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Intel will not give up the mobile phone market to strengthen LTE layout

Intel senior vice president Gregory Bryant said that although the current PC market downturn, but the 2-in-1 device products there are quite significant growth, so it is expected to become the sixth-generation Core i series processor development opportunities, is expected to be smaller, Lower power usage characteristics make 2-in-1 device can have a more significant efficacy performance.

As for Intel in the mobile product development section, Gregory Bryant did not respond to the next whether they will take Core m-series processors for such products, but stressed that the same will cooperate Windows 10 Mobile operating system platform with Microsoft, thereby extending more dollars for Windows 10 experience.

For the recent development by the smart handheld device speed, Windows 10 failed to significantly boost consumption market to replace the new machines, and OEM manufacturers expect clearing its old processor equipped products, etc. affected, resulting in the development of the PC market downturn phenomenon, Gregory Bryant said there really become quite a challenge, but also found that 2-in-1 device products still retain a very high market growth rate, it is expected to become the sixth-generation Core i series processor development opportunities, particularly in the family of processors in accordance with the Core m Effectiveness distinguish between different versions of the consumer market will have more choices.

In addition, with the use of the volume occupied by smaller, lower power consumption while the sixth-generation Core i series processors, Intel believes will allow 2in1 equipment for high performance and provide longer battery life, and then may stimulate more consumer market momentum.

And because the process is further reduced to 14nm, the same architecture using Skylake Xeon processors, has finally entered the notebook form a smooth product, to create higher computing performance workstation action. Release not locked even in the Core i7-6700K, Core i5-6600K desktop machine after Edition Processor, Intel also announced the same products in the notebook is not locked in the mobile processor, whereby gamers, overclockers also You can limit the effectiveness of the performance of the laptop through the challenges.

From Intel stage development, will further allow a wider range of processors corresponding to the application level, whereby the layout of the development in more markets, while strengthening existing markets by connecting more profitable growth opportunities.

We will not give up the mobile phone, mobile market

And part of the development for mobile devices, Gregory Bryant did not respond to whether Intel is considering Core m series processors used in Phablet aircraft, stressed that the current 10-inch below the small size of mobile devices will still be in Atom processor-based, while Core m Series processors are designed for 2-in-1 device, but did not make clear the actual division segment, and therefore on the table machines, notebook product is still possible to use Atom processors, and 2-in-1 devices into Core i series processors.

Additionally, as Intel in the desktop machine, laptop product continued cooperation with Microsoft, so that the new processor is fully compatible with Windows 10 application integration services, is also working closely with Microsoft on Windows 10 Mobile operating system section, thereby allowing the user to further extend Windows 10 experience.

In the public announcement of this year, Intel has made clear that will integrate LTE communication function Atom processor Microsoft Windows 10 Mobile entered the market, but did not see the practical application of a temporary stage products in the market.

As part of the LTE technology development, Gregory Bryant admits indeed represents Qualcomm and other chip makers in the field layout in this regard for a long time, but recently there are many partners in notebook products into its LTE data chip, but does not mean Intel will not give up development This market will still continue to catch up with competitors in the market, and seek to excel.

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The second quarter of the global silicon wafer area shipments showed a rising trend

(SEMI) of the global semiconductor industry association Silicon Manufacturers Group (SMG) latest quarterly analysis shows that the second quarter of 2015 compared to the global silicon wafer area shipments in the first quarter showed a rising trend.

The first quarter of 2015, total global silicon wafer area shipments have reached 2,637 one million square inches (million square inches, MSI) of the new record again in the second quarter increased by 2.5% to $ 2,702 one million square inches. Compared to the previous quarter, total area shipments in the second quarter 2014 also upgrade 4.4% in 2015 first half compared with the same period the total area shipments increased 7.8% in the previous year (see table).

Caoshi Wong, president of SEMI Taiwan expressed: “SMG survey found that silicon wafer shipments for two consecutive quarters showing growth trend in shipments in the first quarter of this year after a new high, with shipments in the second quarter once again a record..”

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On the other hand, Taiwan’s semiconductor industry continued to increase market share in the past five years, not only has improved in foundries and packaging and testing market share, while in the global semiconductor market in the field of advanced technology industries also see growth.

Moreover, Taiwan’s semiconductor manufacturers continue to invest in cutting-edge technology, but also for development and pave the way for the subsequent years. Buildings and facilities play a vital role in high-tech manufacturing, not only directly affect the process yield and production costs, but there must be an essential prerequisite before the high-tech manufacturing.

Paper-thin solar panels supply energy for the whole building

Recently, a team of scientists in Australia has developed an organic printable solar panels, although as Bohou only paper, but its power supply capacity is not bad, even laminated panels provide energy to an entire skyscraper buildings ʱ??

The advantages of this cardboard is that of the solar cell, which can house the actual position of the roof, the glass directly print out 3D printing, saving a lot of tedious aspects of manufacturing panels. Currently, researchers have succeeded in reducing the board each of the organic solar cell to the volume is only the size of a coin, so that solar panels are not only used in home construction and other fields, compact size also allowed for iPad , portable computers and other mobile devices to provide power.

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Regarding manufacturing technology, the research team improved a 3d printer that can be used to manufacture solar cells solar ink cardboard, compared to traditional silicon solar panels, the solar cell is not only the volume of cardboard thin, and production costs Very inexpensive, using methods as simple as connecting the battery.

Cardboard solar project leader, the technology will reduce dependence on traditional energy sources in some developed countries, while providing a cost-efficient small power sources in remote areas of developing countries outside the grid. The technology research team said it would promote this solar paperboard market within the next few years.

2015 global television turnover will decline by 3%

According to Futuresource Consulting published report said the global TV market, despite the overall TV sales fell 2%, but in 2015 4K TV shipments are expected to grow by 147%.

2014 global TV sales increased 3% to 235 million units, its turnover up to $ 94 billion. TV market situation in the world still showing diversity, and in Latin America and other regions are to achieve significant growth, thanks to the region’s World Cup in Brazil (Brazilian World Cup) and enable the analog switch, we will continue to develop after the forecast period. Europe also achieved growth of 3%. Despite the decline in the Asia-Pacific region in 2014, but it remained the largest television market demand, accounting for 37% of shipments. Since many countries in the region is relatively low saturation level, Futuresource expected to grow again in the next few years.

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The report is expected by 2015, global trade volume will decline by 3 percent to $ 91 billion. Most of the drop in sales due to the continued weakness in the Chinese market, as well as economic problems in Russia. Economic instability continues to affect many European markets, which will boost the number of African countries is expected to decline.

However, according to Futuresource it said that this situation will not continue decline, because of the greater popularity of television screens and 4K models faster than originally anticipated. In view of the industry is not yet clear curved screens occasion, they expect 2015 will achieve significant growth, and the development of 4K market will drive their performance. At the same time, although not up to speed before the expected, but the smart TV market share has continued to expand.

Futuresource Consulting, senior market analyst at Jack Wetherill comment, said: “Although we expect 2015 global shipments will decline, but it is expected Futuresource TV market will achieve a good recovery in the long term in the next few years, Futuresource think replacement. demand will increase, and the purchase of television to be upgraded to flat-screen TV as a start. In addition, consumer preferences shift to larger screen will help the performance of 4K TV. ”

The global TV market is expected to report will provide the latest global consumer TV market, and assess the major developments in the market until the second quarter of 2015. The report also provides up to expectations in 2019, and outlines the major regions and countries, and competition based on product characteristics and assess the significant development.

The advent of the world’s smallest transistor: molecular size only

On the road to save Moore’s Law, everybody seems to have mustering the strength. Not long ago, IBM announced the development of a successful 7nm chips, and now, there are research and development team claims successful preparation smallest transistors ever – only the size of a single molecule.

To achieve this amazing achievement from a German, Japan and the US joint research team, they used 12 of indium atoms around a positively charged molecule on the phthalocyanine indium arsenide crystal substrate, and then got a transistor .

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As early as 2012, IBM has stated that the success of a single bit of information will be integrated into the structure of 12 atoms, and successful preparation of this transistor is a huge leap forward in this basis. The transistor diameter of just 167 picometers (10-12 meters), the smallest circuit than the previous 42 times smaller.

Based on this achievement researchers unexpectedly found that the phthalocyanine molecule orientation will be its impact on the charge, and by limiting the movement of electron flow indium atomic scanning tunneling electron microscope, the indium atoms confined precisely within a specific grid .

But this research is still in its early stages, practical use in the distant future, but this research has paved the way for large-scale quantum computing, but the specific situation to be further verified.

2D phospholene is expected to surpass the graphene and silicon material

International Technology Roadmap for Semiconductors (ITRS) sustained action to find alternative materials silicon global attention, the industry is hoping to find a way to achieve ultra-fast 2D perfectly conducting material. Graphene and its derivative versions of carbon nanotubes (CNT) has been the most popular technology is promising, but the black phosphorus application in photonics has demonstrated superior properties of graphene.

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Recently, McGill University (McGill University) and the University of Montreal, Canada (Universite de Montreal), researchers have claimed, 2D monolayer black phosphorus – phosphorus-ene (phosphorene), able to demonstrate superior pure graphene and silicon circuit electronic properties.

2D conductive material advantage lies in its ability to achieve speeds approaching superconductivity at room temperature, plus is ideally suited for extending ITRS development blueprint – the future will require the continuation of Moore’s single-atom level (Moore “s Law) progress Unfortunately, Any single material atoms are very fragile and must be found and are 2D can be deposited in the form of a multi-layer of conductive material.

“Our research shows can induce electron movement in the form of a plurality of 2D black phosphorus atom layer,” Professor Thomas Szkopek McGill University, explained, “on the grounds purely scientific point of view, we still do not know how electrons move in the limited 2D details; in technical terms, this is because the electronic components in the electronic limited to 2D functions better when the show. ”

At room temperature, alkylene phosphorus electron mobility has been measured up to silicon (2700cm2 ?? / Vs) 2 times, and in cooling (3900cm2 / Vs) nearly three times as high as expected for compatibility with the substrate electrode After the optimization, but also to achieve a higher electron mobility. The disadvantage is that black phosphorus monolayer has behaved not stable enough, unless it can be isolated from normal atmospheric environment protection among. However, researchers at McGill University, thought it is not considered too serious problem, because they have been found to even penetrate multiple layers of conductive material 2D electrons move in black phosphorus.

“We all know that the stability of black phosphorus deficiency, unless isolated from the environment of preventive and protective measures. Furthermore, the black phosphorus single thinner, more unstable.” Szkopek said, “but according to our observations, is not We need to see the motion of electrons in the 2D black phosphorus single atomic layer, which is of great significance for the future of the black substance phosphorus components development.

To prove this point, researchers will create dark phosphorus into the quantum well field effect transistor (FET) bare grain, it can easily be turned to value and set off a current of more than 100,000. Even if the material is manufactured using a multi-layer, the researchers were also able to show the use of magneto-2D carrier transmission measurements. In addition, the researchers also predict that phospholene FET can work at very low voltage, low power operation.

Future researchers will be the best phospholene best dielectric layers and experiments, hoping to create a phospholene FET and the best metal contacts. In addition to optimization, the researchers plan to study methods and how the large-scale manufacture of such materials in the fab.

McGill University professor Guillaume Gervais, Professor, University of Montreal, Richard Martel also participated in the study. The study of magnetic field experiments in Florida National High Magnetic Field Laboratory carried out; the laboratory by the National Science Foundation (NSF), Florida and the US Department of Energy (DoE) co-sponsored support.

MEMS sensor electronics industry need to promote innovation and the development of things

Electronics industry urgently needs a new micro-electromechanical systems (MEMS) sensor and to drive things (IoT) development. According to industry analysts said that if the expected use of things driving the growth of the next round of the electronics industry, in large part have to rely on MEMS and sensor technology in order to make all the smart objects interact with the real world. But to achieve new MEMS design to production, it may take a very long time and the high cost in order to meet the market’s expectations of things – unless the electronics industry can find their way to accelerate the development of MEMS.

New applications using existing MEMS components are 12% annual growth rate driven market progress MEMS. However, Jean-Christophe Eloy Yole Dveloppement executive and president, said, unless the industry can find how to successfully convert the mechanical element silicon approach, or to speed up the degree of difficulty with the revolutionary new production might slow down future MEMS market growth .

MEMS completely absent innovative products for over a decade

Through the application of more sophisticated and more widespread adoption of MEMS components, is expected to make this smaller size, higher performance and more cost-progressive element of innovation, continue to stimulate the sensor and the implemented system towards strong growing up. Last year in the field of MEMS to achieve the most rapid growth be Avago (Avago Technologies) and Qorvo (formerly Triquint), this is because of the wide spread of bulk acoustic LTE multi-mode handsets to be used (BAW) filters pose a very big demand. Similarly, strong demand for more applications MEMS microphone and inertial sensors for help drive more sensors suppliers into 2-3 million in annual revenue range ranks.

“It’s really important, because there are a number of companies have the potential to develop into a $ 1 billion company,” Eloy said.

However, only new applications using existing components to maintain double-digit growth of the type of $ 11 billion business, in time may not be long. “One challenge is completely innovative product recently or 2003 Knowles (Knowles) developed MEMS microphone.” Eloy said, “Since then, all but the degree of integration, better packaging, etc. bring progressive Innovation While these are very important innovation, but not a breakthrough new products. We are still waiting MEMS switches, speakers and other products autofocus and full transition to mass production stage. ”

The semiconductor industry has found ways to expand cooperation in the field of pre-competitive research, and have a well-developed commercial infrastructure to support continued growth, he said. “MEMS industry needs some changes occur, in order to simplify and speed up the design process, and put into production as soon as possible.”

2014 global revenues of $ 11.1 billion MEMS

According to Yole’s data show that in 2014 global revenues of $ 11.1 billion MEMS. (Source: Yole Developpement)

“As everywhere need sensors to achieve things, situational awareness, especially for the emerging demand for new biochemical and biomedical sensors, I think the development of MEMS industry really only just begun,” President of the Silicon Valley investment industry Band of Angels SIG Board Kurt Petersen expressed. “Prices will continue to decline, but the development of a new type of sensing mechanism will significantly improve the accuracy,” for the development of a piezoelectric microphone, ultrasonic gesture recognition as well as new technology brings tremendous inertia potential impact – a higher 10 significantly improved the accuracy of fold navigation information.

Peterson believes truly useful wearable device has not yet been developed, but expressed optimism about its future development. The most promising are now being developed in a new class of biological sensors, such as startups Profusa implantable glucose sensor, an external optical device to read, which uses an adjustable sensor platform, in the human body detection chemical drugs.

In addition to better biochemical and biomedical sensors, energy harvesting is another opportunity. “Energy harvester will become increasingly important, because things will provide a huge market,” he said.

MEMS promote the growth of new platforms

In order to claim the fastest time to market and cost-listed, these new elements into volume production of MEMS, semiconductor industry to promote the development of new methods.

“When we turn to the past customers usually require their own unique process, but now there are more and more customers asked us to use standard platforms as possible, with only minor modifications to,” Teledyne Dalsa company’s executive vice president of MEMS foundries Claude Jean and general manager. “A product manufacturing process uses a traditional approach has not been completely eliminated, but more and more customers tend to use mature platform to develop products,” he adds.

Dalsa company is inertial sensors, micro-bolometer, optical MEMS and piezoelectric elements provide a wider range of different platforms, and extend as far as possible their own design and testing support services.

The new platform technology from R & D laboratories. Electronics and Informatics Department of the French Atomic Energy Technology Laboratory (CEA-Leti) aims to cooperate with the foundry, which was put into production piezoresistive MEMS platform to provide to more customers. This technique of moving the material using the “10? m thick layer, and the “500nm thin layer to the edge of the piezoresistive element, then change the resistance through compression or tension to detect its movement.

“The technology is tightly integrated multiple sensor provides alternative methods, or CMOS imaging systems can help manufacturers, and the lack of its own technology in the new company to develop products quickly.” CEA-Leti strategic partners in North America Vice Hughes Metras president and stated, CEA-Leti has been made with the authorization of the industry’s first Tronics quickly its six degrees of freedom inertial sensor market a.

Today, these basic technologies mature also means MEMS market began to seek advantage from a number of cooperation based on mutual interest, in particular with regard to some of the equipment requirements or testing operations. Currently in measuring performance inertial sensors have not been widely accepted standards, does not define the means of future demand for device manufacturers like ITRS roadmap, Teledyne Dalsa’s Jean said.

“At present there is a huge gap between the cost of the MEMS market requirements and available advanced CMOS devices.” He believes that “However, compared to the development of advanced CMOS process, it also requires simpler and more cost-effective TSV manufacturing process and other technical support. ”

Teledyne Dalsa is working with Alchimer wet after the development of low-cost copper processing drilling (Via-Last) MEMS TSV approach. Teledyne DALSA’s Via-Last technology uses copper drilling, and using low-temperature electrochemical process Alchimer formed x100 microns deep perfect perforations filled with five microns in diameter, and the use of copper redistribution layer and Ni / Au UBM is connected to the outside. However, the process is currently available only 200mm wafers, therefore, “we need to start closer cooperation between the MEMS manufacturers and equipment and materials suppliers to develop more cost-effective way to promote innovation progress.” He said.

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3M spent $ 2.5 billion acquisition of British personal security equipment manufacturers

3M Company announced that it has agreed to buy British personal safety equipment manufacturer Capital Safety Equipment Inc. from private equity giant KKR Group, the transaction price totaled $ 2.5 billion (about 15.521 billion yuan). The largest in the history of 113 years and this is an acquisition transaction 3M Company.

It is reported that the company’s acquisition of 3M UK’s Capital Safety equipment also includes the Capitol of $ 700 million (about 4.346 billion yuan) in debt. 3M side said it expects the transaction will be completed in the third quarter of this year, the first year after completion will lead to its earnings per share by 4 cents, but excluding one-time expenses will increase earnings per share of 12 cents.

In 2011, the Capitol was KKR in $ 1.1 billion (about 6.829 billion yuan) acquisition. In the fiscal year ended March 31 of years, Capitol revenues of $ 430 million (about 2.67 billion yuan).

3M Company Name MinnesotaMiningandManufacturing (Minnesota Mining and Manufacturing Company), founded in 1902, is the world’s leading diversified technology companies, known for innovation, product range known to the world, producing thousands of innovative products, medical products, highway safety, office culture and education products, optical products occupy a leading position in its core markets. At the same time, 3M Company is the United States track – one of the industrial component of index constituents 30 kinds Jones, in 2013 global sales of $ 30.8 billion, of which overseas sales of $ 19.7 billion (64% of the total).

Transmission speed laser LiFi University of Edinburgh super 100G / sec

Are you still as Wi-Fi signal and the signal is weak uneven regional distribution annoyed it? Li-Fi could be the answer. This technology uses LED-based interior lighting instead of radio waves for data transmission. But Li-Fi has been a major supporter of the vision over in LED, with laser-based lighting to achieve Li-Fi, data transmission rate or an increase of 10 times.

Li-Fi data by adjusting the LED light output is encoded. The human eye can not perceive flicker rapidly, but the receiver or mobile device on a desktop computer can read the signals can even signal the return signal transceiver room ceiling, providing two-way communication. But many of the blue LED light into white light with a phosphor coating, which also limits the data transfer rate.

The study, published in Optics Express (Optics Express), Haas and his team research shows that replacing the existing LED lamp with a laser diode can significantly improve the current situation. High energy efficiency and light, lasers transmit data rate can be 10 times faster than the LED. Do not use phosphors, laser illumination can be mixed to produce white light of different wavelengths of light. This means that each wavelength of light can be used as a separate data channel, the same waves can be two-way transmission, can greatly improve the speed of light to transmit data, the University of Edinburgh team test the nine laser diodes.

Although Li-Fi-based LED can reach 10 Gb / s data transfer rate, the upper limit of the data transfer rate can be improved Wi-fi7 Gb / s for. Laser transmission data rate can easily exceed the 100 Gb / s.

At present, this device is still very expensive, large-scale production of Edinburgh University is seeking to reduce its costs, and can apply it to the lighting market. BMW i8 headlights is based on the laser light.

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Wireless MCU platform from Texas Instruments for battery-free IoT connection

The extremely low power Simple Link wireless platform from TI is suitable for Bluetooth Smart, 6LoWPAN, ZigBee, Sub-1 GHz ZigBee RF4CE and.

Customers would be able to do without either by energy harvesting entirely on batteries or comment in the always-on operation for several years with a single button cell. “This technique is a first in the industry and gives customers flexible development opportunities for products that support a single chip and identical RF design more radio access standards,” said Oyvind Birkenes, General Manager, Wireless Connectivity Solutions at TI.

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The Simple Link Ultra-low-power platform supports Bluetooth Low Energy, ZigBee, 6LoWPAN, Sub-1 GHz ZigBee RF4CE and proprietary implementations as well as with data rates up to 5 Mbit / s. With an ARM Cortex-M3-based MCU, Flash / RAM, A / D converter, peripheral, a sensor controller, and robust security it offers a high degree of integration.

Figure 1: The wireless microcontroller from TI CC2650 supports Mehere 2.4 GHz technology Figure 2: Block diagram of the Simple Link Ultra-Low-Power Wireless MCU platform Figure 3: CC2650 DK – 2.4 GHz hardware, software and RF development platform Smart Bluetooth, ZigBee and 6LoWPAN

Start Photo Gallery: Click on an image (3 images)
The simple design of this platform is the result of immediately deployable protocol stacks, operating system, TI RTOS, the integrated development environment (IDE) Code Composer Studio, the tools, online training and support from the E2E Community, so Birkenes. The available reference designs facilitate the development and layout, so that a minimum amount of HF sufficient expertise. About the TI IoT Cloud Ecosystem TI also facilitates its customers to the cloud connection.

The first products of the Simple Link Ultra-Low-Power Wireless MCU platform of CC2640 Bluetooth Smart and CC2630 for 6LoWPAN and ZigBee. For more flexibility, the wireless MCU CC2650 can be used, which supports multiple 2.4-GHz technologies, including Bluetooth Smart, 6LoWPAN, ZigBee RF4CE and. Additional products will follow later this year, the CC1310 sub-1 GHz for the operation and the CC2620 ZigBee RF4CE.

Trimmed for low power

The ultra-low-power platform is designed for low power consumption. A dedicated onboard sensor controller speaks the external sensors to autonomously, while the rest of the block is in Sleep mode. Characteristic of the platform are less than 6.2 mA draw maximum current consumption with active radio operation and under 61 uA / MHz lying power consumption of the MCU in the active state.

The entire chip can be placed in a standby status, with only 1.1 uA current consumption for retention of memory and running real-time clock (RTC). Birkenes: “The platform comes with it to half the power of other MCUs, such as the value of 143.6 of the EEMBC benchmarks shows ULPBench A blog post includes information about how the battery-free operation can be realized..”