In the recently held a new conference glory Huawei Huawei Fellow Yiwei Xuan cloth, Hass unicorn series chip cumulative shipments have exceeded 80 million. This is a remarkable achievement, however, Kirin Hass chip shipments to break one hundred million, but also further enlarge and strengthen, in particular, to dare to challenge industry leader Qualcomm Snapdragon chip.

As we all know, the chip is one of the “core” power boost mobile phone industry continues to move forward. Especially with the growing competition in the market for mobile phone manufacturers, if not self-development of the chip, you need to use third-party chip, which is likely to lead mobile phone manufacturers to pay higher costs, more flexibility but can not define your own products, and even affect the time new products, it is difficult to get rid of product homogeneity, can not give users more differentiated experience. So many current phones manufacturers have started to increase investment in research since the chips, hoping to seize the initiative in the future product innovation and market competition.

However, review of the current number of Chinese mobile phone companies really have very few self-developed chip manufacturers. Although the latest Chinese mobile phone shipments data, has occupied 90% of the domestic mobile phone market share, but “Delta does not increase profits,” the phenomenon is still quite prominent. One very important factor is that most manufacturers are still heavily dependent on the use of chip Qualcomm, MediaTek and other vendors. This is tantamount to disguise their work. Huawei is one of the few Chinese mobile phone manufacturers continue to invest in research since the chips, and has a certain strength to compete with the international chip giant manufacturers. Especially with the unicorn 950 launch and the first equipped with the chip’s annual flagship phone Mate 8 release, Huawei declared successful counter-attack in the mobile phone chip market.

It is reported that Huawei’s self-developed chips have been the case without human attention quietly gone through 20 years of history. Since 1991, Huawei established ASIC Design Center, 2004 Hass Semiconductor Co., Ltd. was founded; started to develop smartphone chips from 2006 to 2008, announced the first mobile phone chip K3V1, and then in 2012 launched the smallest quad-core K3V2 processor and to achieve ten million commercial; from 2013 to further clarify the use of SoC architecture, introduced support for LTE Cat4 Kirin 910 quad-core processor, and a variety of large-scale commercial on Huawei’s flagship smartphone, the world’s first launch in 2014 supports LTE Cat6 standard Kirin 920 chip, introduced in 2015 and the successful Kirin 930/935 chip scale applications on the flagship model, and then introduced the industry’s first commercial 16 nanometer technology chips Kirin 950 SoC, Huawei has been in the mobile phone chip this “no return” on courage.

The past two years, Kirin chips gained more and more recognized by consumers, access to application on a series of Huawei mobile phones selling models, the current overall chip shipments unicorn show rapid growth. In the new conference, Huawei’s first full-mode chip re-launched Kirin 650, become another important milestone in the development of Huawei Kirin series chip, chip Kirin also shows the international advanced level in technology and further shorten the distance.

Known as the Pearl of the chip industry on the crown of ICT, and self-study of mobile phone chips this road is full of obstacles. Not only a huge investment, and each first silicon failure, may bring up to tens of millions of huge losses. Many lack the financial and technical strength of the enterprise despite also want to practice self-developed road, but in the face of enormous difficulties and risks, had to give up. “Huawei from the outset, chose the most difficult road to climb, I hope that through continuous investment terminal core chip R & D, to master the core technology to build long-lasting competitiveness, so as to provide differentiated the best experience.” Ai Wei said.

Not long ago, Huawei CEO Ren Zhengfei, Huawei’s terminal proposed future revenue target of up to five years, $ 100 billion, which means that Huawei’s terminal will surpass Samsung, Apple in the global mobile phone market share but also grown exponentially. Hass unicorn chip this “nuclear umbrella” will play a crucial role. In addition to meet their supply needs outside Hass Kirin should also look beyond broad some, such as delivery to more domestic mobile phone manufacturers to pass ratio, more favorable conditions for MediaTek to attract more Chinese manufacturers to use Kirin chip, Chinese enterprises gradually get rid of dependence on Qualcomm and other chip companies, and ultimately achieve domestic alternatives.

Although it had established Hass out “to prevent people without food,” the strategic plan, but by 10 years of accumulated technology and development, Hass has now far beyond the original vision to become the world’s chip design has important implications enterprise. According to 2015 statistics, Huawei Hass revenue growth of 19%, ranking the world’s top 10 chip design companies in sixth place. And have appeared in the case of Qualcomm, MediaTek performance decline, shipments and revenue both contrarian surge. Since Huawei phones dare to challenge Samsung, Apple, then Hass unicorn and dare to challenge Qualcomm Xiaolong, China to play a leading role in the field of ICT chip, issued more energy to completely change the “lack of core small soul” dilemma Chinese ICT industry .

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Microsoft’s price of $ 1.96 per share, to spend $ 26.2 billion acquisition of professional networking site Linkedin. Transaction has been approved by the board of directors of Microsoft and Linkedin. This price Linkedin previous valuation premium compared with 49.5%. After the deal was announced, Microsoft and Linkedin jointly held a conference call with analysts, purpose and future development to make an explanation of the transaction.

· Microsoft CEO Satya Nadella (Satya Nadella) represented at the meeting, Linkedin will retain their own brands, culture and independence. Linkedin CEO Jeff Weiner (Jeff Weiner) will stay on Linkedin CEO, joined Microsoft executive team and report directly to themselves. He also said, Linkedin founder Reid Hoffman (Reid Hoffman) fully supports this transaction, the acquisition is expected to be completed this year.

Nadella emphasized that Microsoft and Linkedin share a common mission, it is to support each and every company in the world to achieve greater value, and the best way to achieve this goal is to connect each of the world’s professionals to help them be more productive and more successful. This is the Microsoft acquisition Linkedin purposes. Weiner said, Linkedin has over 433 million users and 105 million monthly active users worldwide, the mobile terminal traffic accounted for 60%, and continues to grow. In particular, he stressed that China is the fastest-growing market Linkedin.

Nadella spoke, Linkedin and Microsoft Office 365 and Dynamics business has a strong synergistic effect, which is Microsoft’s core business lies. Microsoft will by individuals and businesses as well as many business subscription model for advertising, accelerate these three business interaction and collaboration. There are significant growth opportunities in this regard.

Specifically, he said that Microsoft has 1.2 billion Office users, Windows 10 installed capacity of over 300 million, Office 365 users to 70 million monthly living, Dynamics 800 million users. But only to Microsoft may reach 9% of the market range, which means that Microsoft has a huge room for growth. Now, Microsoft has a Linkedin has 433 million users and 105 million active users. Microsoft’s enterprise service maps and Linkedin professional social graph integration exciting prospect.

Nadella cited as an example of the synergistic effect of the empty space of Microsoft and Linkedin. He mentioned, LinkedIn will become the connection between Microsoft and many other social services infrastructure, whether it is Outlook, Excel, Skype, Powerpoint, Word, or SharePoint. Microsoft’s powerful artificial intelligence and machine learning techniques for the rapid growth of information flow LinkedIn brings improved, helping the latter to enhance the liquidity of the ad.

Microsoft general counsel Brad? Smith (Brad Smith) describes that, before the two sides to complete the transaction requires the approval of the US, EU and Canadian regulatory authorities, etc., which does not include Japan, South Korea and China. Microsoft expects that this transaction is expected before the end of the year to get regulatory approval. He noted that Microsoft and Linkedin business no significant overlap, but complementary, Microsoft can help Linkedin expand their business. The merger is conducive to the world’s hundreds of millions of users to bring more benefit.

Microsoft CFO Amy Hu DS (Amy Hood) spoke, Microsoft agreed to pay $ 196 per share, all-cash transaction by way of acquisition of Linkedin. The deal worth $ 26 billion, including net cash Linkedin. Microsoft will before the completion of the transaction, with the favorable market window new issues, financing for the acquisition. She mentioned that the main purpose of the acquisition is to accelerate business growth Linkedin Linkedin and Office 365 and Dynamics, and is expected to bring cost synergies of $ 150 million per year.

She is expected in 2017 and 2018 fiscal years, the deal would give Microsoft a non-GAAP earnings per share to bring about 1% dilution. After completion of the transaction, Microsoft will continue to publish impact of the acquisition on earnings per share caused. DS Hu stressed that the transaction will not affect Microsoft’s current equity repurchase program, Microsoft will continue to promote the end of the year $ 40 billion equity repurchase program previously approved.

Some analysts asked Microsoft over the past few strokes huge deal less successful, but growth is slowing Linkedin. Nadella said that Microsoft is in three dimensions to measure whether the acquisition. First, whether the acquisition will help Microsoft to enter new markets or enhance current market competitiveness? Second, whether the transaction can bring significant synergies? Thirdly, the transaction is in line with Microsoft’s core business, part of Microsoft’s enterprise architecture to integrate, focus on the best in the field of executive power. In his view, Linkedin transactions fully comply with three conditions.

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“DOB technology is rapidly becoming the new choice for LED lighting applications, although not as SMD or other conventional forms of penetration so fast, but it must be a place, the next few years, DOB will reach more than 20% market share.” Easy US-light Executive Vice president and technical Director Liu Guoxu mentioned in his speech.

DOB, is based on the high-voltage AC drive modules integrated DOB light, it attracted the attention of many designers. DOB is not actually new, a few years ago have begun to enter the international manufacturers, and mass production, including Osram, Samsung, LGIT have launched their products.

Liuguo Xu said in his speech, efficient and high-voltage LED driver IC elements are constructed of DOB. LED drivers account for about 20% in lighting costs, not only affects the cost, but also affect efficiency, but also determines the life of the LED lamp.

Traditional AC-DC Driver topologies there are many, such as isolated driver with the device, large volume, assembly complexity, high cost, stability and security is good. Other ways have different structures, including the choice of Buck-Boost configuration, it requires a large capacitance and inductance element. It is relatively inexpensive RC Buck power, low cost, but low reliability.

Direct AC from topology point of view, many packaging manufacturers have introduced AC LED or DOB, traditional anti-parallel structure, mixed bridge structure, but also the use of an external bridge, light and easy to use SBC AC linear drive. Compared with the conventional AC-DC converter (switching power supply), AC linear drive can be connected directly to the mains, no external circuit, very compact, very easy to implement integrated, adjustable light, and very flexible, longer life, because it does not contain electrolytic capacitors, the extra space can be used to full cooling, lower cost, low component count, assembly costs are low. With a large number of driver chip production, the overall costs will fall significantly.

Liu Guoxu think, DOB provides new flexibility for lighting, if appropriate AC design, can solve the flicker problem. Since DOB simplicity and integration of different sensors connected to the gateway, the future DOB in the field of intelligent lighting can account for a place.

In addition to DOB, the Liuguo Xu also talked about other technology trends, for example, high CRI, high luminous efficiency LED technology is a breakthrough (narrow spectrum red phosphor or quantum dots into a key); health and artificial lighting efficiency energy saving substituted, a new market demand driven; intelligent lighting faster than imagination, and from everyday life is getting closer; silicon LED national Science and technology invention award, the industry once again become concerned about the hot; CSP packaging technology to become hot from the backlight and flash, start applying to lighting.

On LED market trends, Liu Guoxu summed up five points: First, LED prices continue downward, but the decline has slowed down, the quality gradually returning, as concerns; Second, the upper and middle reaches capacity continues to increase, the greater the larger; Third, cross-border mergers and acquisitions and overseas overwhelming; Fourth, emerging markets become hot pursuit; five market segments into a new opportunity (UV, plant growth, visible light communication, etc.).

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The semiconductor industry is about to reach the wafer process bottlenecks, also on behalf of Moore’s Law will likely fail, the future is bound to integrate fab down to the packaging and testing plant in miniature wafer process can not continue, the packaging and testing industry will be temporarily to system-level packaging, etc. effective integration of chip technology will do to improve the chip manufacturing profits, provoked beyond the role of Moore’s Law, ASE, SPIL and force a positive layout.

Semiconductor Association Lu superior that the next vertically stacked semiconductor going to do 3D, the future of the global semiconductor industry will grow towards the kind of Moore’s Law.

Wafer miniature reach bottleneck

Ma Guanghua, deputy general manager SPIL R & D Center, said the future single chip has been unable to continue to narrow the case, say, or a reduced cost price has gone beyond economic benefits, it is necessary at this time through the packaging technology to enhance the performance benefits of the chip, like ASE system-in-package (SiP) technology or wafer level packaging.

Ma Guanghua pointed out that the so-called wafer level package is to direct the entire wafer packaging and testing process have lost part of the packaging materials, make up an IC (integrated circuit) will be relatively thin, so-called fan-out wafer level package that is directly on the fan-out wafer packaging materials can save another 30%, while the chip can be thinner.

There panel next level package, Ma Guanghua interpretation, the panel level package is the direct use of the panel encapsulation, compared to the 12-inch wafer cutting IC, can be more efficient and cost-effective, until the fan-out type package maturity on the panel after, there will be panel-level system-level package.

Panel level package cost savings

Now all major plant aimed at advanced packaging process to improve the quality of packaging and testing, but also to throw off opponents, which is actively layout ASE fan-out type package and system-in-package, the previous ASE also made DECA TECHNOLOGIES type of fan-out wafer level packaging process technology and patents.

Powertech chairman DK Tsai said that after due future product development will move towards compact size, but faced with the limits of Moore’s Law, it is necessary to take the advanced packaging technology to make up for this deficiency, whether 2.5D, 3D or fan-out (Fan out) packaging, etc., to force all devices are ready.

IC packaging and testing industry pointed out that at present, neither on logic IC or is NAND Flash, the 3D stacking technology is required in order to allow the chip to maximize the benefits of play, but also to achieve the slim and light level.

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Silicon Valley will be a Monday morning, people do not want to get up in the face of hard work where there is a ready example ──, according to recent Bloomberg (Bloomberg) reported, Aicha Evans Intel (Intel) wireless business group manager had left.

I had a chance encounter, according to Intel official data 20 years seniority Evans, as an African woman engineer, she can get on top of Intel’s position is obviously very competent professionals. According to various stories, Evans in the last few months of his career especially hard, because it is responsible for the operation situation of poor Intel wireless business.

Intel for many years actively trying to heat beyond laptop mobile phone market to expand their territory, including its ambitious acquisition and sale deeds StrongARM processor, designed its own flash memory containing the function blocks cellular phone chips, and It has acquired the iconic cellular phone modem chip business Infineon (Infineon) wireless business group.

Originally responsible for Infineon’s wireless business business group Hermann Eul last to leave, Evans was his successor; Evans on behalf of Intel to attend last year’s Mobile World Congress (Mobile World Congress, MWC), said the company will data 5G machine chip lead, but in view of the first edition 5G standards may be by the end of 2018 will come out, as though daring goal but also very far away.

So, why Evans left the company so soon? If she really leave the words … this Intel declined to comment, Evans himself did not respond to messages sent by the author, and the industry has all kinds of speculation on this post …

The Motley Fool tech community site speculated that this is because the business group Evans trouble shipping 14-nanometer versions of Intel integrated applications processor SoFIA year; but I’m not sure whether her department is responsible for the chip.

Market research firm Forward Concepts Leader Will Strauss speculated, Evans is leaving the department because she did not get the iPhone case design 7; however Bloomberg reported citing a Wall Street analyst speculation that Intel will get at least part such a large number of high-value design case.

Of course, unless Apple (Apple) of the minority as well as some key suppliers, no one really knows the answer; but it was still too early, things could still change. In Steve Jobs (Steve Jobs) is still Apple, when I heard that the company had to abandon the use of a component, because vendors say too much should not say.

One thing is very clear, the smart phone modem chip market is not easy to break; Qualcomm (Apple) in the market 58% market share, such as Strauss said, this is because the company will be pretty all the latest 3GFPP function together, and can quickly introduce new designs. Qualcomm is currently the 12th generation chip support 600 Mbits / s download speed, and has been discussed in the next generation (xiii generation) chips will reach Gbit / s level.

And close behind MediaTek (MediaTek) the market share of 20 percent, China’s Spreadtrum (Spreadtrum), compared with 6% market share; both companies are good at cutting costs, and outstanding performance in the Chinese mobile phone market.

Phone modem chip market is so steep, market share ranked fourth and fifth supplier (respectively 6% and 3% of Marvell Broadcom) have quit last year; and Strauss noted that Chinese telecommunications equipment maker Huawei ( Huawei) also has a very good LTE modem chip, the chip supplier’s Hass (HiSilicon) design.

Intel in the mobile phone modem chip market share of only 1%, and should be spent billions of dollars to maintain the business; therefore Evans in the past few months will indeed be on pins and needles. I really hope one day to hear her own experiences, that would be great Silicon Valley story.

In Silicon Valley, there are many super smart guy trying to complex, rapidly changing global market perform some incredible feat, and that the story of what I turn on the computer trying to accomplish tasks every Monday morning!

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Researchers at the University of Georgia and Gurion University of the Negev in Israel by DNA molecular manufacturing a new type of diode. This is considered to be the world’s smallest size diode. The researchers said it would promote the development of DNA components, and promote the development of molecular electronics. The function of the diode is to realize the unidirectional flow of current. More than 40 years ago, scientists have suggested that the diode and other electronic components can be miniaturized, reduced to a single molecular size. This has led to the birth of molecular electronics, and the research results of molecular electronics is expected to promote the computer technology to break through the limitations of traditional silicon devices.

In this study, the scientists used DNA to create a diode. The breakthrough of gene science makes it possible to design DNA accurately, and makes DNA become the best raw material in the study of molecular electronics.

The double helix structure of DNA consists of molecules called the base pair. The length of this new type of diode is only 11 base pairs. Typically, the length of each DNA base pair is about 0.34 nm.

DNA itself does not play the function of the diode. However, when the researchers to a position of the internal DNA insert two small Coralyne molecules, and to the applied 1.1 volts, can be found in the current through the diode of the DNA in a certain direction to 15 times stronger than in the other direction.

The scientists said that this DNA diode can be further optimized, so as to develop a molecular device can provide the actual function. The research is published in the journal Nature chemistry.

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In order to solve the calculation problem of the world’s most intractable, the Lawrence Livermore National Laboratory, Lawrence Livermore National Laboratory) hope to obtain inspiration from the structure of the human brain, so the laboratory program in this month 31 days to a value of $100 million super computer testing. It should be pointed out that this super computer is the most special place is the integration of the 16 dedicated to simulate the work of the human brain processor.

It is reported that the use of this super computer processor chip called “TrueNorth” by the IBM in 2014 for the first time introduced. In fact, IBM, Qualcomm and Microsoft had previously teamed up to design, develop a computer algorithm to improve the processing speed of the chip. And such as “TrueNorth” is more suitable for this type of chip is applied to advanced artificial intelligence technology, including in-depth study. It should be noted that this chip technology is actually a model of the human brain to run a simulation, although it has not yet been tested, but its future prospects are very attractive.

Specifically, the “TrueNorth” chip and the current server or personal computer used in the chip has a very big difference. The chip set up 5 billion 400 million transistors, which constitute a network of 1 million simulated neurons, which are connected by a large number of analog synapses. Moreover, IBM is mainly used in the United States Department of Defense Advanced Research Projects Agency (DARPA) under the funding to develop TrueNorth chip.

Engaged in truenorth research and development work has been 12 years of IBM’s chief researcher de Harmon della – Modha DharmendraModha said “although in some degree, the structure of the brain looks quite simple, but it can solve some complicated problems.” say。

IBM revealed that it is now five to seven years away from the commercial TrueNorth large-scale investment, but the Lawrence Livermore national laboratory test is an important step in this direction taken an important step.

Similar to the human brain, TrueNorth does not need to consume a lot of energy at run time. For example, the average server chip power consumption of more than 150 watts, while the power consumption of TrueNorth chip is only 2.5 watts. However, TrueNorth can not be used to run the web server, and even can not be completed in a Excel table in the work of several columns of data input. This is mainly because the chip is designed is to perform such as image recognition, or is a kind of artificial intelligence application (such as the recent Google (micro blog) parent company alphabet software AlphaGo beat South Korea chess master Li Shishi that era of computing tasks.

“TrueNorth will be very useful for deep learning applications and for a wider range of machine learning applications.” Van Essen Brian, a computer scientist at the Lawrence Livermore National Laboratory, said.

In fact, Lawrence Livermore national laboratory as early as 2014 began to assess the TrueNorth, but this is the first time the chip has the opportunity to start large-scale testing. Van Essen says his team will be part of the super computer operation gradually transition to truenorth tested, like today, there are many PC will graphics processing of transition to the graphics card to deal with the same principle. He hopes that this technology can help solve problems such as interactions subatomicparticle and network security and other complex issues such as sub atomic particles.

On the other hand, the Lawrence Livermore National Laboratory launched the test for IBM is also an important stage to prove the practicality of TrueNorth.

“They do this very well, TrueNorth may be very efficient, but they still need to prove the accuracy of the model.” University of Washington, associate professor of computer science Sezi – Lewis (Luis Ceze) said.

It should be noted that, IBM is not the only one in the field of computer depth learning to set off waves of enterprise. Currently, Qualcomm is developing its own intelligent cognitive platform Zeroth, the technology allows mobile devices have the innate ability to learn, and do not need to get data through the cloud. For example, Zeroth can identify specific parameters in a picture, so people can use the phone for a specific photography. In addition, users can also use Zeroth technology to identify the picture in the face. More important is that in contact with enough pictures and human face, Zeroth technology will become more and more intelligent.

At the same time, Microsoft researchers are also being launched to allow the programming chip with the company’s Bing search engine to start a collaborative work.

“The race to build a new era of computing chips has already begun. To be honest, we’re still in the lead.” Modeha said.

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IBM researchers recently published a paper, the paper describes the a so-called resistance type processing unit (resistive processing unit, the RPU) new chip concept, allegedly with traditional CPU compared. This chip can will be high to the original 30000 times the depth of the neural network training speed extract.

Depth of the neural network (DNN) is a multi hidden layer artificial neural network. The neural network can be carried out supervision and training, can also be used for unsupervised training. The results of is able to own learning machine learning (or called Artificial Intelligence), namely the so-called deep learning.

Not long ago, DeepMind (Alphabet) Google in the man-machine war beat Li Shishi AI Go program AlphaGo on the use of a similar algorithm. AlphaGo consists of a search tree algorithm and two multi layer neural networks with millions of neurons. In a network, called “network strategy” for computation of which step of the highest winning percentage of. Another network called “value network”, used to tell AlphaGo how to move the albino and sunspots are better, so that you can reduce the likelihood of depth.

As the outlook is good, many machine learning researchers have focused on the depth of the neural network. However, in order to achieve a certain degree of intelligence, these networks need a lot of computing chips, such as the number of AlphaGo used to calculate the number of chips to reach a thousand. So this is a consumption of computing resources, but also costly task. But now researchers at IBM put forward a new concept of chip and its powerful computing ability can be a top traditional chip thousands of, and if the thousands of this chip combined, AI in the future may appear more breakthroughs.

This chip called RPU mainly uses the depth of the learning algorithm and other two features: local and parallel. To this end ROU with the next generation of non volatile memory (NVM) technology concept, the algorithm uses the weight values stored in the local, so as to minimize the data movement during the training process. The researchers said that if the large-scale application of the RPU to 10 million weight depth of the neural network, the training speed highest can accelerate 30000 times, that is to say, usually need to thousands of machines training a few days to the results using this chip for several hours to fix and energy efficiency but also much lower.

Of course. This paper only presents a concept, the chip is still in the research stage. At the same time, in view of the common nonvolatile memory have not yet entered the mainstream market, so such a chip market is estimated to also need a few years time. But if the chip does so much calculation and energy efficiency advantages, I believe in AI research and application of giant will pay attention to Google, Facebook, IBM itself is AI, data one of the active participants, something if you do it is market should not have to worry about.

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Beidou satellite navigation system, members of the Committee of experts, Wuhan University of surveying, mapping and remote sensing, experts, the Chinese Academy of engineering surveying academicians yesterday to the Changjiang Daily reporter revealed that at present, Wuhan navigation and location-based services, Industrial Technology Research Institute (hereinafter referred to as the Wuhan Institute of navigation) to take the lead, and Wuhan University and other domestic research team cooperation, are working together on Beidou smartphones high accuracy positioning and navigation chip related standards, is expected to be the fastest in the end of this year advent.

“The development of this standard has been recognized by the relevant international organizations, has been accepted as a smart phone, such as high precision navigation services, the compass navigation sequence standard construction content.” Liu Jingnan said that after the adoption of the international industry certification standards, will become the compass in the field of smart phones with high precision positioning and navigation to the market and then to the world’s pass”. It is reported that the Wuhan navigation Institute of Wuhan dream core technology Co., Ltd. has successfully developed a high precision mobile phone with compass navigation chip last year, this year has been large-scale production, the market is about to put on the market. That is to say, is similar to the current commonly used American satellite navigation system GPS (global positioning system, GPS (Global Positioning System), perhaps soon, Beidou navigation system will also become the worldwide smartphone standard.

China’s independent research and development of high-precision satellite positioning system – the Beidou navigation system, is the international third satellite positioning system (the first two are the United States of America’s GPS and Russia’s GLONASS). Surveying said: a global satellite navigation system Beidou “by 2020 will be built, the standard positioning service accuracy can be better than 10 meters, high precision enhancement service positioning accuracy can reach meter level even Yami level, will be a financial global standard service and the multimode region enhanced services in one of the satellite navigation system. Compass also provides 120 Chinese characters short message communication services, authorized to achieve interoperability with the Internet and mobile internet”.

Currently, the Big Dipper mass application market is mainly concentrated in the mobile phone location services and vehicle applications two major market segments. At present, the market of our country is still in the standard application start-up period in the future, the compass application market share will be the largest. Data also show that from a global perspective, the personal terminal and vehicle navigation satellite navigation market accounted for more than 60% of the market.

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According to foreign media reports, Apple this week adopted a new patent, the patent shows Apple is developing a support ForceTouch Mac keyboard touch technology.

The patent by the US Patent and Trademark Office approach, patent No. No.9178509, the patent entitled “ultra-low key way Keyboard”, the patent Apple in September 2012 filed the first patent inventors Jeffrey T.Bernstein. The keyboard principle described in this patent is similar to Apple’s prior Force Touch touch technology, but a lot of large size. Under each physical button is equipped a pressure sensor, a pressure sensor is located beneath the key cap, the actuator can generate tactile feedback.

Apple patent describes an integrated similar Force Touch touch technology, without the use of any full-size QWERTY keyboard key axis. This patented keyboard After removing the mechanical key axis, can reduce the height of the keyboard a few millimeters, the future wants to help Apple build size thinner MacBook products.

The best hardware input conditions include a resistive sensor, strain gauge and capacitive sensors, and also includes other components can detect the user presses the button, the intensity, and sends a signal to the computer’s processor. At the same time, the sensor can detect a slight change in the distance, and set the system to provide a high platform to get different input levels.

The other key component is the actuator, can achieve transmission piezoelectric material, when the bottom of the piezoelectric material to obtain mechanical power can be turned into a mechanical strain from the application field. The use of these unique electrical characteristics, ForceTouch meet similar needs.

In the process of entering, by pressing the keyboard’s different specific signal intensity through output, including embedded pressure sensor. In determining the user presses the intensity, the keyboard controller will receive the signal and further processing. Then the keyboard will simulate a user clicks through different intensity of different mechanical keyboard feel, and cooperate with the transmission system.

For the detection of different size pressing efforts, coupled with the Apple keyboard, and supporting software to make a key corresponding to a variety of operations. For example, applying the key “A” force the size of the first one, will enter the “A”, the second the size of the force would trigger a system command or other functions. This process is similar to the 3D Touch technology on the iPhone 6s, allowing the user to achieve the Preview, Quick Start and other functions through different intensity.

It is unclear whether Apple will launch today, based on the patented Force Touch keyboard, but do not find evidence of Apple in the development of related hardware and software.

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