Beijing August 15, according to “Japan Times” online edition reported that Hon Hai Precision to reverse the sharp decline in efforts gathered pace on Saturday. Sharp has been officially appointed vice chairman of Hon Hai Wu Dai positive for the company’s president and CEO.

The adjustments at the company after the completion of the acquisition of Sharp day, the transaction is the first major Japanese electronics companies acquired by foreign companies. Hon Hai Sharp hope to achieve revival under new leadership, so Takahashi Xing three Sharp, former president (KozoTakahashi) last Friday to leave.

Hon Hai Wu Dai positive number two man, was the first leader since the company was founded Sharp selected from outside.

Hon Hai to invest 388.8 billion yen Sharp, currently has a 66 percent voting stake in Sharp, Sharp’s largest shareholder.

Sharp plans to accelerate the development and mass production of electroluminescent light emitting display panel, which is expected to attract a high market demand. However, industry analysts believe that, since this area behind South Korean rivals, Sharp also need to further promote the use of energy-saving high-resolution exclusive IGZO (indium gallium zinc oxide) LCD panel technology.

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According to Associated Press reporter Li Yuqiong Korea (Youkyung Lee) reported that due to the South Korean government and Samsung Electronics omission resulting Samsung Semiconductor and LCD plant more than 200 employees contracted serious illness, in which at least 76 people were killed.

The report said, according to workers’ safety organization Banolim records show that more than 200 former employees of Samsung semiconductor and LCD factories suffering from serious diseases, including leukemia, lupus, lymphoma and multiple sclerosis. These employees are mostly 20 to 30 years, of which at least 76 people have died.

Unfortunately, the South Korean government is not as difficult to obtain for these seriously ill employee compensation, while also pampering Samsung employees to conceal the truth. He reported that a mere 22-year-old employee died of leukemia deaths. His family said that Samsung has proposed compensation for one billion won (US $ 864,000) to make their peace.

A former employee suffering from the loss of vision caused by multiple sclerosis, the employee said, Samsung factory which they never had education chemicals harmful to the body. Another former employee said breast cancer, Samsung all the money, recruited from the countryside without the knowledge of young people, like the use of disposable cups, as workers, so that their life is in danger.

In the past 10 years, Apple has developed into an international equipment manufacturer. At the same time, Apple is also strengthening its supplier standards (including Samsung), including the working environment and the treatment of workers and the like. Even so, the media will often exposed these suppliers violations, such as child labor, excessive overtime, low wages, etc., and even suicides.

Li Yuqiong 2012 have been reported, more than 30 employees to Samsung Korea Samsung workers compensation complaints and Welfare, said his illness with the factory’s working conditions. However, the complaint has not been recognized, then at least 10 several employees appeal.

In December 2012, South Korean workers compensation and Welfare announced the outcome of the arbitration, a chip Samsung finds poor factory working conditions, in which a female employee and breast cancer death, claim compensation for the families of employees of Samsung.

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According to the “Wall Street Journal” online edition reported, artificial intelligence technology industry has become a popular trend. In this trend, driven by technology companies are competing to acquire start-up companies in the field of artificial intelligence, Intel became the latest to join the ranks of the acquisition of the company.

Intel on Tuesday announced that it will acquire artificial intelligence start-up companies Nervana Systems, to develop called “deep learning” popular artificial intelligence techniques. Nervana is a company with 48 employees engaged in the semiconductor, software and service development.

Intel did not disclose the purchase price.

Prior to this, Apple on Friday the acquisition of artificial intelligence company Turi Inc. Venture capital research firm CB Insights data show that since 2011, the company acquired a large number of transactions artificial intelligence start-up companies reached 31 pen, these big companies, including Google, Twitter, Yahoo, IBM and Salesforce.com.

PwC calculations included smaller-scale acquisitions, so far this year with AI-related start-up companies has reached 29 pen acquisitions this year, the total transaction volume is expected to exceed last year announced 37 pen.

After the 2010 acquisition of startup Siri, Apple promoted the rapid development of artificial intelligence in the consumer sector. After the acquisition of Turi, Apple is expected to benefit from Turi CEO Carlos Gus Sterling (Carlos Guestrin) expertise, which is the University of Washington professor of machine learning.

“Artificial intelligence will gradually change every industry,” a pioneer in the field of deep learning, Baidu’s chief scientist and Stanford University associate professor Andrew Ng expressed. He believes that the acquisition of buyer demand for talent to more than technology.

Intel’s acquisition of the company’s artificial intelligence has a special motivation. Although Xeon chip can handle most computing tasks in the data center, but rival Nvidia GPU faster handling specialized tasks associated with deep learning.

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Infineon Technologies AG launched 50 new mm module, further expansion of the welding type thyristor / diode module product line. The thyristor / diode module can meet the demand of continuous growth of high performance and low cost of growth markets, especially suitable for application of high reliability and price advantage is obvious: the market price of the new module pressure ratios are of the same specifications meet modular low 25% or so. In the application of some non – necessary modules, such as frequency converter, power supply, welding, and high performance, the product is very practical.

The Infineon Technologies bipolar Co., Ltd. launched new 50 mm welded module, the further expansion of the existing bipolar type welding modular product line. Currently, the rated current of the 50 mm module ranges from 280 A to 330 A. Infineon in two years ago has production 34 mm and 20 mm welded module, after extensive use, the field reliability has been customer’s site to verify. All these high price module was launched, aimed at as crimping a necessary supplement to the modular products, them all using industry standard package and is equipped with a good electric insulation copper substrate, effectively enhance the heat dissipation performance.

Using new 50mm module of welding technology and the existing 20 mm and 34 mm module together. At present, can meet the large quantities of demand. The module topology configuration is complete, including thyristor / SCR, thyristor / diode and diode / diode; current production module product blocking voltage of 1600 V, the current range of rated current from 55A to 330 A. Infineon plans in 2017 launched blocking voltage module for welding of 1800 and 2200 V, extend and perfect the product line.

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Recently smartphone supply chain circulated a statement: China Mobile from October 1 this year, subsidies LTE cat.7 models, since MediaTek’s baseband (modem) currently only supports LTE cat.6, under the explosion models models OPPO R9 version R9S steering Qualcomm platform, thereby adversely affecting shipping couplet MediaTek chip solution.

Spreadtrum recently in the media open day, also emphasized its for high-end smart phone market launch of the first LTE chip solution SC9860, integrated baseband support LTE cat.7, thus more than one asymmetric competition in the market compared to MediaTek Advantage.

Baseband on the mobile phone industry is evident. Due to popular mobile phone chip integrated solutions, has only application processor (AP) chip makers in the smart phone industry is difficult to gain a foothold chip giants have set foot in a lot of R & D group with the acquisition or expansion. For example NVIDIA acquired Icera, Broadcom acquired Renesas communications chip business, Intel acquired Infineon’s chip business.

However, Broadcom, Marvell and Nvidia and other chip giant struggled several times, chose to quit. So far, the global mobile phone baseband vendors have only Qualcomm, MediaTek of Taiwan, Huawei Hass, violet show sharp (Spreadtrum), South Korea’s Samsung and other companies a few. Collective exit mobile phone chip giant, Samsung self-study because the baseband has achieved great success.

The last straw that breaks the camel

As the world’s largest, and shipments ahead of the smart phone manufacturers, Samsung’s every move, decided the fate of the suppliers and downs. Meanwhile, Samsung is the world’s most complete industrial chain of smart phone manufacturers, in addition to the smart phone, the panel, components, chip, wafer manufacturing, and other fields have achieved enviable success. Apple and Samsung patent war vigorous in those years, Apple’s iPhone has had to rely on Samsung’s production core chips.

Samsung is also a considerable scale manufacturers of communications equipment. Smart phone industry chain of control and communication technology understanding, so that Samsung as early as 2010 began with a research and development base. After 2010, the Samsung Galaxy S series smartphones was a huge success, jumped from the world’s biggest smartphone maker, a full range of phones using Qualcomm, Broadcom, Marvell and Intel chips, but has not given up its own R & D base band.

By 2015, Samsung invested many years finally beginning to see the rewards: Galaxy S6 Most shipments using a self-developed baseband chip, and Exynos7 discrete structure, technical strength to achieve industry-leading level. And before the Galaxy S6, Samsung already uses an integrated version of the application processors and baseband chips for low-end smart phones. Samsung’s long-term dependence Marvell and Broadcom, lost the largest customers.

Prior to this, China’s Huawei Hass, Spreadtrum has been rising, and MediaTek together serious pressure on the survival of these foreign chip giant, the Samsung can only hold thigh. Samsung chip with self-study group after the success, became the last straw that breaks the camel, forcing these giants arm to survive, to exit the mobile phone chip market.

In fact, from WCDMA to HSPA to HSPA + and then to LTE, the LTE Cat.3 to LTE Cat.4, LTE Cat.6, LTE cat.7 to LTE cat.9 like, baseband technology almost every year in the evolution. Manufacturing technology-intensive, highly complex baseband requires strong communications technology research and development and ongoing annual R & D investment, high investment, high risk features hundreds of millions of dollars, the mobile phone chip giants unbearable. Broadcom has revealed exit baseband business could save $ 700 million a year. Huawei, Samsung and other mobile phone manufacturers choose self-study, so that the chip giants do not see the huge investment returns, exit to become the only option.

Vertical integration model success?

A few years ago the outbreak of the demand for smart phones, the world once had dozens of companies developing mobile phone chips. In Matthew and scale, driven by merger and reorganization of these companies continued survival of the fittest, with Broadcom, Marvell and other chip giant quit, cell phone chip industry ushered in the era of oligopolistic competition.

Meanwhile, the explosive growth of smart phones, a leadership position in the mobile phone manufacturers shipments reach tens of millions or even hundreds of millions of its own with the scale effect, let the phone manufacturers, “vertical integration” as possible. Huawei is the pioneer, the company’s Hass over the years invested heavily in chip development, and rely on their own integrated chip solutions for smartphones brings a differentiated competitive advantage, it is widely recognized by consumers.

Huawei handset shipments is limited to the size and positioning of Huawei Hass, Huawei Hass chip supply to solve their own part, it did not affect Qualcomm, MediaTek and other chip vendors independent business model. Samsung dominate the global mobile phone, in the field of the same super-class components supplier, Galaxy S6 proved the strength of Samsung chip solutions, introduced this year Exynos 8890, is an integrated chip solution (single-chip processor), the baseband data rates up to 600Mbps the LTE cat.12, with Qualcomm and Huawei Hass at the same level.

Moreover, in the chip manufacturing also uses Samsung’s own 14nm FinFET technology. According to public performance parameters, performance Samsung Fengyun flagship single-chip with Qualcomm Xiaolong 820 par. Earlier claims that Qualcomm Xiaolong 820 to Samsung OEM manufacturing, it is afraid of losing big customers to take the initiative. 2015 Samsung Galaxy S6 using their own chip solution, allowing Qualcomm earnings was very ugly, and even face the risk of the company was split.

Smart phone industry more competitive, “left is king,” the trend is clear. When the remaining large manufacturers have more than 50 million units or even a million units in shipments, but also have a basic self-developed chip scale effects. If the self-developed chips will bring greater competitive advantage than general-purpose chip, it would be a subversion of the business model. Samsung self-developed baseband success, the butterfly effect is caused by the mobile phone chip industry.

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Karlsruhe Institute of Technology (KIT) researchers have successfully developed a method for detecting the optical data path innovative photodetector, occupying an area of ​​less than 100 sq. M …

Glass fibers (glass fibers) may become the information age transport highway ── Karlsruhe Institute of Technology (Karlsruhe Institute of Technology, KIT) researchers have successfully developed a method for detecting the optical data path innovative photodetector (photo detector), the core components of glass fiber receiving end; this achievement sets a new standard for the size of such elements, the researchers claim that its footprint is less than 100 square microns (micrometer), it is ideal for integration into an IC program, but more impressive is its data transfer rate.

KIT researchers Sascha Mühlbrandt claims the new photodetector is currently the world’s smallest optical data transmission element, can bring significant performance improvements to optical communication systems because the components can be integrated into a large number of optical components in the semiconductor; in the team’s experiment, the researchers reached a maximum transfer rate of 40Gbps, enough time in less than a second complete video content delivery within a DVD. Mühlbrandt convinced that its throughput is still potential for further increase: “Within this plasma photoemission detector (plasmonic internal photoemission detector, PIPED) ever achieve such a high data transmission rate of the minimum size of the detector;” He said the element 100 times smaller than conventional optical detectors.

This light detector ultra-small size, the advantages can be integrated with a downstream circuit pretreatment (downstream preprocessing) on ​​a single CMOS chip; microstructure KIT Institute of Technology’s (Institute for Microstructure Technology) project coordinator Manfred Kohl said this innovative plasma component can support high-speed data transfer between chips inside computers, opening the possibility of combining electronic and optical components advantages, higher than that of pure electronic parts data throughput.

In order to combine optics and electronics in a very small space, KIT developed a light detector utilizes plasma surface polaron (surface plasmon polariton), capable of metal dielectric boundary (metallic-dielectric boundary) electromagnetic surface is highly concentrated. This new kind of plasma converter to convert the signal directly to the metal surface is the wavelength of light is based, also known as light-emitting (photo emission); To effectively control the light absorbing and converts it into an electronic signal conditions, the researchers in titanium – silicon contact surface (titanium-silicon junction) generation of carriers (charge carriers), and another gold – silicon junction to the restructuring, and the detector is a high speed through its special geometry of the two metal reached ── – the distance between the junction silicon less than 100 nm.

The researchers believe that the concept of PIPED not just the future of the optical data transmission infrastructure sis, but also key components of wireless data transmission system; KIT subsidiary responsible for research to support ultra-high speed optical signal processing of electro – fusion technology HIRST (Helmholtz International Research School of Teratronics) Institute Professor Christian Koos said: “plasma components can be applied to high-speed wireless data communication, and to achieve 1 terabit per second data transfer rate.”

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Development and manufacturing of high-performance sports cars and racing gearbox Xtrac UK recently released the EV (electric car) racing’s new reducer series “P1227″. Support front-wheel drive, rear-wheel drive and four-wheel drive, with other high-power high-performance racing car development as the goal.

Compared with the original reducer “P1092″, “P1227″ weight reduction of about 20%. It can be integrated with the United States and the United Kingdom GKN BorgWarner and YASA motors. In combination with a single motor, the whole can be small, lightweight, two-motor is used in combination with torque vectoring capabilities. A high degree of freedom in design can also be equipped with LSD (Limited Slip Differential, limited slip differential).

The new series supports reduction ratio range, the degree of freedom is high, easy to integrate into the vehicle design. Motor configured to be both horizontally and vertically configured.

YASA motor with the double “P400C” with the use of reduction ratios ranging from 2.5: 1 to 5: 1, the maximum number of revolutions support 10,000 rpm, the maximum torque support 1000N · m (two 500N · m motor). Weight does not include motor for 45kg.

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Promote energy efficiency and innovative Semiconductor (ON Semiconductor), further expansion of automotive power integrated module (PIM) product line, launched STK984-190-E. The module is optimized for driving three-phase brushless DC motor (BLDC) for modern automotive applications, comprising six 40 V, 30 A MOSFET configured as a three-phase bridge, and an additional 40 V, 30 A high-side reverse battery protection MOSFET. The MOSFET is mounted onto a direct bond copper (DBC) substrate, resulting in a compact module with excellent heat dissipation, it is only as effective as discrete programs half the board space.

The module is suitable for 12 V automotive motor drive applications, rated power of 300 W, electric pumps, fans and windshield wipers. Using motor controller designers to incorporate such LV8907UW, can create energy efficient BLDC solution with best-in thermal performance and built-in diagnostics, and ultra-small PCB, saving critical dimensions and weight.

Use this module can significantly reduce component count and BOM cost. DBC substrate thermal resistance reduced, thereby reducing the operating temperature of the MOSFET. By reducing the thermal cycling during temperature changes, which reduces the power consumption and increase reliability. Insulation provided by the DBC substrate also enhance the reliability. STK984-190-E specified operating temperature range of -40 ° C to 150 ° C. All integrated MOSFET through AEC-Q101 certification.

Chris Chey, general manager of ON Semiconductor System Solutions Division, said:. “Develop an efficient BLDC drive program usually takes at least 13-15 discrete components, while less than half the number of car components STK984-190-E power modules required in addition to a compact size, STK984-190-E support robust thermal performance with a smaller heat sink. this enables the size and weight of the system is significantly reduced, which means engineers can fully address the challenges currently facing with regard to improve fuel economy and overcoming space constraints. ”

STK984-190-E lead-free DIP-S3 package measuring 29.6mm x 18.2mm x 4.3mm.

According to overseas media reports, Taiwan’s IC design greet the season in the third quarter, gradually covering inventory downstream customers, MediaTek counterattack horn blowing performance driven, comprising: Realtek, silicon Cenda, Bright, Li product, Sheng Branch, etc. 3rd quarter results monthly rise, the opportunity to challenge the new record high.

From rival Qualcomm optimistic about the third quarter outlook, you can see the results of this season MediaTek go Yang is not difficult, Qualcomm estimated quarter revenue between 5.4 to 6.2 billion US dollars, higher than analysts expected figures, MSM chipset shipments will be between 195 million to 215 million group, annual growth rate of between 4.0% to 6%.

MediaTek chairman Tsai Ming-Kai previously they predict the third quarter in good shape, the mainland and the emerging markets in the smart phone development speed up the pace, 2G, 3G into the 4G than expected to fast, the third quarter continued the previous quarter boom, shipping momentum continues to grow . The corporation estimates, the three major telecom operators in the mobile phone, driven by continued subsidization, Andriod mobile platform customers continued to build inventories, MediaTek Q3 revenue will continue to set new monthly high, and the opportunity to rebound this quarter gross margin .

Netcom Realtek chip maker into the traditional peak season, switching applications replace 802.11n WLAN 802.11ac shipments warming, increase market share month by month, and after the acquisition of Avago Broadcom exit consumer WLAN, Ethernet chip market, Realtek into a single chip manufacturers, substitute effect gradually reaction, new orders in the third quarter began volume shipments.

Also benefit from 802.11n 802.11ac substitution effect, RF IC stand volume in the third quarter WiFi RF components ship sustained heavy volume this season monthly revenue record June sales will remain high trend, the second half of the monthly performance go Yang. Since the multi-band multi-mode mobile phones towards development, RF radio frequency front-end components used in an amount more than 2.5 to 3 times the penetration increased from 35% last year to 50% this year, only the previously established plot 11ac 2.4G and low power 5G PA, expected third quarter 11ac began shipping high power 5G PA.

Analog IC silicon Cenda the third quarter into the industrial shipping season, monthly sales continued in June highs boom, SSD steady growth is expected to received the Japanese and the US Department of SSD customer orders, in addition, China cut before five smart TV and Korea of ​​the customer, shipment growth is expected in the second half. Plus the acquisition of Maxim and NXP sector into the fermentation efficiency, legal expected this year and the acquisition of profitable sector revenue is expected to grow 13-14%, 3-4%.

China’s three major telecom operators continued to subsidize smartphones, Bright led the third quarter of the mobile phone chip fast charge continued strong demand for mobile phone IC were maintained annual growth rate of more than 30% annual growth, accounting for the proportion of products from 2 years ago 15% to 25% in the first quarter of this year, corporate forecast to benefit from the booming mobile phone fast charge IC shipments, quarter by quarter revenue of 5-10 percent.

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According to “Science Daily net,” the report pointed out recently in the United States of an international technology team, officially announced the development of a new technology, which is a high-performance magnetic memory chips team will migrate to the surface of a soft plastic, and lossless performance . And through the soft plastic characteristics, the development of a transparent film-like “soft plastic smart chip.” It has excellent data storage and processing power in the future if the formal commercialization, the future is expected to become an important product wearable storage element.

Reports indicated that research and development which “soft plastic smart chip” team first magnesium oxide-based magnetic tunnel junction (MTJ) grown on a silicon surface, then etching away silicon below, then the use of a transfer method, in a raw material made of polyethylene terephthalate made of soft plastic surface, a magnetic memory chips implanted. After testing, the new equipment in action Magnetoresistive Random Access Memory (MRAM) on the clear. Since MRAM in the processing speed, power consumption, and can be powered down after data storage and other properties, are higher than conventional random access memory chips. Therefore, the “soft plastic smart chip” Future after integration and MRAM will create a new birth of another storage element.

Currently, flexible electronics equipment market to develop soft magnetic storage device the most attention. Because they will be the future of wearable electronics, and biomedical device key components of data storage and processing. Although scientists have conducted a number of studies on different styles of memory chips and materials. However, the flexible substrate to create a high-performance memory chips without compromising its performance, the research is still facing enormous difficulties.

At present, developed the “soft plastic smart chip,” the international team for the National University of Singapore, scientists Yonsei University, the University of Ghent, Belgium, Singapore and the Singapore Institute of Materials Engineering Research Institute of the combination. The team said that at present in the United States and South Korea have applied for a patent for this technology. The device is currently being further enhance the effectiveness of the experimental magnetoresistance, and look forward to products used in other electronic devices.

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