8K display panel will replace OLED as the flagship model of each brand

Japanese TV station, NHK intends to provide better Super HD 8K4K picture quality and super-high color gamut than 4K for the 2020 Tokyo Olympics. The BT2020 will leave the world’s best watchers with the clearest and deepest impression.

Major TV manufacturers such as Sony, Panasonic, Samsung and Hisense are all ready to provide a full version of the 8K flagship TV by the end of 2018 or early 2019. Meanwhile, 8K content is expected to be used in various memorable historical programs in the future, such as the Olympics. World Cup football, NBA playoffs, etc. BCR30GM

In order to smoothly put 8K panels before 2020, in 2017, TV panel makers have been cooperating with all panel component manufacturers, such as ICs, quantum dots, optical films, and machine manufacturers, to develop 8K display panels. FP40R12KT3G

According to IHS Markit’s “Quarterly Large Area Product Roadmap Tracker” report, 8K displays have recently become very popular, mainly because the next two companies, Lenovo and South, have developed screen driver boards and 8K TV chips for 8K display panels. To do image upgrades. Earlier in 2016, several panel manufacturers started to develop 8K display panels. However, due to the lack of mature materials and components, 8K display panels produced at that time had many problems. But with 8K screen driver board and 8K TV chip this year, panel makers, TV stations and brand manufacturers have more expectations for 8K. Current system chip vendors such as Morningstar, MediaTek, and Hass have stepped up their efforts to develop 8K system chips. On the other hand, Sharp’s recent 70” AQUOS 8K TVs have already begun to be sold in the first quarter of this year, which has forced other TV brands to become tighter, otherwise it is equivalent to high-end products.

Huawei will mass-produce Kirin 980 chips using TSMC’s latest 7nm process

Recently, according to foreign media reports, Huawei will launch the Kirin 980 processor in the second quarter of 2018. This series of mobile phones will be equipped with a 7nm processor. Last year, Huawei released the Unicorn 970, which once surprised the market. After all, this is the world’s first mobile-side artificial intelligence chip. Even the Qualcomm 835 that was released by Qualcomm had insufficient confidence. It has been applied to Mate 10 series, Glory V10, P20 series.

It is understood that, compared to the Kirin 970, this processor will configure the second generation of artificial intelligence chip NPU, on the basis of the previous generation, to support more scenarios, the performance of the NPU more than doubled (FP16 performance 4 TFLOP above) . In addition, Unicorn 980 will be equipped with A75 CPU architecture, and use more advanced TSMC 7nm process, which is Huawei’s 7nm process for the first time on the chip, the chip’s total number of core or upgrade to 10. Not only that, Unicorn 980 will also specialize in the issue of running low points for Kirin, which will significantly increase the performance of running points, and will even be more than 20% higher than Xiaolong 845 in overall performance. MV2201

In fact, Huawei and TSMC have been cooperating closely. They have been advancing since 28 nm, and have continued at 16 nm, 10 nm, and 7 nm nodes. Samsung and TSMC have been fiercely competing in new processes in recent years and have been fiercely fighting for orders. On the 7nm process, Samsung plans to introduce the world’s first EUV EUV lithography, which was originally hoped for. However, new technologies need to spend more time on research, development, calibration and equipment, and the progress is not smooth. Taiwan Semiconductor Manufacturing Co., Ltd. first built a 7-nm process based on existing technologies, and will join EUV next year and upgrade to 7nm+. Only 5nm of 2020 will be launched directly into EUV. XC17V02PC20I

In addition, there is news that the Unicorn 980 processor will be launched on Huawei’s new flagship phone in the Mate series (maybe Mate20) released in the second half of the year. Of course, after the Mate series of new flagship mobile phones, next year’s Huawei P series next generation of new aircraft and glory high-end series of new aircraft, is also expected to use this chip, the specific performance, let us wait and see.

Samsung first ultra-IBM into the United States patent library boss Huawei ranked 61

In the global technology industry, one indicator of the technical strength of each company is the number of patents. According to the latest news from foreign media, the latest statistics show that as of the end of last year, the cumulative number of patents registered by Samsung Electronics in the United States exceeded IBM’s number one for the first time, and the organization also pointed out that IBM’s technology research and development is moving toward aging.

Almost all technology companies in the world have registered patents in the United States, so the number of patents acquired in the United States has also become an authoritative comparative indicator. fz1200r12kf5

According to the Yonhap quoted from IAM and other organizations on Sunday, Samsung Electronics has accumulated 75,596 patents in the United States as of January 1, equivalent to 1.6 times that of IBM.

IBM holds a total of 46,643 patents, and it has been the largest patent-owned company in the United States for the past 25 years.

The above statistical report points out that Samsung Electronics not only surpassed IBM’s number of patents, but that in the foreseeable future, the company may always occupy the top spot. cm75ye13-12f

The report pointed out that although IBM used to lead in the number of patents, some of its patent assets are aging. In addition, IBM will give up some patents at an early stage. “As patent assets age, IBM must further intensify innovation, or It is the acquisition of patent assets to adapt to rivals’ competition.”

Japan’s Canon, which traditionally manufactures digital cameras, holds 38,996 patents in the United States, ranking third. With the gradual replacement of digital cameras with smart phones, Canon has begun a large-scale business transformation, targeting medical devices and other fields. A large number of patent libraries will also promote Canon’s transformation strategy.

Microsoft Corp. has 33,327 patents, ranking fourth, and Intel Corp. is ranked fifth, acquiring 30,985 patents.

Another Korean company, LG Electronics, ranked seventh and held a total of 28,223 patents in the United States.

Among the top 100 companies, US companies accounted for 46 seats, and European companies took up 14 seats. China’s Huawei Corporation ranked 61 and Lenovo Group had 93.

Huawei and Lenovo are also the most internationalized technology companies in China. Huawei has sold telecommunications equipment and smart phones globally. Last year, Ericsson exceeded Ericsson as the world’s largest telecommunications equipment supplier. Lenovo Group is the second largest personal computer manufacturer in the world.

Among other Korean companies, SK Group ranked 56 in the United States, LG Display ranked 65, and Korea Electronic Telecommunications Research Institute ranked 82.

Samsung Electronics overtook IBM to become the largest number of US patents, but it was not unexpected. IBM used to be the overlord of the personal computer era, but later it sold its computer business and focused on corporate IT consulting, high-performance servers, and large computers. In the Internet era, IBM’s industry status began to decline. The company has entered the emerging cloud computing market, but its competitive strength is far inferior to that of Amazon.com.

Samsung Electronics is the world’s largest consumer electronics company. It owns a wide range of products and raw material components such as display panels, memory chips, and semiconductors. Samsung is also the world’s largest smartphone manufacturer. Samsung’s mobile phones are often able to rely on excellent R&D capabilities. Launched major innovations including curved screens.

In addition to traditional household appliances, raw materials, mobile phones and other services, Samsung Electronics also follows the trend and has laid out various emerging technologies such as voice assistants, artificial intelligence, machine learning, automatic driving, virtual reality, and augmented reality. Technological R&D in these areas naturally promotes the continued growth of Samsung Electronics’ patents.

Reuters: Taking the European market as a springboard Huawei and Samsung Apple face positive competition

Reuters reported on March 28th, Beijing time, as the world’s third-largest smart phone manufacturer, Huawei launched its new flagship product, the P20 series, in Paris on Tuesday in order to seek new products in the European market. breakthrough.

In the current European smart machine market, competitors Samsung and Apple have made great progress. However, Huawei’s P20 series, with its rich camera capabilities and aggressive pricing strategy, is trying to compete positively with the Samsung Galaxy S9 and Apple iPhone X in the highly homogenized high-end smartphone market. bc556ap

Huawei said that the high-profile version of the P20, the P20 Pro, is equipped with three cameras and sensors, which also makes the image clarity of this product the leader in existing smartphones. Samsung’s flagship product, the Galaxy S9, launched in Barcelona last month upgraded the camera, and the Huawei P20 Pro is a clear response to Samsung’s product.

At the press conference in Paris, Huawei said that the basic P20 is priced at 649 euros (about 5053 yuan), while the high-priced P20 is priced at 899 euros (about 7,000 yuan). In contrast, according to Samsung’s website data, the price of the Galaxy S9 and the high-priced version of the Galaxy S9+ is about 739 euros (about 5754 yuan) and 869 euros (about 6,676 yuan) respectively.

The European market will be the key for Huawei to become the world’s second-largest mobile phone manufacturer. In China’s domestic market, Huawei is facing fierce competition from domestic rivals, but the European market is different. Thomas Husson, an analyst for consumer equipment at Forrester, a market research organization, said: “Given its absence from the US market, Huawei’s challenge in the European market is how to enhance its brand personality and gain more market share.” s1227-66bq

Huawei stated that in the first half of 2017, the company’s shipment volume in the European market increased by more than 50%. According to data provided by market research company Counterpoint, in the two major mobile phone markets in Europe—the Italian and Spanish mobile phone markets, the current Huawei mobile phone shipment share has exceeded that of Apple and Samsung. Counterpoint estimates that in recent years, the share of Huawei mobile phones in Western Europe has risen to 12%.

The share of Huawei smartphones in the UK and France accounted for 5% and 6%, respectively, and it was lower in the European market. In these countries, Huawei is strengthening its business.

However, Counterpoint analyst Peter Richardson said that Huawei has begun to face greater competition in the European market due to the recovery of Nokia mobile phones developed by HMD Global and its competitors from China. Xiaomi is increasingly powerful in this market.

The increase in the share of Huawei smartphones in the European market will help the company to make up for the disadvantages it has encountered in the US market. The chairman of the U.S. Federal Communications Commission (FTC) said last week that for Huawei, the FTC plans to adopt “active measures” to ensure the integrity of the US communications industry supply chain.

Samsung pushes 10-nm midrange processor Exynos 9610 to enhance visual depth processing

South Korean technology giant Samsung officially announced on the official website on the official website of a new generation of mid-range mobile processors – Exynos 9610. The processor is affiliated with the Exynos 7 series of Samsung mobile processors. The biggest feature is the addition of visual depth processing, which can achieve 480fps slow-motion photography at 1080p resolution, or 4K 120fps recording and playback capabilities. Samsung pointed out that Exynos 9610 will adopt Samsung’s new generation of 10-nanometer LPP process technology. On the processor side, the 8-core architecture is still based on the classic size core 2.3GHz A73×4 plus 1.6GHz A53×4. Under the DynamIQ big.LITTLE architecture, task scheduling tasks can make full use of each core performance of the CPU, regardless of whether it is a large or small core. It is also equipped with an embedded Cortex-M4F coprocessor to handle the daily sensor message processing. On the GPU, although the public version of the G72 architecture has greatly improved the GPU performance, the Exynos 9610 adopts the Mali-G72 MP3 with only three cores. The future may not be sufficient. bc556ap

For baseband chips, the baseband chip used by the Exynos 9610 supports up to LTE Cat.12 3CA 600Mbps downlink speeds, and up to Cat.13 2CA 150Mbps uplinks. The wireless connection function supports 802.11 ac 2×2 MIMO Wi-Fi and Bluetooth 5 and FM functions, and satellite positioning supports the mainstream GPS, Beidou, Galileo, and GLONASS systems.

Finally, because Samsung knows that photographing and photography have become the most frequently used features of consumer mobile phones, the Exynos 9610 has specifically added a visual depth processing module to enable deeper facial detection, multi-frame noise reduction, and simulated depth of field. Other functions. At the same time, the CPU supports 480fps slow-motion photography at 1080p resolution, or 4K 120fps recording and playback. These features make the future of the phone with the Exynos 9610 have a good photography function. Currently Exynos 9610 is ready for mass production. Samsung said Exynos 9610 will begin large-scale commercial use in the second half of 2018. s1227-66bq

Intel CEO Kezi Qi: Enhancing security from the chip level

Later this year, hardware-level protection will be applied to data centers and PC products.

In order to address the vulnerability discovered by the Google Project Zero team earlier this year, Intel and the technology industry faced a major challenge. Thousands of colleagues throughout the industry have made unremitting efforts to ensure that we are able to deliver on our common primary commitment: to protect customers and their data. With humility, I am sincerely grateful to the people and colleagues around the world for their commitment and hard work. And I’m convinced that when companies need help urgently, companies, even competitors, will work together to cope. xc18v04vq44i

However, there is still a lot of work to do. As the security situation continues to evolve, we know that there will always be new threats. This prompted me to draft a pledge to “safeguard safety first” in January. Intel has always been very concerned about security, and now, more than ever, we are sticking to the principles I have stated in these commitments: customer-first urgency, transparent and timely communication, and ongoing security.

Today, I would like to provide some updates to illustrate our continued progress in fulfilling these commitments. First of all, we have now released microcode updates for all Intel products released in the past five years in order to protect against the vulnerabilities discovered by Google through the side channel approach. Secondly, I would like to express my appreciation to all industry partners and express my gratitude. They work closely with us to develop and test these updates, and to ensure that these updates have been productized. AT24C16BN-SH-B

These updates are now in place and I encourage everyone to ensure that their systems are always up-to-date. This is one of the simplest ways to achieve lasting protection. I would also like to take this opportunity to share more details about our future defense of these vulnerabilities at the hardware level. This is also my commitment at Intel’s recent earnings conference call.

Vulnerability variant 1 will continue to be addressed through software defenses, and we are currently working on changing the hardware design to further address the other two vulnerabilities. We have redesigned some of the components of the processor to introduce a new level of protection through partitioning, which will prevent both variant 2 and variant 3 of the vulnerability. You can think of this partition as an extra “protection wall” between the application and the user’s privilege level, setting a barrier for intruders.

These changes will be the first to be applied to our next-generation Xeon Extensible Processors (codenamed Cascade Lake) and 8th generation Intel Core processors expected to ship in the second half of 2018. When these new products come out, the key is to ensure that they provide people with the desired performance improvement. Our goal is not only to provide the best performance, but also to provide the safest performance.

However, our work is not yet over. This is not a one-time event but a long-term commitment. We attach great importance to this. Customer first urgency, transparent and timely communication, and continuous security. This is our commitment, my commitment to all Intel employees.

U.S. CFIUS requires Broadcom not to relocate its headquarters to the United States

According to Reuters, the U.S. Foreign Investment Committee has informed Broadcom that it will not act arbitrarily to move its headquarters to the United States. Regardless of any measure, CFIUS must be notified 5 working days in advance. bsm300gb120dlc

Broadcom said today that it expects to complete the migration from Singapore to the United States by May 6, and said that it today requested the Singapore court to order an extraordinary shareholders meeting to approve the move. The meeting is scheduled to be held on March 23.

CFIUS has ordered Qualcomm to postpone the shareholders’ meeting in order to more fully investigate the security implications of Broadcom’s hostile takeover of Qualcomm. j2-q04a-d

As for the terms of the U.S. Overseas Investment Commission, “We know the order of these terms and fully comply with them,” Broadcom told Reuters.

Earlier, there was a sensational report that Intel might respond to Broadcom’s deal with Qualcomm through the acquisition of Broadcom itself, which is currently up 3.7% in a few hours.

INVECAS and Molex Collaborate to Enhance Automotive Infotainment Media Modules

Molex and INVECAS Announce Collaboration to Develop Automotive Infotainment Media Modules for Smart Vehicles.

Joe Stenger, Molex’s Advanced Technology Development Manager, said: “Infotainment systems play an important role for differentiated vehicle owners and OEMs looking to design their vehicles, and the ability to pack more and more functionality into modules gives them a competitive advantage. Molex’s infotainment system modules optimize a wide range of capabilities in a single solution, reducing complexity, size and cost control for automakers. ” xc2v1000-5fg456c

The new Infotainment Media Module integrates powerful solutions from INVECAS Design, a leading provider of proven IP and embedded software and system-level solutions for the automotive and other market segments. The solution is produced by GLOBALFOUNDRIES, a leading global, full-service semiconductor foundry. GF’s automotive-grade platform is a cost-effective solution for a wide range of products from wearable devices to automotive MCUs.

Dasaradha Gude, Chief Executive Officer of INVECAS, said: “In-vehicle infotainment is driving the transformation of the driver experience in a variety of exciting ways and we are excited to be working with Molex to advance the top infotainment technologies in next-generation vehicles development of.” xc3s200-4tqg144c

Gregg Bartlett, senior vice president, CMOS Business Unit, GF Corporation, said: “Working with Molex to provide further support for the development of leading infotainment systems in next-generation applications such as infotainment media modules will help in the future Formation of the Automotive Market The GF’s automotive-grade technology platform, combined with INVECAS’s design, will deliver a highly integrated in-vehicle infotainment system module. ”

Molex’s infotainment system media module is a highly reliable and scalable, all-in-one solution that significantly reduces the time it takes to implement automotive modules. Module for audio and video applications while data, navigation and car infotainment system functions together. The module can be configured for both wired and wireless connections, integrated with the car audio console, the built-in human interface display and the media system. The USB Media Module comes with built-in device compatibility and can be used for in-car data sharing, allowing multiple devices to operate and charge simultaneously, for example, playing iPad’s streaming music while running a navigation application on Android. With high-power USB Type-C connectors up to 100 Watts, it supports fast charging, optimizing design flexibility and meeting custom power and data requirements.

Leveraging decades of accumulated experience, Molex leads the development of power and signal solutions in the automotive industry, qualifying, designing and implementing a complete suite of end-to-end custom modules in a cost-effective manner.

Tsinghua University in the bionic graphene pressure sensor research has made important progress

Professor Ren Tianring, a professor of microelectronics at Tsinghua University, published an article titled “High Sensitivity and Wide Linear Range Graphene Pressure Sensor with Bionic Randomly Distributed Structure” at ACS Nano, Sensor with Random Distributed Spinosum for High Sensitivity and Large Linearity. The similar biomimetic structures are proposed based on human skin-sensing microstructures. The combination of microstructure and distribution mode solves the contradiction between sensitivity and linear range. The comprehensive improvement of device performance provides a new idea. dan202ut106

In recent years, the flexible force micro-nano sensor has become a research hot spot in the field of human physiological information monitoring and detection in particular, and a large number of related industry companies have been established one after another. Compared with the traditional silicon-based devices, due to its comfort, fit and wearability and other aspects of the characteristics of the widely used in physical and chemical monitoring of the human body, but as a mechanical device, two important indicators of sensitivity and linearity The contradiction between has not been well resolved. The devices that are usually prepared need to sacrifice one index to serve the other one, which often limits the scope of its practical application. Solving the contradiction becomes a difficult problem.

Based on the highly sensitive response of human skin, especially the fingertips to different sizes of stresses, Ninteen’s group proposed the preparation of a similar structure based on the study of its microstructure. The sandpaper was used as a template to form a flexible substrate. The graphene was used as a mechanosensitive layer after being reduced at high temperature to prepare a pressure sensor with acupuncture morphology and random distribution. The sensor exhibits excellent stability, fast response and low detection limits, enabling high sensitivity over a wider linear measurement range. Among them, the acupunctural changes in the contact area mainly contribute to the high sensitivity, and the random distribution mainly contributes to the wide linear range. The combination of the two largely resolves this contradiction. lm2678t-adj

Due to the high sensitivity and wide linear range of the sensor, the research group successfully applied to the monitoring of various physiological activities of the human body, such as pulse, respiration and voice recognition, as well as the monitoring of walking posture such as walking, running and jumping, As well as walking gait monitoring. The use of wearable high-performance mechanical sensors to acquire various physical activity parameters of the human body will have important practical significance in terms of personal health and medical treatment, and has great application prospects.

The research results have been supported by the National Natural Science Foundation of China and Ministry of Science and Technology projects.

SK hynix entered the industrial solid state drive market for the first time

According to Korean media etnews reports, SK Hynix plans to target the industrial solid state drive market. Large data center and server manufacturers are major customers of industrial solid state drives.

Compared with the normal consumer market, these markets have higher added value and technical barriers, so far, SK hynix has not achieved any results in these markets, it is planning to increase by developing and mass production of new products to increase NAND flash memory Market share.dan202ut106

Based on the fourth generation of 72-Gbit / s 512Gb (Gigabits) 3D NAND flash memory chips, SK hynix has developed SATA Solid State Drives that support up to 4TB and began shipping samples to major U.S. data center and server manufacturers.

The new SATA solid state drive from SK hynix achieves 560MB / s, writing 515MB / s continuously, reading 98000IOPS at random (input / output operations per second) and writing 32000IOPS at random. lm2678t-adj

“Our new SATA SSD meets the performance requirements of major data center and server manufacturers and its read latency, which is the most important feature of industrial solid state drives, meets our customers’ needs,” said a representative at Hynix .

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