Nvidia, at the forefront of the artificial intelligence boom, has now claimed the title of the world’s most valuable company, displacing Microsoft from the top spot.

Nvidia’s market capitalization reached $3.335 trillion on Tuesday, with its stock rising 3.5% to $135.58.

Just days ago, the company based in Santa Clara, California, surpassed Apple to become the second most valuable company globally.

Microsoft and Apple saw their stocks decline by 0.45% and 1.1% respectively, occupying the second and third positions.

The rise in Nvidia’s stock contributed to record highs in the S&P 500 and Nasdaq indices, continuing the company’s streak of success. Its Graphics Processing Units (GPUs) are crucial for AI development.

Driven by high demand for its chips from tech giants like Microsoft, Meta, and Google, Nvidia’s stock has surged nearly 182% this year, following more than tripling in 2023.

Nvidia controls about 80% of the AI chip market, used in data centers running AI models such as OpenAI’s ChatGPT.

Since going public in 1999, Nvidia’s stock price has skyrocketed by 591,078%.

According to the Kobeissi Letter’s capital market newsletter, an investment of $10,000 in 1999 would be worth $59,107,800 in Nvidia stock today.

Founded in 1991, Nvidia initially focused on producing chips for electronic games.

In the 2000s, CEO Jensen Huang led Nvidia to heavily invest in developing GPUs widely applicable beyond gaming, positioning the company for the impending AI boom.

The company’s remarkable ascent has made Jensen Huang one of the world’s wealthiest individuals, with Forbes estimating his net worth exceeds $11.7 billion.

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On June 11, Infineon Technologies AG launched the PSoCTM 4 High Voltage Precision Analog (HVPA)-144K microcontroller, which meets the needs of the automotive battery management industry by integrating high-precision analog and high-voltage subsystems on a single chip. It provides a fully integrated embedded system for monitoring and managing automotive 12 V lead-acid batteries, which is very important for the 12 V power supply of the automotive electrical system. The PSoC™ 4 HVPA-144K microcontroller complies with the ISO26262 standard and can bring compact and safe smart battery sensing and battery management functions to modern cars.

The dual high-resolution analog-to-digital converters (Σ-Δ type analog-to-digital converters) of the PSoCTM 4 HVPA-144K, together with four digital filtering channels, measure key parameters such as voltage, current, and temperature to achieve accurate measurement of battery state of charge (SoC) and state of health (SoH) with an accuracy of up to ±0.1%. The semiconductor device has two programmable gain amplifiers (PGA) with automatic gain control, which enables full autonomous control of the analog front end without software intervention. Compared with traditional Hall sensors, the battery accuracy is higher with shunt current sensors.

The integrated 12 V LDO (withstands 42 V) does not require an external power supply and can directly power the device from a 12 V lead-acid battery. The integrated transceiver can communicate directly with the LIN bus. The product meets ISO26262 ASIL-C functional safety requirements.

The Arm® Cortex®-M0+ MCU on which the PSoCTM 4 HVPA-144K is based operates at up to 48 MHz and has up to 128 KB of code flash, 8 KB of data flash, and 8 KB of SRAM, all with ECC. The PSoCTM HVPA-144K also includes a variety of digital peripherals, such as four timers/counters/PWMs and a serial communication block that can be configured as I2C/SPI/UART.

The PSoCTM 4 HVPA-144K is supported by automotive-grade software. Infineon’s Automotive Peripheral Driver Library (AutoPDL) and Safety Library (SafeTlib) are developed in accordance with standard automotive software development processes and are compliant with A-SPICE, MISRA 2012 AMD1 and CERT C, as well as ISO26262.

With the launch of PSoCTM 4 HVPA-144K, Infineon has laid the foundation for expanding its PSoCTM microcontroller portfolio to include lithium-ion battery management systems for electric vehicles. The portfolio will soon be joined by products for monitoring and managing high-voltage (400 V and above) and low-voltage (12 V/48 V) batteries, further promoting the use of future electric vehicles.

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Qorvo®, a leading global provider of connectivity and power solutions, recently announced the launch of the industry’s best high-gain 5G pre-driver, the QPA9822. The product can achieve a high gain of 39dB at 3.5GHz and a peak power of +29dBm. This new pre-driver for mMIMO base stations demonstrates Qorvo’s firm commitment to promoting the development of 5G technology and further consolidates its leadership in cellular infrastructure.

As a wideband, high-gain, high-linearity driver amplifier, the QPA9822 is designed for 32-node mMIMO systems. It can achieve up to 530MHz of 5G New Radio (NR) instantaneous signal bandwidth, which is very suitable for the N77 band that is critical to 5G deployment and other mMIMO applications.

“Qorvo’s QPA9822 not only provides the best high gain that can be achieved by 5G pre-drivers on the market today, but also creates a scalable solution for 32T and 64T wireless base stations. This helps ensure that 5G mMIMO systems are easily deployed in popular bands around the world.” said Debbie Gibson, product line director of Qorvo’s Wireless Infrastructure Business Unit.

The QPA9822 is internally matched to 50Ω impedance across the entire operating band of 3.3-4.2GHz and integrates a fast enable/disable function through the VEN pin. In addition, it also has external bias control capabilities to optimize linearity and support up to 530MHz of instantaneous bandwidth.

The QPA9822 uses a compact 16-pin, 3mm×3mm SMT package, which is size and pin compatible with the QPA9122M high-gain, high-linearity driver amplifier, and can be easily integrated into existing and new designs, thereby shortening the time to market for customers.

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Arteris, Inc. is a leading system IP provider dedicated to accelerating the creation of systems on chips (SoCs), and Andes Technology (Taiwan Stock Exchange: 6533) is a founding and principal member of the RISC-V International organization. Also a leading provider of high-performance/low-power RISC-V processor IP, today announced a partnership to advance RISC-V-based processors for artificial intelligence, 5G, networking, mobile, storage, AIoT and space applications. Innovation in SoC design.

The Andes QiLai RISC-V platform is a development board powered by the QiLai SoC, which is based on Andes’ RISC-V processor IP and Arteris FlexNoC interconnect IP for on-chip connectivity. The QiLai SoC integrates Andes 64-bit AX45MP multi-core processor (quad-core cluster) running at 2.2 GHz and NX27V vector processor running at 1.5 GHz, and uses Arteris Network-on-Chip (NoC) interconnect IP, which The IP features PCIe, DDR, SRAM and general IO subsystems using the AMBA AXI protocol. Supported software includes the OpenSUSE Linux distribution, AndeSight™ toolchain, AndeSoft™ software stack, and AndesAIRE™ NN SDK for converting AI/ML models into executable files.

Dr. Charlie Su, President and Chief Technology Officer of Andes Technology, said: “Despite the widespread use of AndesCore™ AX45MP and NX27V processors, we are pleased to see QiLai SoC’s first success on a new project. Arteris NoC IP is a flexible, The best choice for high-performance, top-level connectivity. The QiLai platform enhances rapid development and evaluation of RISC-V software and accelerates the expansion of the RISC-V ecosystem.”

Michal Siwinski, Chief Marketing Officer of Arteris, said: “We are excited to partner with Andes and support the interoperability of the QiLai platform to further accelerate the mainstream adoption of RISC-V technology. Our collaboration supports our goal to be a catalyst for SoC innovation. mission so that our mutual customers can focus on effectively creating the breakthroughs of the future.”

Arteris’ FlexNoC non-coherent NoC IP and Ncore cache-coherent NoC IP enable scalable, low-latency and energy-efficient on-chip communications to achieve superior performance in complex SoC designs. The technology facilitates the integration of high-performance, low-power CPU IP, enhancing system functionality and interoperability, especially within the growing RISC-V ecosystem. This configurable and adaptable interconnect solution connects seamlessly with a variety of components to reduce risk and accelerate time to market. System designers can leverage Arteris NoC IP to enhance the reliability and quality of next-generation SoCs by connecting well-tested CPU IP blocks.

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The semiconductor industry is characterized by relentless innovation, stringent quality standards, cost efficiency, and rapid market delivery. However, it also faces numerous challenges, including increasing design complexity, shrinking feature sizes, rising defect rates, and a growing demand for new materials and products. Now, artificial intelligence (AI) plays a crucial role in overcoming these obstacles and enhancing engineers’ productivity in chip manufacturing.

AI significantly reduces chip manufacturing costs by optimizing various aspects of the production process. Generative AI employs advanced reinforcement learning techniques, such as Deep Q Networks (DQN) and Monte Carlo Tree Search (MCTS), to optimize costs. These technologies predict the most promising outcomes by improving decision-making processes and evaluating placement options. This fine-tuning greatly reduces the time and resources engineers need for each chip design and manufacturing process, significantly lowering production costs while ensuring adherence to strict quality standards.

Streamlined Manufacturing Processes
Generative AI simplifies semiconductor manufacturing processes, particularly in supplier network optimization. It formulates multi-source strategies by sifting through extensive documentation and facilitates procurement from diverse suppliers based on criteria such as demand, availability, and proximity. AI-driven robots excel in negotiating costs, distilling vast amounts of data into coherent insights, and navigating complex performance metrics and supplier communications. This optimization ensures smooth supply chain operations, enhancing overall manufacturing efficiency.

Improved Wafer Fabrication
Wafer fabrication is a crucial step in semiconductor manufacturing, transforming non-conductive silicon wafers into substrates filled with integrated circuits. This process involves stages such as oxidation, photolithography, etching, and doping, each potentially impacting chip integrity. Generative AI, combined with advanced imaging technologies, significantly enhances defect detection rates by identifying anomalies that traditional methods might miss. This improvement mirrors the transformative impact of AI in other industries, such as logistics, where AI optimizes picking routes, delivery frameworks, and cost structures.

Achieving Sustainability with AI
Reducing Carbon Emissions
Generative AI plays a vital role in reducing CO2 emissions in the semiconductor industry. It optimizes energy usage and predicts demand to prevent overconsumption. AI-driven energy-efficient chip designs and streamlined supply chains further reduce environmental impact. Additionally, generative AI advances carbon capture technologies, decreasing atmospheric CO2 levels and promoting a green and sustainable future for semiconductor manufacturing.

The Present and Future of Chip Manufacturing
Many countries are heavily investing in new semiconductor manufacturing units to meet high chip demand. For instance, the US government proposed the CHIPS and Science Act of 2022, investing $52.7 billion in semiconductor manufacturing and research as part of a broader infrastructure plan. Over the next five years, approximately $1 trillion will be invested globally in expanding the industry, underscoring the urgency of the situation.

Traditional approaches to supply chain resilience are increasingly inadequate. AI-driven tools are set to become indispensable in chip design, potentially boosting engineer productivity, addressing the rising costs of designing complex chips at cutting-edge nodes, and bridging the engineering talent gap.

Conclusion
Integrating generative AI into the semiconductor industry promises unprecedented efficiency, innovation, and sustainability. As we tackle challenges and harness AI’s potential, we stand at a pivotal moment in redefining the semiconductor landscape, setting new benchmarks for quality, speed, and environmental responsibility.

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Vishay Intertechnology, Inc. (NYSE: VSH), based in Malvern, Pennsylvania, USA, and Shanghai, China, announced the launch of a new series of low-profile, aerospace-grade planar transformers for power conversion – the SGTPL-2516 series. Compared to traditional planar transformers, the customizable Vishay Custom Magnetics SGTPL-2516 series transformers offer lower cost, smaller size, and higher power density, providing significant advantages and meeting MIL-STD-981 Class S requirements.

Featuring through-hole terminals and various package sizes, these transformers find wide applications in switch-mode power supplies as well as DC/DC and AC/DC converters. Designed for harsh environments, they feature robust encapsulation with molded windings, operate at temperatures up to 130°C, and are certified according to MIL-STD-981. The SGTPL-2516 series transformers operate at frequencies ranging from 80 kHz to 300 kHz, with a high dielectric withstand voltage of 1500 VAC, power rating of 150 W, and leakage inductance of 0.5 H.

With a unique winding structure and manufacturing process, these transformers achieve a higher copper fill factor than traditional planar transformers, resulting in improvements in package size, efficiency, and power density. The winding technology of the SGTPL-2516 series enables adjustment of operating voltage, inductance, power, package size, and height according to specific design requirements, without incurring upfront tooling costs. In addition to MIL-STD-981 Class S Group A and B screening, these devices also offer Class P screening for design verification testing and other customized screening options.

Samples of these new transformers are now available, and they are in full production. The lead time for Class P screening devices is 8 weeks, while for Class S screening devices, it is 21 weeks.

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According to reports, in order to maintain America’s leading position in semiconductors, the United States needs robust trade policies to complement domestic efforts to accelerate development. This was the main message of public comments submitted by the SIA on April 22 in response to the U.S. Trade Representative’s request for information on how trade policies can enhance U.S. supply chain resilience.

President Biden signed into law the bipartisan Chips and Science Act in 2022 to incentivize the growth of the U.S. semiconductor ecosystem, strengthen its supply chain, and ensure the U.S. semiconductor industry remains globally competitive. Ultimately, this is a bold plan aimed at bringing more chip manufacturing back to the United States.

This historic move has already yielded significant results. Since the passage of the CHIPS Act, companies across the semiconductor ecosystem have announced over 80 new projects in the United States, with private investment now approaching $5 trillion. However, to ensure the long-term competitiveness of U.S. semiconductor companies and make the Chips Act more effective, a larger global market is needed to allow SIA members to sell chips domestically that they manufacture domestically.

In fact, 75% of the revenue for U.S.-headquartered semiconductor companies comes from sales to foreign markets. Unfortunately, despite U.S. government efforts to foster greater economic supply chain integration and resilience through the Indo-Pacific Economic Framework (IPEF) and the Americas Prosperity Partnership (APEP), U.S. chip exports declined by 14% last year.

SIA strongly recommends that the Office of the U.S. Trade Representative effectively utilize trade policies and pursue market-opening initiatives to stimulate global demand for U.S. semiconductors (as well as other goods manufactured domestically). Similarly, SIA encourages the U.S. Trade Representative to advocate for U.S. companies to re-engage in countering market access barriers and regulations imposed by other governments, which unfairly skew the competitive environment and disadvantage the U.S. semiconductor industry.

When navigating the twists and turns of global trade and technology, it’s evident that the future of the U.S. semiconductor industry depends not only on domestic investment but also on prudent strategic international partnerships and wise trade policies aimed at opening new markets for American chips.

SIA expresses its anticipation to continue collaborating with the U.S. government and other stakeholders, advocating for new ideas to pave the way for a more resilient, competitive, and sustainable U.S. semiconductor industry, driving future astonishing innovations.

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With the assistance of NVIDIA’s artificial intelligence and high-performance computing infrastructure, Japan is making rapid strides in the fields of quantum and artificial intelligence computing. According to Nikkei Asia, the National Institute of Advanced Industrial Science and Technology (AIST) of Japan is constructing a quantum supercomputer with the aim of achieving remarkable achievements in this specialized domain.

Dubbed as ABCI-Q, this new project will be powered entirely by NVIDIA’s accelerated and quantum computing platforms, indicating that the system will achieve both high performance and efficiency. This Japanese supercomputer will also be built in collaboration with Fujitsu.

NVIDIA, in an earlier blog post, mentioned plans to integrate its NVIDIA CUDA-Q platform into the system. This platform, an open-source resource, allows users to harness quantum classical applications. CUDA-Q will serve as a component of the supercomputer, seamlessly integrating with relevant CPUs and GPUs. Additionally, Team Green plans to install 2000 NVIDIA H100 artificial intelligence GPUs and utilize the latest NVIDIA Quantum-2 InfiniBand interconnect technology.

Tim Costa, Director of High-Performance Computing and Quantum Computing at NVIDIA, stated that researchers require high-performance simulation to tackle the most challenging issues in quantum computing. CUDA-Q and NVIDIA H100 can assist pioneers like ABCI in making crucial advancements, accelerating the development of integrated quantum supercomputing.

Japan’s ABCI-Q supercomputer is part of the country’s technological innovation phase, aiming to lead in mainstream consumer industries by leveraging advantages of contemporary technologies such as quantum computing and artificial intelligence.

Several months ago, NVIDIA CEO Jensen Huang met with Japanese Prime Minister Fumio Kishida, discussing strengthening collaboration across multiple domains to provide stable supplies of artificial intelligence equipment for Japan’s needs. The release of ABCI-Q marks just the initial step in establishing extensive cooperation between Japan and NVIDIA.

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U.S. Commerce Secretary Gina M. Raimondo said on Sunday that the chips powering Huawei’s Mate 60 Pro phone, from the sanctioned Chinese company, are not as advanced as American chips. This indicates that the U.S. policy of export restrictions on telecom equipment giants is effective.

Huawei has been on a trade restrictions list since 2019, and last August released a new phone powered by sophisticated chips, surprising both the industry and the U.S. government. The Huawei Mate 60 Pro is seen as a symbol of China’s technological resurgence, despite Washington’s efforts to weaken its ability to produce advanced semiconductors.

Many saw this as a slight to Raimondo during her visit to China. But in an interview with CBS News’ “60 Minutes,” Raimondo pushed back on this notion.

“It tells me that export controls are working because that chip is nowhere near what we have in the United States,… It’s years behind the advanced chips we have in the United States,” she said. “We have the most sophisticated semiconductors in the world. China does not.”

For years, Washington has been trying to deprive Beijing of advanced semiconductor chips and the tools needed to manufacture them, fearing they would be used to bolster China’s military capabilities.

Huawei, symbolizing this tech war, was added to the so-called Entity List in 2019, triggering concerns among U.S. suppliers seeking difficult licenses to export to it.

But its suppliers, including Intel, have been granted licenses worth billions of dollars to continue selling to the company. Huawei announced this month its first AI-powered laptop driven by Intel chips, sparking anger from hardliners in the Republican party.

When asked if she’s being tough enough on big corporations, Raimondo is resolute.

“I will hold companies accountable just the same,” she told Leslie Stahl in the “60 Minutes” interview. “They don’t like it when I tell them they can’t sell their semiconductor to China, but I will,” she added.

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While the concept of humanoid robots is gaining popularity around the world and major technology giants are entering the market, industry leader Boston Dynamics has announced that it will stop developing the humanoid robot Atlas. After the news was released, it aroused great concern among industry insiders.

On Tuesday local time, Boston Dynamics released a video on YouTube. What is different from the past is that this video is not to show Atlas’s shocking athletic capabilities and latest progress, but to review and say goodbye.

Boston Dynamics said: “For nearly a decade, Atlas has captured our imaginations, inspired the next generation of robotics experts, and transcended many technological barriers in the field. Now it’s time to take a break and take a look back at Atlas, our hydraulic robot. All the work we’ve done so far on the Atlas platform.”

The origins of Atlas date back to 2009, when Boston Dynamics signed a $26 million contract with the U.S. military to produce a bipedal robot originally called PETMAN.

Later, Atlas achieved a series of incredible achievements, starting from walking like a normal person and then walking on rough ground.

Next, he demonstrated his ability to run, dance, carry goods, do backflips, etc. He was also able to maintain balance even when being hit by a stick.

The U.S. Defense Advanced Research Projects Agency (DARPA) noted: “Atlas is one of the most advanced humanoid robots ever built, but it is essentially a physical shell for the software brain and nerves the team developed.”

After entering 2024, the humanoid robot industry will continue to develop. Tesla has released several performance update and iteration videos of its humanoid robot Optimus, and star startup Figure has released its first robot demo powered by a large OpenAI model. Meanwhile, multiple teams at Apple are working on advancing personal robotics, an area that has the potential to become one of Apple’s ever-changing “next big things.”

Therefore, it is confusing at this moment that Boston Dynamics has announced that it will stop developing Atlas. Some analysts speculate that Atlas’s retirement is not so much an end as a new beginning, with Boston Dynamics preparing to develop more advanced robots.

Boston Dynamics has been working on commercializing Atlas technology for years, a trend that has been further accelerated after Hyundai acquired the company in 2021, but the complex hydraulic robots are not consumer friendly.

Atlas has made many advancements over the past decade. However, while many of the system’s advancements in locomotion are still impressive, some aspects, such as the hydraulic system, are outdated compared to contemporary robot standards. Now, Boston Dynamics’ latest decision marks the end of a robotics path.

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