IBM storage experts believe further depth enterprise flash applications, application data from the small stage Tier0 began to shift to the Tier1 application patterns, SSD applications and virtualization capabilities begin to integrate, but also interfacing existing storage products, will drive more business with full flash storage array that has been adopted by even full adoption.

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10 years ago, IBM sold the entire PC division last turn X86 server business selling products to the store the other hand, it is willing to invest heavily hit, when the storage industry have launched many mixed-type storage devices, IBM pioneered betting the flash memory body market, IBM Greater China recently cum technology systems Business Unit of flash memory storage solutions to solve the technical director Xu original units, exposing IBM flash memory market development strategy.

Xu original thought, application-level enterprise flash technology will push up one level up, began to shift from small data applications Tier0 stage to Tier1 application patterns, Tier1 application integration stage virtualization capabilities, can interfacing existing storage products, expect more companies will start using full-flash storage array, it will further the adoption of a comprehensive enterprise adoption.

IBM acquired in 2012 TMS (Texas Memory Systems) after the introduction of the all flash product line FlashSystem, the All-flash storage market, every year big action announced $ 1 billion will be invested, in addition to the development of new flash memory technology, flash memory technical entire body and to existing product lines among other also plans to set up 12 research centers of flash memory, providing enterprise product testing environment.

Flash memory research center to help customers do the actual testing environment and application evaluation, and based on different sizes and patterns to provide business support, including hardware and software, test tools, technical support and professional and technical personnel, accelerate business importing and applications, in addition, IBM also be opened for 600 API for independent developers to use.

Last year, IBM branched out into software-defined storage (SDS), the introduction of flexible expansion of storage software (Elastic Storage), and the layout of flash storage products for enterprise tier0, tier1 application requirements, were introduced IBM FlashSystem 840 and two IBM FlashSystem V840 section full flash storage array.

Xu Yuan said that although flash technology has emerged in 1978, but the technology has not yet reached a mature stage technology and applications, has been to the last two, three years, the price dropped to a certain extent, flash memory was really ready to enter the application stage, the first to be applied to specific applications such as networking, and now even traditional data centers have begun to use flash technology, he believes the market in flash storage technology is a disruptive innovation.

IBM has introduced in the last year of FlashSystem 840 and IBM FlashSystem V840 two full flash storage arrays, FlashSystem 840 can be optimized for the data center, the performance compared to the previous generation of products FlashSystem 820, the new system has doubled, reaching 1.1 million IOPS , nearly twice the bandwidth upgrade also for database analysis, virtualized infrastructure and public cloud and private cloud.

And FlashSystem V840 is the integration of the storage device virtualization system SVC (SAN Volume Controller), energy storage device resources for a single point of control, but also has compression, replication, automated tiered storage and on-demand resource allocation and other functions.

SVC can upgrade the existing storage facilities and the availability of additional storage devices, including the ability to deploy traditional disk in a decentralized environment, and can be standardized function virtualization storage devices. Xu Yuan said, because many corporate customers want to have additional functions, such as high-availability solutions, tiered division, compression, storage and other needs, these software functions and to FlashSystem V840 the whole solution, but this whole fast flash storage devices within the next year will be one of the main thrust of the solution.

Taiwan IBM Systems Technology Group at the Information Technology cum Associate Que Zhiming said that before storage equipment import, business users can be simulated by means of improving the effectiveness of the device after the import situation and estimate the overall effectiveness of the verification phase, in addition, IBM is also providing TCO analysis tools to help customers estimate the total cost of ownership is reduced amplitudes.

Que Zhiming also said that all storage devices have higher-order, in-order, low-order points, once the business users understand the positioning of each storage device, will be able to meet the economical way to appropriate storage device placed in the appropriate location, to maximize benefits. And he believes that companies need to consider when taking into account the storage trends, including optimization, software-defined storage, big data applications, they can be used all-flash storage solutions arrays.

He mentioned, FlashSystem 840 for enterprise application requirements for tier0, companies using flash memory to strengthen the effectiveness and shorten batch analysis time, or for database, ERP and other systems, the Flash as a cache applications, while FlashSystem V840 is for more complex enterprise IT environment, integrating virtualization products, storage devices can be integrated both functions are no longer just a cache of strengthening it, but also for the storage of flash storage devices, with the virtualization approach to interfacing different products in a storage pool for system use.

Although FlashSystem 840 and FlashSystem V840 has been launched for some time, but Taiwan’s science and technology at IBM System cum business associate, said Chen Zhirong, started businesses lack a reference case, the whole flash storage device is not fully understood, after this year with customers after the run-in and accumulated practical experience, business users now Taiwan market has begun to experience the advantages of flash storage applications, and can not affect that many restructuring the situation, greatly enhance the effectiveness of the storage device.

He also revealed that there are currently three major brokerages two import flash storage devices, other home also includes bankers, manufacturing, telecommunications, government agencies, and so the case has been imported, you can see the flash storage devices have now been more customer acceptance, companies began to expand the use of the scale. He also said, IBM will focus on tier1 future applications, providing both an all flash storage device core solution.

December 18 morning news, big-screen phones are now so good, but also to the Tablet PC to do? Even Apple’s iPad sales are beginning to fell (IDC expects iPad sales fell 12.7 percent), the tablet market there hope?

In the recently held “2014 Intel commercial flatbed media communication”, the assistant vice president of IDC China industry research and consulting services, said Wu Lianfeng, the overall global tablet market, especially flat consumption growth slowed sharply indeed, in the past few years at every turn double drop into the single digits, but the decline in the market is not all, commercial flat growth is still very strong.

In Wu Lianfeng seems flat to maintain strong growth in the commercial core of three reasons:

- From a macro perspective, cloud computing, big data, mobile, social, and the third among the mobile platform and the perception that the future will be extended to the endless intelligent edge. So with the mobile-related products and services with smart phones, tablet-related will have a good future growth.

Two smart phones for business solutions have a lot of deficiencies. (AD7401)”Mobile phone for business, then the screen is too small; secondly it is safe, especially for time industrial applications, security is still relatively poor; the third is the performance of the phone is still worse than the flat; Fourth, compatibility, some office software or enterprise class application compatibility will be relatively poor. ”

Third, the Tablet PC in the business which will have a lot of advantages.(surt5000xlt) From the user’s point of view, close to half of the CIO believes big screen to facilitate business processes; more on performance flat enough to support commercial office, if it is, then the x86 architecture, with existing business applications will be good overall compatibility; tablet can be directly industry custom made, and these are the phone difficult to do.

Wu lianfeng In his speech, also described IDC for the future development trend of commercial flat-panel market.

First, the style will be personalized, will be more numerous, the entire tablet style will be more; the second, from the operating system, the future is in the three pillars of the situation; and third, the next tablet peripheral devices will become more and more abundant; fourth, industry solutions will be stimulated; fifth, security management will become increasingly important; sixth, commercial pricing model innovation.

The Infineon RGB LED Lighting Shield for Arduino is equipped with the microcontroller XMC1202 that has a Brightness Color Control Unit (BCCU) for the LED lighting control. The Shield for high current DC motor controllers for Arduino uses the high current half-bridge driver NovalithIC BTN8982TA.

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The RGB LED Lighting Shield with XMC1202

The module for RGB LED lighting enables the control of different LED light sources. It has three independent output channels for flicker control of multi-colored LEDs. The Shield is based on the microcontrollers XMC1202 from the XMC1200 series. This series provides, inter alia, the complete dimming control and flicker-free light over all Dimmungsstufen. Expand the shield can be a DMX communication interface for integration with lighting and audio systems. Also possible is the combination with a 24 GHz radar sensor, for example for motion detection.

DC Motor Control Shield with BTN8982TA

This Shield is half-bridge and full-bridge designs can be evaluated. It can drive two DC motors unidirectional or bidirectional DC motor. Fitted is the shield with two fully integrated high current half-bridge drivers for motor control of the type NovalithIC BTN8982TA. This combines three integrated circuits in a single package: two power ICs (a P-channel high-side MOSFET and an N-channel low-side MOSFET) and an integrated driver IC with a logic circuit for the power control and their monitoring. Other features include diagnostic functions such as current measurement, adjustability of the slew rate, dead-time generation and protection functions at overtemperature, undervoltage, overcurrent and short circuit.

The Novalith IC BTN8982TA is ideal for secure high-current PWM motor drives, which should be as small as possible and supports high-frequency pulse width modulation, for example, up to 30 kHz. Brushed DC motors can be operated up to 250 W continuous power (eg 12 V / 20 A). The current limitation of BTN8982TA can peak currents up to 55 A.

Until the end of January 2015, the two Shields Farnell Newark element14 and element14 are to relate. Then the two Arduino Shields will also be available by Infineon and its distributors.

Advanced semiconductor giant to increase its investment process, Intel, Samsung, TSMC (2330) three strong capital spending continues to increase in the density of semiconductor devices, TSMC capital spending this year has been the point of view of billions of dollars more foreign investment is estimated TSMC capital spending next year will skyrocketed to $ 12 billion.

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SEMI (Semiconductor Equipment and Materials International Association) has issued the report pointed out that next year the global semiconductor manufacturing equipment market will continue to grow by 15.2 percent year came to $ 44 billion. The Taiwan semiconductor equipment spending, will also be five consecutive years ranked highest in the world.

SEMI estimates that this year the global semiconductor equipment market will reach $ 38 billion, representing a growth of 19.3 percent last year. Where all kinds of wafer fabrication equipment machine is still the highest revenue contribution blocks. SEMI estimates, this year’s wafer fabrication machine market size will grow by 17.8 percent, reaching $ 29.9 billion; packaging equipment market is forecast to increase by 30.6%, amounting to $ 3,000,000,000; semiconductor test equipment market is expected to grow 26.5% this year to $ 3.4 billion dollar; other product categories (including fab equipment, mask and wafer manufacturing equipment, etc.), this year the market is estimated by 14.8%.

In terms of regional markets distinction this year in Taiwan, South Korea and North America is still the largest semiconductor equipment capital spending areas. According to SEMI estimates that semiconductor equipment sales to Taiwan next year is still forecast to grow 28.1 percent to reach $ 12.3 billion, for five consecutive years ranked the world’s largest market.

Caoshi Wong, president of SEMI Taiwan, said Taiwan’s investment in semiconductor foundry, packaging and testing memory and drive manufacturers, continued steady growth, will further strengthen Taiwan’s leading position in the global semiconductor industry.

2014 is the DRAM industry is quite profitable harvest year. Benefit from the global smart phone continued selling tier DRAM makers have switched were acting memory; TrendForce’s memory storage career at DRAMeXchange estimates that 2014 action-type memory DRAM will account for 36% of overall output, 2015 a chance to break 40 percent mark.

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DRAMeXchange research associate Zuo Guo Rong said that, thanks to robust demand action type memory, thanks to the standard output relative reduction in memory, but let module prices has remained at high level, the 2014 average price of about $ 32 4GB modules, standard memory body average gross margin of 40%. Each DRAM makers toward comprehensive profit status, oligopoly market structure and market changes in the demand side will affect the future development of the DRAM industry in 2015.

DRAMeXchange forecast 2015 five DRAM industry market trends as follows:

(1) DRAM slowdown but the plants begin to profit as a priority

DRAM industry into oligopoly market structure, the only three DRAM makers begin to profit-oriented as a priority, carefully controlled to adjust the output and product categories, together with the global smart phone continues to maintain high growth, also allows capacity to action formula memory, squeezed into the output standard memory, so the standard memory market prices remain high water level, has become a cash cow DRAM factory, so the profit to produce dazzling aspects transcripts. DRAMeXchange DRAM estimated 2015 output value will reach $ 54.1 billion, the annual growth of 16% profit growth for the market to stabilize the year.

(2) Samsung and SK Hynix Jie new plant completed, depending on market demand dynamically adjust production capacity

Samsung (Samsung) and SK Hynix (Hynix) coincidentally announced in 2014 to expand the new plant in the news, capacity competition resurgence of rumors flying around, but DRAMeXchange pointed out that, in fact, Samsung, while the expansion of Line17′s, Line16 DRAM production capacity has quietly reduced and return NAND Division to use. And SK Hynix M14 is expected to vote next year in the fourth quarter only a small amount of pieces, large-scale investment pieces will only emerge in 2016.

Overall, DRAMeXchange that because the market demand will continue to grow, but rather to build for the future factory needs, just cast film output is planned, and the subsequent price decline quarter by quarter, although it will, but as long as the process turn into a continuous basis, DRAM makers are still able to maintain profitability in the current water level.

(3) action type memory leapt mainstream, LPDDR4 coming next year

2014 smart phone into the parity of the many low-cost high-regulation models in the global market to conquer new territories, so that emerging market set off a wave of replacement smart phones. Zuo Guo Rong said that in the smart phone market constantly expanding, 2015 action-type memory is also close to 40% market share of the global market, accounting for 27% compared to standard memory, action-type memory has risen to global DRAM market mainstream products.

On the other hand, the action type of memory do observed in 2015 is still the mainstream specifications LPDDR3, output amounted to more than 60%, while the first application of the new specifications LPDDR4 flagship smartphone models in the next year, regardless of the power saving mechanism with the clock surpassed LPDDR3, expected in 2015 will reach 15% market share.

(4) 20nm become the main battlefield, but the increase in capital spending will make the process turn into slowing down

Korean series 25nm process DRAM plant in the second half of 2014 has entered the mature stage, regardless of the size of yield and cast films have become the mainstream DRAM specifications. As for the 20nm process, Samsung has entered the validation phase, SK Hynix is expected to enter the market in the second start of the season next year; in contrast, Micron (Micron) is currently planning only Inotera have 20nm process of standard memory, turn into progress compared with the two Korean factory behind the goal by the end of 2015 to reach 80K cast films.

DRAMeXchange said that, due to enter the 20nm process needs more equipment to produce, implies the need for more capital spending, however, profit-oriented, the proportion of the plants turn into 20nm process will be slowed down.

(5) by the end of 2015 with DDR4 server market share is expected to exceed 50% mark

In the full cooperation of Intel (Intel) and a strong leading DRAM factory, DDR4 memory will be the first cut in the server field. Guo Rong Zuo said server memory in addition to stability requirements, but more recently inked both low voltage and speed. According to JEDEC specification, DDR4 voltage only 1.2V, the future rate can be as high 3200Mhz. The price is also working with the server part with DDR3 gradually close, DRAMeXchange expected DDR4 fastest at the end of 2015 to replace DDR3, memory became mainstream server market.

Recently, Marvell has released two ARM Cortex A53 equipped with 64-bit CPU architecture 5 die 4G LTE SoC, for high-performance smart phones and tablet PC market. Both products are PXA1908 and PXA1936.

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According to vice president of global MARVELL, Lee, managing director of China Chunchao perform introduction, PXA1936 for 8-core products, used in all eight core ARM Cortex A53, clock frequency 1.5GHz (PXA1936 Pro frequency of 1.8GHz), provides advanced graphics and security function, high-performance image processing capabilities, support for 13 million to 16 million pixels pixels camera, support for 1080p video decoding and display, SensorHub function and improve usability.

PXA1908 four core products, the clock frequency of 1.2GHz (PXA1908 Pro frequency of 1.5GHz), enhanced image processing capabilities, support for 800-megapixel camera, support 720 display, using advanced power management, with a mature DSDS 5-mode modem software.

PXA1908 and PXA1936 fully compatible with the software, so that the OEM and ODM manufacturers to quickly and seamlessly launch a high-performance mobile phone or tablet. Both products support the current popular wireless protocols to meet TD-LTE, FDD-LTE, TD-SCDMA, WCDMA and GSM wireless communications technology.

Following Apple A7 processor on the market more and more mobile phone chip makers began publishing 64 products, such as Qualcomm Snapdragon 610 and 615, 808 and 810 Xiaolong, MediaTek MT6732 and 6752, Samsung Exynos5433. MARVELL now also released 64 products. The second half of 2015 is expected to 64 smart phones is expected to appear in large numbers on the market.

Your phone battery died, but no mobile power how to do? Plan V portable charger can charge the phone directly with ordinary 9-volt batteries.

It is reported that the battery problem always plagued all smart phone users, when we bring in the full enjoyment of the smartphone game, work and social benefits, such as when the phone is always to face the lack of electricity around to look for the power supply. And more and more of the mobile power products have appeared on the market, has become a very popular mobile phone accessories field. Today we bring is a portable charger called Plan V, it can make the case that you do not have to move at the same time the power of the battery died, ordinary batteries that can charge the phone.

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Plan V usually do when you can be hung on a keychain, weighs only 7 grams, which itself does not store electricity, but by 9 volt batteries available in the market for mobile phone charging. Let the Plan V role to play, you have to like it first launched U disk connected to the phone, and then come up with 1-2 9-volt battery mounted on the connection point, so start charging the phone. It is not a savior, but let the phone to get a few hours of talk time and that there is no problem.

Plan V of Flintu development company said a 9V battery provides enough power for 4 hours talk Samsung Galaxy S5 or iPhone 5, in addition to note is that, Plan V being only micro-USB version, and supports the iPhone version will have to use the Lightning wait until the target amount was set before committing to the development.

For automotive camera applications involving digital image sensor supply various design elements. In rain, snow, fog, and other difficult driving conditions, high levels of image quality is essential. Car driver when reversing the degree of dependence on technology is much higher than visual inspection. If a low-noise analog power rail demand, efficiency and size and other major design elements can not be optimized, then the operation in good weather conditions may not be a good solution for harsh weather conditions.

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Design Elements

For automotive camera applications involving digital image sensor supply various design elements. Image quality is an important indicator of whether the application can be profitable class. In rain, snow, fog, and other difficult driving conditions, high levels of image quality is essential. Car driver when reversing the degree of dependence on technology is much higher than visual inspection. If a low-noise analog power rail demand, efficiency and size and other major design elements can not be optimized, then the operation in good weather conditions may not be a good solution for harsh weather conditions.

Advanced Driver Assistance Systems

For example, AptinaAR0132 is a universal sensor with 1.2 million pixels and and 720p60 resolution, support for high dynamic range imaging for automotive advanced driver assistance systems (ADAS) and the surrounding view / parking assist camera applications. Where the kernel (VDD) and I / O section (VDD_IO) require 1.8V voltage, analog part (VAA, VAA_PIX and VDD_PLL) require 2.8V voltage. Obviously, the analog portion of the chip is more easily affected by power line noise. Many designs use a low dropout regulator (LDO) will be downconverted all power from the 5V input rail.

Design goals

The overall objective is to provide a practical embodiment of the power supply system for AR0132AT image sensor, it successfully integrated into automotive applications and packages. Although the details of the other sensors and systems may be different, but the principles discussed in this paper have general applicability.

Size of the image sensor is very important because it must be incorporated into 25 mm cube in which the overall efficiency and good thermal management make high demands. Despite having a low noise LDO output, but its power consumption is high, will the image sensor heating, resulting in adverse effects, so the 25 mm cube in the work is not satisfactory.

Power switching power supply solutions is much lower, but with higher output ripple and noise in nature. In implementing the switching power supply solutions that require additional attention to its image sensor analog input noise power supply rail (ripple) sensitivity.

Design Process

Is designed for image sensor capable of efficient power supply system, it is necessary to know the sensor sensitivity level and switching power supply ripple output in order to take appropriate steps to ripple design on the sensor supply rail drops below the threshold degradation.

To protect electronic assemblies assembly-friendly, safe and virtually designed housing are needed. However, users also require user editing capabilities.

The wide range of applications for housing for electronic modules, modules and functional units requires some important properties. These are primarily the protection from negative influences such as moisture, dirt, dust or electromagnetic radiation, but also other functional properties such as easy assembly of electronic components, adaptive and robust construction, durability, and a modern and graceful design.

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In addition to these factors, the efficiency of the housing used plays an important role. Because only at a fair market price find a modern design, functional and efficient housing their way into industrial applications.

Proven manufacturing processes and suitable material

Considering many of the above features, so provide for the housing construction in some materials. In addition to the already long-established materials such as plastic and aluminum steel is more often used in the case construction. Mainly by manufacturing processes such as extrusion, many of the housing units and components in the form of aluminum profiles in various, complex geometries and contours can be produced inexpensively. In addition, eliminating the need for additional post-processing of the extruded profiles, by adhering to the tight tolerances in the extrusion process.

The design of the housing AKG series consists of two extruded aluminum this half-shell profiles, which form a tube with a special tongue and groove system assembled and installed by frontally bolted cover plates. The many forms of housing profiles enable various functionalities such as wall and ceiling mounting with integrated brackets, mounting rails by special brackets, improved cooling of electronic components, thanks to built-in cooling fins and, not least, an elegant outer appearance, which is realized with plastic design elements.

The integration of circuit boards or electronic components in a closed housing is particularly problematic when these are fitted with connectors on multiple pages, displays and switches, and must be passed through openings in the housing wall or the cover plate to the outside. For such applications, the housing GD series was developed, which is characterized by a particularly installation-friendly design and various functional properties.

Easy installation thanks to slide-in cover plate

The open-sided, U-shaped housing sections have built-in guide grooves for receiving electronic components or circuit boards and retractable cover sheets, which can be varied in thickness and thus the stability. By mechanical machining of the cover plates of the receiving devices such as LCDs, the connector or switch is enabled, which are then inserted together with the circuit board in the housing profile.

The fixation of the cover plate is carried by the front and back covers with inner shadow gaps which compensate not only the manufacturing tolerances, but also prevent deflection of the cover plate. For applications with a high heat release said cover sheets can be replaced by an adjusted by milling heat sink for cooling of electronics.

The case series GD is default black or anodised available in four different widths and six length variants, as well as in the finishes. The special geometry of the housing profile allows the recording of membrane switches or front panels. In addition to the standard versions, the housing may machined to customer, be surface treated and printed.