Due to the impact of Apple to Samsung, Samsung this year and only iPhone 6/6 Plus processing chip – that’s 30% A8 production orders. For Samsung had a monopoly on the iPhone processing chip, the share fell so heavily is clearly inconsistent with the company’s development strategy, so they want him next year in A9 chip get more benefits. Wei Feng network news, according to South Korean media reports, Samsung has recently issued a hint of the upcoming production A9 chip.

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Reported that the executives in charge of Samsung’s semiconductor business, Kim Ki-nam told the media that they were about to apple production 14 nm processors, and 14 nm is rumored A9 chip production process. This statement is also considered Samsung has solved the 14-nanometer process among yield problems. Kim Ki-nam said Samsung’s earnings will get a substantial growth through A9 orders. The current A8 chip production orders were from Taiwan Semiconductor Manufacturing Co. (TSMC) accounted for 70% of the share.

TSMC has issued an official press release a few days ago, claiming that its third-quarter profit growth in 2014 could reach a record 47%, the main reason is iPhone 6/6 Plus popular on a global scale. I believe this news, Samsung also makes very jealous, because a major supplier A series chip was originally them. In addition, there is news that the list of suppliers A9 chip will only Samsung and TSMC.

2014 LTPS TFT LCD panel shipments into the area and only 56% of capacity, which means that many of the existing production LTPS panel makers are still improving efficiency, improve product yield and LTPS panel space quality stability. LTPS panel will present five future development trends: First 2017 LTPS TFT LCD production capacity will reach 12.2 million square meters, a substantial increase of 66% compared to 2014; Second LTPS TFT LCD capacity utilization is generally 75% to 85%; Third, LTPS TFT LCD demand from 2014′s 3.1 million square meters in 2017 to grow to 6.4 million square meters; Fourth LTPS panel area shipments in 2014 accounted for only the actual input capacity of 56%, in 2015 this proportion increased to 60% , 2016 and 2017 will remain at 62%, which indicates that the area of ​​conversion LTPS panel production capacity and shipments are still gaps between; Fifth LTPS LCD panel will continue to face high-resolution amorphous silicon, Oxide and AMOLED panels competition.

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With panel makers, especially in mainland China panel makers to actively invest LTPS TFT LCD (low-temperature polysilicon thin film transistor liquid crystal display panel) new plant to supply the smart phone panels, many people have begun to worry LTPS TFT LCD will supply surplus, thus affecting smartphone panel the whole supply chain. For some new vendors, LTPS panel plant operational efficiency and yield is the need to solve a big problem.

NPD DisplaySearch consider the following points will pose a threat to the market for LTPS TFT LCD panel demand:

First, amorphous silicon (a-Si) TFT LCD technology and technology continues to challenge the limits, and continue to make breakthroughs. For example, currently has a-Si TFT LCD mass production 300PPI (such as 4.7 inches 1280 × 720) smartphones panel. Many panel makers are actively developing amorphous silicon (a-Si) TFT LCD technology to produce 5.0 inches Full HD (1920 × 1080) of the panel. A few years ago on a-Si (amorphous silicon) can not do 300PPI more products this argument has been broken by advances in technology. Panel makers are still constantly challenging technical limitations of a-Si. Long time compared with the LTPS technology, a-Si is undoubtedly the most cost-effective option.

Second, the oxide (Oxide), also known as indium gallium zinc oxide (IGZO), is also actively expanding in the smart phone market share share. Which Xiapuyou is aggressively expanding the use of Oxide technology in smart handheld devices, and with greater capacity 8th generation panel production line.

Third, actively promote the Samsung AMOLED display screen technology, the color is stronger than LCD. Samsung AMOLED display overcapacity enormous pressure, and therefore are actively looking for more external customers to consume capacity. Generally, if the screen size and resolution of the same panel of smart phones, AMOLED LCD panels and more than 10% to 15% premium. But Samsung display are more flexible to adjust its AMOLED panel premium, especially in the Chinese market, hoping to expand the AMOLED panel shipments reached purposes.

Fourth, the world’s largest user of LTPS panel is Apple iPhone. Except in special LTPS specifications Apple used, the remaining majority of LTPS TFT LCD panel is using a smart phone manufacturers in mainland China. Chinese mainland smart phone manufacturers adopt a “high standard, low price” business strategy, leading panel makers had to endure tremendous downward pressure on prices. Downward pressure on prices may be greater LTPS panel aspect, because it’s the average price is higher than the a-Si TFT LCD panel.

Things to bring all things Internet, machine-to-machine all kinds of new possibilities, wisdom, control, data acquisition, intelligence systems, but also to many individuals, startups or major companies began to develop innovative products in order to obtain consumer of all ages, it also means that things are a huge disruptive market.

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According to IDC research predicts that in 2020 there will be 30 billion networked devices, the market revenue will reach 7.1 trillion dollars in size, and now its application has been all over the retail, transportation, health care, industrial manufacturing and other industries. Things diversified development, but also to various technology giants competing to invest, to launch a variety of solutions or alliances. In order to simplify and accelerate the deployment of Things output devices, ARM has also announced the launch of the new software platform ARM mbed IoT Device Platform and mbed OS operating system.

Among them, ARM mbed platform for networking devices are particularly sensitive to energy consumption and pricing Things device design, which combines Internet protocol, information security and standardized management, and also has mbed hardware and software ecosystem as a backup, so that new committed to the development of enterprises to create differentiated product features. Krisztian Flautner networking business unit general manager, ARM pointed out, there are still many things device in isolation is not linked, it is difficult to imagine that all devices can communicate in a truly comprehensive link to the world, and mbed platform to solve this problem. mbed platform provides a common set of communication transmission and management tool suite can be applied to a variety of purposes.

The mbed OS is based on the ARM Cortex-M processor designed operating system, which supports all major standards, including Bluetooth Smart, Thread, Wi-Fi, 2G, 3G, CDMA communication technology. ARM also stressed that will expand its ecosystem through open standards, allowing businesses to more quickly access large networking markets. ARM mbed OS will begin offering in the fourth quarter as the initial development partners, is expected in 2015 the first batch of devices using mbed OS will come out.

U.S. sapphire materials suppliers and equipment manufacturers a very special advanced (GT Advanced Technologies) on October 6 suddenly filed for bankruptcy protection. As at September 29, 2014, still holds a very special advanced $ 85 million in cash. A $ 578 million supply agreement signed with Apple basis before, very special need to provide a certain number of advanced sapphire crystal rod to give Apple, but because of the long grain yield as expected, Apple unwilling to continue to pay the remaining money; plus pole Sapphire Dan Changjing with special advanced drilling equipment factory Xin Jing dispute lawsuit against Taiwan, the amount of equipment needed to return $ 24 million to Xin crystal diamond, cash-strapped cause problems.

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TrendForce’s green energy career at LEDinside observation pointed out that the results actually tracked. Despite the very special advanced with nearly 2,000 crystal growth furnace production capacity to 5.5-inch iPhone 6 Plus Size converter, capable of providing 1,000 ten thousand sapphire protection panel, but due to a very special advanced crystal growth rate while maintaining good at four percent, plus processed into a situation from ingot yield sapphire segment protection panel can not be overcome, the cause can not be imported sapphire protection panel iPhone this year two new machines, but most especially the two companies advanced and Apple also abolished many employees to this project responsible for.

LEDinside said sapphire protection panel will be Apple’s competitors to differentiate important expression. Because Apple has invested a lot of money and patent applications in the layout sapphire protection panel to protect the lens from the camera on the iPhone, Home key to Apple Watch table covers are introduced one by one sapphire glass, sapphire protective panel therefore not impossible to import the iPhone OK, but still needs time to overcome. If all goes well, perhaps equipped with sapphire iPhone protection panel have the opportunity to debut at the end of 2015.

Road iPhone sapphire protection panel listed, still need to overcome three major obstacles

1 long crystal production capacity:

Sapphire protective panel in the supply chain into consideration crystal growth technology can not be ignored. Traditional suppliers such as KY law Monocrystal, Rubicon, Harbin Institute of Technology, Taiwan companies such as poly photovoltaic technology is more skilled, higher product yield, but requires a lot of skilled long-grain division to produce poor mass production. KY law currently able to do more than 90 kg class is only a small number of vendors. The product life cycle is short and the need for mass production of mobile phone industry, there are still a considerable number of threshold to overcome, and therefore had no choice supplier of Apple and more KY law camp.

On the other hand, HEM crystal growth method is very special claim to its high degree of advanced crystal growth furnace automation equipment, and can grow more than 200 kg of single crystal sapphire, very adaptable to mass production, which is the beginning of the selected pole Apple the main reason special advanced cooperation. However HEM France very special product yield is much lower than claimed by the advanced level, it seems that still takes time to overcome technical obstacles. For Apple, if you want to continue future development of sapphire protection panel, you must have enough ingot sources. Currently HEM method and KY France, VHGF law sapphire suppliers have switched certified, so Apple will continue to increase in the future to avoid ingot supplier shortage. Sapphire Dan Changjing for both experienced vendors will have the opportunity to increase the supply of apples, or even get a stable agreement.

2 Cost Capacity:

Currently the size of 5.5 inches, the production cost of sapphire panel thickness of 500 um, at least more than $ 60, for a sell US $ 859 the iPhone 6 Plus, it just costs sapphire protective panels accounted for 7% of the price of the phone. Therefore, how to reduce the cost will be very important topic. Despite boasts a very special advanced laser cutting technology, the sapphire substrate can be thinned and then to fit the traditional tempered glass processing, can reduce the cost of sapphire protection panel, but now it seems that the technology is still some distance away from mass production, is there a more appropriate technology to reduce costs need to do to observe the future.

After processing capacity of 3 segments:

Sapphire protection panel is not simply the sole responsibility of the advent of long-grain plants, as well as cutting and grinding and polishing after the segment, coatings, mimeograph and other processes. Especially in the Cutting and polishing of processing, hard and difficult because of the sapphire substrate material processing, but at the same time there is the problem of fragile, so the segment processing firms also need to actively look for ways to identify with a mass production process in nature.

TSMC announced the 29th leading the field of integrated circuit manufacturing services, the introduction of the industry’s most comprehensive ultra low-power technology platform for the needs of a wide range of technical support and because fast-growing networking and wearable device market to provide the necessary technology to meet market diversification product applications. TSMC said through this technology platform provides a number of process technology to significantly enhance the power advantage to support networking and wearable products, but also provide a complete design ecological environment and accelerate customers’ time to market.

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TSMC said a combination of ultra-low-power process in addition to covering the current 0.18-micron low-leakage process (0.18eLL), 90 nm ultra low leakage process (90uLL) and 16 nm FinFET process, but extended to the new 55 nm ultra-low-power process (55ULP), 40 nm ultra-low-power process (40ULP) and ultra-low-power 28 nm process (28ULP) to support operation at speeds up to 1.2GHz of applications. This covers the 0.18-micron to 16 nm FinFET ultra-low-power process with a combination of energy efficiency for a variety of intelligent networking and wearable products.

Among them, 0.18-micron to 40-nanometer manufacturing process ultra-low power consumption also have the RF and embedded flash memory function, can make system-level integration to effectively reduce the size of the appearance, and by wireless transmission technology product series of things. And compared to the previous generation of low-power process, ultra-low-power process to be able to further reduce the operating voltage up to 20-30%, in order to reduce dynamic and static power consumption, while significantly prolong things and wearable product compact size battery life up to 2-10 times.

Cum co-CEO Dr. Liu Deyin TSMC general manager, said ultra-low power consumption and ubiquitous link function is the key to the success of things, the successful launch of a comprehensive industry-leading technology platform to effectively meet the needs of diverse and innovative networking market . This combination of technologies for a wide range of companies in emerging markets to offer, demonstrated technology leadership and commitment to bring customers the greatest value and help customers build competitive products, the success in winning design cooperation.

In addition, TSMC stressed that customer use of “open innovation platform” provided by both IP Design ecological environment is an important value ultra-low-power technology platform company extra to offer. When the chip designers to new ultra-low-power process design, can be easily re-use the company’s low-power process Silicon Intellectual Property and component database, designed to improve the probability that the first production of successful products to market quickly and achieve goals .

TSMC is expected in 2014 with customers in 55 nm process ultra-low power, ultra-low-power 40-nanometer manufacturing process and ultra-low-power 28 nm process reached a preliminary cooperation in a number of case design and put into trial production in 2015.

Mentor Graphics Corporation today announced that based on TSMC (TSMC) SPICE simulation tool certification program, Analog FastSPICE (AFS ™) platform (including AFS Mega and Eldo®) adopted a 16nm FinFET + V0.9 certification process technology. V1.0 certification is underway and will be completed in November 2014.

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“Mentor’s Analog FastSPICE platform, AFS Mega and Eldo has successfully reached the 16nm FinFET + technical accuracy and compatibility requirements. Using TSMC 16nm FinFET + technology, customers can be very competitive design through accurate verification solution,” TSMC design senior director of marketing infrastructure Lee Suk said.

Analog FastSPICE platform for nanometer analog, radio frequency (RF), mixed signal, memory and custom digital circuits for rapid circuit verification. For larger circuits, AFS platform also provides high-capacity, high-speed mixed-signal simulation, including the industry’s only comprehensive full-spectrum device noise analysis. Memory and other array-based circuit for, AFS Mega-based “Silicon accurate” simulation.

“In partnership with TSMC, we on the Analog FastSPICE, AFS Mega and Eldo conducted TSMC’s 16nm FinFET + certification, which is another important milestone,” AMS Mentor company DSM department to verify Ravi Subramanian, general manager said. “Through continued close collaboration with TSMC, we will ensure that our joint customers can meet the most complex and highest degree of integration of nano nano analog, mixed-signal and RF design requirements verification platform.”

Mentor Graphics Calibre® and Olympus-SoC ™ platform also passed TSMC’s 16nm FinFET + certification process technology. Olympus-SoC product supports TSMC’s 16nm FinFET + design rules, to provide pin connection, low-voltage wiring to improve and advanced timing closure function, and also supports MCMM optimization. Calibre xACT ™ series of products for long runtime and accuracy improved, so our joint customers can more fully utilize TSMC’s 16nm FinFET + technology.

2014 for the IC industry is not quiet year, the largest industry in the last decade to support policies formally introduced this year, the level of capital acquisitions demonstrate unprecedented vigor, but carding industry performance of the company found that corporate profits are still many structural problems imbalance, packaging and testing enterprise performance leader, and the design enterprises either mediocre or decline in performance, to some extent reflects the current IC industry problems.

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Daily News revealed that, A shares 13 IC companies, a total of six grew to maintain performance, including Taiji Industry, Long Point Technology, Nantong Fujitsu Microelectronics three companies net profit growth of more than 100 percent year on year. Beijing Jun, Shanghai Belling three national technology and the sharpest decline in performance of the company were 118%, 48% and 31%.

IC industry can be divided according to the upstream and downstream design, equipment, packaging and testing, manufacturing several areas, A-share companies focused on the design and packaging and testing. This year almost all of the design class enterprise is struggling, several performance decline or even loss of business all from the design companies. The best performing countries in the core with the side only 19 percent reported earnings growth in the electronics industry is not outstanding, but it was the best report card in the first half of listed IC design company can come up with. And several other design class enterprise performance all decline.

End dismal performance design, and packaging and testing side but nice view, many companies this year to usher in performance even big reversal. Changjiang Electronics Technology and Jiangsu Nantong Fujitsu Microelectronics is the packaging and testing of two more well-known enterprises, reporting the results remarkable year, net profit in the first half of this year the two companies are close to 50 million yuan, an increase of respectively 141% and 102%. Another one from the packaging and testing companies in Gansu Huatian Technology, earnings growth also exceeded 36 percent in the first half, time shares Jing Fang Technology net profit increase of 19%.

Insiders said that due to weak industrial base, the financial structure of the problem of domestic IC industry has long criticized the industry, the performance of most enterprises from government subsidies rather than their own operations, and problems faced by domestic enterprises also designed a long time. As we all know, the domestic IC industry at the top of the lack of resources to control, in other words the lack of core competitiveness of enterprises in the design, so the design enterprises in the state caught in long-term survival can only get better when the boom of a product is higher downstream performance. Such ills is obvious, that is, market segments boom erupted uncertainties too high.

And walking foundry model to scale as the scale of the package by the technical aspects of the manufacturing industry impact is relatively small. Analysts say there is no problem as long as the quality and production capacity is guaranteed, whether domestic or foreign orders, such firms can digest, and the more well-known upstream firms, moat after entering their supply chain more secure.

In recent years with the rise of intelligent terminals, mobile phone, tablet, wearable even to the extent of increasing electronic industries, which also makes IC demand surge. In fact, whether foreign or domestic IC design enterprises in recent years because of capacity issues are a headache, a more stable packaging production line, are the meat and potatoes of the industry, which is encapsulated in recent years, corporate performance there are reasons for security. It is worth noting that, before the national release of the integrated circuit industry support plan, will also be locked in the packaging and testing resources and manufacturing sectors.

Spreadtrum before the Nasdaq-listed, RDA, Montage Technology Group have been purple cast and Pudong Branch acquisition and delisting from the Nasdaq, analysts said the company expected that several post-landing A shares, this could break the current situation. The three companies are IC design companies, the former two focus on communications, Montage Technology places do set-top box chips Kyo. From the competitiveness of enterprises and financial data, the strength of these companies are more than the current A-share IC design companies are expected to join them to break the current A-share IC design enterprises Legion strength weak situation.

In 2014, driven by overall economic recovery, smart phones and emerging wearable devices, the end product demand continues to grow, the global semiconductor market value is expected to reach 3,220 billion, compared with 2013 growth of 5.3 percent.

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Industrial Information Institute for Information Industry (MIC) industry consultant and director of the Hong Chunhui pointed out that due to the wisdom of handheld products demand growth in 2014 is quite optimistic about the development of the global semiconductor market; first half of the North American semiconductor equipment book to bill ratio (B / B Ratio) are maintain a 1.0 or above, Japan in June this year also rose to 1.0 or more.

It is worth noting that, in the global semiconductor market in mainland China as the largest source of demand. Hong Chunhui revealed that continent for electronic product manufacturing center, and the majority of the domestic market, mainly for driving the global semiconductor market to the greatest force in Asia; 2013 Chinese mainland market, representing nearly 30 percent of global semiconductor market share, 2014 will continue to increase.

As for Taiwan, the personal computer (PC) market decline rate reduction, continued to rise, such as fingerprint identification and sensor applications emerging growth, as well as advanced manufacturing process and high-end packaging needs, plus the first three quarters of new products and have emerged, semiconductor strong industrial growth; MIC estimates that in 2014 the performance of Taiwan’s semiconductor industry is expected to better than global output value will reach NT $ 2 trillion zero 93.4 billion yuan, compared with 2013 growth of 16%.

Moreover, Taiwan’s IC design industry rely on the Chinese mainland brands very well, but also to benefit from the strong growth trend of the mainland market. Hong Chunhui, said the first half of 2014, due to MediaTek’s multi-core products in mainland China continued to get smart phone manufacturers use to make Taiwan’s IC design industry with outstanding performance in the first half of 2014, compared with the first half of 2013 grew 15%. In addition, the Taiwan panel driver IC vendor’s products are not only favored by Taiwanese panel makers, China and South Korea panel makers are also widely used, making the Taiwan panel driver IC enjoy a very high market share.

Hong Chunhui that the first half compared to the state of high growth, Taiwan’s IC design industry will be relatively slow growth rate in the second half, but remained at a relatively stable high. The second half of 2014 is expected to increase the proportion of 4K × 2K TV, China plans to long-range evolution (LTE) demand will continue upward, so Taiwan IC design at this year’s growth will still be good.

New product launches of mobile communication, not only to stimulate the wafer shipments, will also enable increased demand for advanced process, so the second half of 2014 Taiwan’s foundry industry will continue to maintain high growth momentum, it is estimated in the third quarter 2014 production value of Taiwan’s IC manufacturing growth rate will reach 8 percent.

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