Research firm IC Insights released the latest report, DRAM factory sales in the fourth quarter of 2017 will hit a historic new peak, estimated at 21.1 billion US dollars, compared with 12.8 billion US dollars in the fourth quarter of 2016 a 65% surge. IC Insights said that according to historical experience, the DRAM industry may experience a long-term downward trend in the near future. As DRAM capacity increases, prices will start to decline this year, with a two-year losing streak. TL-5186

Looking back at 2017, benefiting from the demand for data centers, driving a significant increase in server DRAM, while smart phones and other mobile device products using low-power high-density DRAM are also synchronized growth in 2017 DRAM price quotes all the way up to the fourth quarter is still strong , IC Insights estimates fourth quarter 2017 DRAM sales will reach 21.1 billion US dollars, an increase of 65%, setting a record high. STP36NF06FP

IC Insights predicts that the DRAM market will reach an annual growth rate of 74% in 2017 and a breakthrough of 31 billion U.S. dollars in 2017. There are five major new stimulus factors in the DRAM market. These include the limited memory capacity of memory suppliers, the technologies below 20 nanometers Increased difficulty, demand for graphics DRAM, server DRAM and mobile DRAM.

Taking mobile storage as an example, the capacity of smart phones carrying DRAM memory is continuously increasing. The Apple iPhone 8 has 2GB of DRAM and the iPhone X has 3GB of DRAM. Samsung Galaxy S8 uses 4GB DRAM. Huawei P10 Plus and HTC U11 are equipped with 6GB of DRAM. Razer Inc.’s first smart phone, the One Plus 5 model from Singapore, known primarily for video game equipment, also boasts 8GB of DRAM.

However, IC Insights warns that based on historical trends, the DRAM industry may experience a long-term downward trend in the near future as prices will begin to decline as production capacity increases and DRAM production increases Fear will be 2 years.

Samsung and SK hynix announced new capital expenditures into the new DRAM production will be trial production in the second half of 2018, which may ease the first half of 2018 DRAM gains. Samsung’s Pyeongtaek plant in South Korea is expected to ramp DRAM production in Q4 2018, and SK Hynix also announced plans to build a new production line in Wuxi, China.

IC Insights also said DRAM maker Samsung and SK hynix will have new capacity out of the top 2. And the No. 3 maker of Micron can not afford to sit idly by, especially in the highly competitive DRAM industry. Micron may also re-install a new wafer plant.

This morning, Micron released a technical article on the official blog that GDDR6 video memory has completed all the design work and passed the internal verification, starting with 12Gbps pin and 14Gbps chips.

In fact, people should see it, some Pascal graphics GDDR5X actually has reached 12GHz, such as the EVGA GTX1080TIFTW3ELITE, TITANXp also reached 11.4Gbps. PGM-11801

However, GDDR6 still has its own advantages, up to 32Gb single-chip (currently 8Gb and 16Gb), dual-channel, 1.35V voltage (1.5V relative to GDDR5), internal electronic interference reduction, the other manufacturing process is also upgraded from G5X 20nm Is 16 nm.

Micron said that now they can focus on improving production yield and faster development of GDDR6 video memory, after all, the theoretical limit is 16GHz.

Micron conservative estimates, GDDR6 memory will be commercially available in the first half of next year, but NVIDIA has long said that they will be the starting, after all, there are Samsung and SK hynix are preparing. BLE112-A-V1

Taking into account the CES2018 somewhat aggressive, it is estimated that in March GTC General Assembly, with GDDR6 Volta GeForce graphics cards will be released, but due to cost reasons, I estimate may only GTX2080 / Ti (imaginary name) on the use of Moreover, G5X is not bad.

In addition, rumors AMD will also GDDR6 side, because HBM2 cost is too high, inconvenient to Redeon production line popularity.

Dibotics, a pioneer and leader in real-time 3D laser radar processing for Renesas Electronics Corp., a leading global provider of advanced semiconductor solutions, today announced that it has partnered to develop a vehicle for advanced driver assistance systems (ADAS) and autonomous driving applications Level embedded solution for light detection and ranging (LiDAR) processing. The collaboration enables system builders to implement real-time 3D mapping systems with low power consumption and advanced functional safety (FuSa). rur860

Currently, Lidar processing requires efficient processing platforms and advanced embedded software. The system manufacturer offers SLAM on Chip ™ (Note 1) by combining Renesas Technology’s high-performance image processing and low-power Automotive R-Car SoCs with Dibotics’ 3D Real-Time Location and Mapping (SLAM) technology. On-chip SLAM enables 3D SLAM processing on a SoC for high-performance PCs, and enables 3D mapping using LiDAR data without the need for inertial measurement units (IMUs) and global positioning system (GPS) data. This collaboration makes it possible to implement real-time 3D mapping systems in automotive systems with low power consumption and advanced functional safety.

Renesas Electronics and Dibotics Collaborate to Deliver Real-Time, Low-Power LiDAR Solutions Based on R-Car SoC

In response to the auto-driving era, the automotive electronics market continues to optimize the sensor technology needed for autonomous vehicles, including real-time HD sensing of the environment, precise vehicle positioning, and real-time sensor fusion. LiDAR has become the key sensor for autonomous driving because it senses very accurately the obstacles around the vehicle and controls the vehicle through real-time communication with the electronic control unit (ECU) over alternatives such as cameras and radar. The dramatic increase in the amount of data transmitted by lidar sensing technology will drive the demand for high-performance, real-time processing of large amounts of data. maz3091

“The seamless integration of Renesas Technology and Dibotics technology enables real-time, efficient solutions for advanced LiDAR data processing at the highest levels of automotive functional safety,” said Jean-François Chouteau, vice president, Renesas Electronics Global ADAS Center. For autonomous driving, Renesas Electronics is working with innovative partners to optimize the Renesas autonomy Platform for Renesas end-to-end platforms and we are pleased to announce the collaboration with Dibotics to provide disruptive technology to the LiDAR market. ”

Raul Bravo, CEO and co-founder of Dibotics, said: “LiDAR sensors will play a crucial role in all ADAS and autopilot functions, a combination that combines Renesas ‘professional design with Dibotics’ unique cutting-edge performance, Helping OEMs, tier-one suppliers and LiDAR manufacturers reduce development costs and accelerate time-to-market, and we are excited to work with market leaders such as Renesas Electronics. ”

Unlike existing methods, Dibotics’ Augmented LiDAR ™ software implements 3D SLAM technology, which requires 3D LiDAR sensor data for 3D mapping. It eliminates the need for additional inputs to IMUs, GPS or wheel encoders (Note 2), eliminating additional integration efforts, reducing BOM costs and simplifying development. In addition, the software enables point-by-point classification (Note 3), detection and tracking of the shape, velocity and trajectory of moving objects, and Multi-LiDAR fusion (Note 4).

The high performance of the R-Car enables it to run Augmented LiDAR software from Dibotics. The R-Car has low power consumption and meets ISO 26262 (ASIL) functional safety standards for high functional safety. Renesas Electronics R-Car is a groundbreaking part of the Renesas autonomy ™ Platform for ADAS and autopilot, providing a complete end-to-end solution from cloud to sensor and vehicle control.

IDC notes that the global IoT spending in 2018 is projected to increase 14.6% annually to $ 772.5 billion. IDC expects to spend $ 674 billion in 2017, a breakthrough of $ 1 trillion in integer levels in 2020 and a further $ 1.1 trillion in 2021; a CAGR estimate of 14.4% for 2017-2021.

IoT hardware is expected to be the largest technology project in 2018, with $ 239 billion mainly focused on modules and sensors and some will be invested in infrastructure and security. The software is expected to be the fastest-growing technology category in the IoT market, with CAGR projected at 16.1% for 2017-2021. maz3091

IDC expects IoT Service Spending CAGR to reach 15.1% between 2017 and 2021 and estimates the annual amount for 2021 to approach IoT hardware.

Carrie MacGillivray, vice president of operations and IoT at IDC, said that by 2015 more than 55% of IoT planned spending will focus on software and services.

The most actively invested IoT solutions for 2018 are manufacturing ($ 189 billion), transportation ($ 85 billion) and utilities ($ 73 billion) respectively.

In 2018, cross-industry (Cross Industries) IoT application expenditures such as car networking and intelligent building are estimated to approach 92 billion U.S. dollars. rur860

IDC Research Director Marcus Torchia said consumer Internet spending will reach $ 62 billion in 2018, making it the fourth-largest industry category, with applications such as smart home, home automation, security and smart appliances.

Under the guidance of smart appliances, consumer IoT spending CAGR is estimated to reach 21.0% between 2017 and 2021, ranking the highest in all industries.

TSMC, Apple and other large customers on the 7-nanometer manufacturing process under the strong sprint in the next 7-inch production sprint pace is expected to lead TSMC a new wave of growth momentum.

News, due to TSMC 7 nano-technology unparalleled industry, ready to go, kinetic energy look pretty next year.

TSMC is scheduled to hold a supply chain management forum on Thursday (July 7), marking a rare event for TSMC to hold two supply chain management forum events in a row for a year, highlighting the 30th anniversary of TSMC’s emphasis on supply chain partners.

The supply chain management forum, still co-CEO Liu Deyin featuring keynote speech, is expected to announce the sprint 7-nanometer process mass production, it will also announce the 5-nanometer trial production and production progress for the TSMC, and then write Lay a good foundation for operating peak.

It is understood that TSMC has won the next generation of Apple’s next generation A-series mobile chip exclusive production orders, led TSMC 7-nanometer mass production “did not play the first sensation.”

Industry interpretation, TSMC will hold a supply chain management forum this time, announced the sprint 10-nanometer process capacity and speed up the 7-nanometer production volume determination.

TSMC originally planned, 7 nanometer and 7 nanometer + advanced process, the former will enter mass production in the second quarter of next year, and the upcoming introduction of EUV technology 7 nanometer + process, will also enter the pilot production stage next year.

By the end of 2018, 50 designs will be finalized, including 7nm and 7nm + advanced processes.

In the second half of this year, as TSMC’s A11 processor was shipped in volume and shipped strong growth, TSMC paid a total of NT $ 251,207 million in the third quarter. It is expected that the consolidated annual revenue will reach 8.8% Rewrite the record high, next year in the 7-nanometer process volume production, continued to see the performance increase.

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According to foreign media reports on November 27, Apple may abandon Samsung as its supplier of OLED displays as it is currently working with BOE, China’s largest monitor maker, to develop a collapsible OLED screen.

It is reported that Apple has filed for the foldable OLED screen patents, and headquarters may be developing this for the future iPhone models foldable screen. Meanwhile, according to ETNews reports, BOE is currently also preparing to develop Apple-dedicated folding OLED displays.

Samsung is the supplier of the iPhone X OLED display, and the iPhone X may be Apple’s designated model that will use the foldable display. However, if Apple diversifies its supply chain of OLEDs or completely abandons its rival Samsung, it will put a monopoly on the market.

However, unless Apple has found strong supply chain support, otherwise the next generation of iPhone is unlikely to use folded OLED display. And Apple will surely make sure its iPhones are not flawed, so it will certainly test BOE’s products before signing with BOE’s new monitor maker.

It is noteworthy that many technology companies compete for folding screen accessories, and even some companies have also applied for a large number of patents. However, a foldable display that truly fits mass market devices has not yet appeared. Therefore, these messages are just rumors of the display industry.

However, if Apple can develop a foldable display ahead of its competitors, Apple will be back in the forefront of phones and technology innovations, even as Face Scanning technology in Face ID technology lags behind.

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A few days ago, at the Deal Times conference in New York Times, I said that every company should formulate an artificial intelligence strategy without delay. As the digital revolution accelerates, data is getting more, more complex, and more diverse, companies must make critical decisions quickly. In order to manage digital floods, companies need artificial intelligence strategy, otherwise they will lag behind the times.

Massive, complex data available exceeds the capacity of human analysts. Without the help of machines, it is increasingly difficult to make effective use of the data, and the machine not only processes the data but learns from it.

Artificial Intelligence enables organizations to manage complex data and provide unprecedented opportunities for organizations to make real-time decisions, manage operations dynamically and respond to customers.

This is not just about predicting the future. From banks to the healthcare industry, from manufacturing to consumer services, companies around the world have begun to use artificial intelligence to analyze data and build learning organizations to adapt and compete at unprecedented speeds. E.g:

The Bank of New Zealand has come up with a new brand vision, “Your Bank,” that focuses more on its customers. One way to achieve this is to harness artificial intelligence to reshape and re-invent a more personalized customer experience.

Sharp Medical is using artificial intelligence to screen patients’ electronic medical records for many years to predict which patients are at risk of sudden deterioration, with an accuracy rate of 80%. This model predicts whether the Rapid Response Team will need to be invoked for the next hour, allowing Sharp to intelligently deploy medical emergency teams to critical locations in hospitals to intervene before life-threatening events occur .

Fero Labs is harnessing artificial intelligence to help manufacturers increase industrial output, prevent costly machine failures and reduce waste, all of which help improve product quality and reduce costs.

Amazon Cloud Services (AWS) is providing customers with machine learning services to help them develop smart applications. It allows organizations such as Zillow to estimate the value of more than 110 million homes with high accuracy and enables Netflix to create personalized program recommendations for its 100 million users.

Companies are using the Artificial Intelligence platform for exciting innovations, just a few of these. Enterprises want to use artificial intelligence to win the future, they should follow four key guidelines:

1. Understand what data is being collected and what data can be collected by the latest intelligent interconnect technology

2. Deploy the infrastructure to consolidate the data and know how to analyze the data

3. Determine where to invest in artificial intelligence to help learn from the data

4. The world in which AI is supporting and assisting real-time decision-making is coming and training is needed to prepare executives

At Intel, we are committed to making artificial intelligence an important part of our product portfolio. The same technology that can solve our internal business challenges can also help our customers. Examples of AI-optimized solutions include: plant processes, strategic planning, IT data center operations, and more. There are numerous application cases, and as such, Intel Capital also sees artificial intelligence as one of the strategic criteria for choosing an investment project.

To this end, Intel provides a complete set of artificial intelligence products, including software and hardware, can be applied to almost every conceivable case. By providing a flexible and scalable solution across business scenarios, we lead the integration of AI with business operations. The most forward-looking companies are already gaining competitive advantage through artificial intelligence. Looking to the future, artificial intelligence strategy will no longer be dispensable, it will become a business survival conditions.

Companies need to immediately develop and implement their own artificial intelligence strategy, to win the future.

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Renesas Electronics (China) Co., Ltd. (“Renesas Electronics”), a subsidiary of Renesas Electronics Corporation, a leading global semiconductor solution provider, announced five new products, including the R7F0C205L, R7F0C206L, R7F0C206M, R7F0C207M and R7F0C208M, Expands its 16-bit microcontroller (MCU) product line to further enhance development support for touch-enabled home appliances, smart buildings, industrial automation and portable device applications. Embedded developers can take advantage of new products that integrate both user interfaces (including capacitive touch keys, LEDs and LCDs) and system control functions on a single chip.

The new MCU inherits the RL78 family of industry-leading low-power and superior electromagnetic compatibility (EMC) and other powerful performance. Developers of capacitive touch applications can utilize the state-of-the-art second-generation capacitive touch technology from Renesas Electronics at very low power and at very low cost. In addition, the embedded LCD and LED direct drive capabilities, support for a wide range of product designs, and regulate the developer MCU platform throughout the product line. The MCU also integrates high-current ports for driving LEDs and LCDs to optimize capacitive touch key applications with LEDs and LCD displays. The new MCU is Renesas Electronics’ first 16-bit touch MCU that supports LCD and LED direct drivers on a single chip. Delivered with a solution that includes MCUs, Workbench and Graphical User Interface (GUI) tools (HMI Code Generator), the new evaluation board and evaluation kit will be provided separately.

The main features of the new capacitive touch MCU:

Detect up to 64 keys, low-capacitance touch key standby current, high-current port directly drives the LED

The new MCUs support complex user interface requirements and support up to 64 keys. Helps to reduce the complexity of wiring when adding a touch panel, simplifies board design, and mutual-sensing key configuration improves waterproof performance. The average power consumption of capacitive touch keys in standby mode is only 6 microamperes (uA), effectively supporting battery-powered and other portable devices with low power requirements.

The built-in high current drive port of the MCU can directly drive the LED and is suitable for most LED display and touch button control LED display applications. The MCU also supports most common interfaces.

Workbench, software, and application notes are available to further reduce development time

The Workbench Auto-Alignment Tool, which is configured on the Renesas capacitive touch key MCU, makes it easier and faster to use the graphical user interface (GUI) to adjust to the effects of different board layouts, tracking patterns, panel materials, and more in the past Difficult to change the sensitivity and other settings. Combining the software and information needed for development, including application notes, user manuals, and reference software, Workbench can be used with MCU samples and evaluation boards to quickly confirm and evaluate system operations, reducing development time.

The capacitive touch R7F0C208M evaluation kit is IEC61000 certified

Three capacitive touch R7F0C208M evaluation kits have passed IEC 61000-4-3 and IEC61000-4-6 anti-noise certification and will be available soon.

Availability

New solutions and optional reference boards and evaluation boards will be available in February 2018.

The new MCU includes a 64-pin, 80-pin LQFP package and 48 KB to 128 KB flash memory for consumer and industrial applications. Its industrial-grade products support complex human-machine interface (HMI) designs in industrial applications.

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Microchip Technology introduces the PIC16F15386 family of 8-bit PIC microcontrollers (MCUs). In addition to Microchip’s existing core independent perimeter (CIP), the series also includes a 32MHz high-precision internal oscillator and a variety of memory functions, such as a friendly boot loader write function memory access partition ( MAP) to avoid accidental overwrite.

The Component Information Area (DIA) provides protected storage space to store unique identification information and calibration values ​​unique to the component. The PIC16F15386 family provides a simple and easy-to-use MPLAB Xpress development platform and supports the MPLAB Program Generator (MCC) to provide users with the most complete development experience. This series of components for general purpose and low power applications, the use of a wide range. lqh6ppn101m43l

The launch of the expandable series of components includes up to 28KB of flash memory and 2KB of RAM, with 8 to 48 pins and other packaging options. This is the first 8-bit PIC MCU family to offer a 48-pin package, and adds more ADC channels and I / O. The series has a high-level CIP integration, which can perform a number of system functions (signal generation, motor control, safety monitoring, system communication and man-machine interface) using the periphery outside the core at the lowest power consumption. The new MCU also includes power management features (idle and doze mode, and peripheral module disabled), allowing engineers to achieve the best balance between power and performance.

For this new product portfolio, Microchip has launched a dedicated new Xpress series development board to help customers immediately start the project development. In just two minutes, engineers can use the Xpress family of development boards and the cloud-based MPLAB Xpress IDE to start the development of the application. Other support tools include two Curiosity development boards (DM164136 and DM164137) and software development platforms, including Microchip’s free software, including the MPLAB Code Generator (MCC) and MPLAB X IDE. MCC is a free software plug-in, which provides a graphical interface to help engineers for its application around the function and configuration. The Xpress series development board is now available free of charge. m83513/03-d03n

The PIC16F15386 family includes 13 components that offer a wide range of package options including PDIP, SOIC, DFN, UDFN, UQFN and SSOP. All products have begun to provide samples and put into mass production.

In the recently held annual supply chain management forum, TSMC joint CEO Liu Deyin (Mark Liu) also disclosed that TSMC will be in the second half of 2019 planned production of 5nm process.

TSMC has just begun mass production of 10nm, but the first quarter of 2017 will try to produce a new 7nm, 2018 into mass production, and then into the 5nm, can be said to be a ring, did not stop. 08055c104kat2a

Liu Deyin also revealed that TSMC will be in the 7nm process to improve the version of the first use of EUV extreme ultraviolet lithography, 5nm will be fully applied. This is the first to determine the launch of the EUV fab – Intel 7nm will not still do not know.

Liu said that TSMC 10nm process mainly for mobile devices, will be the end of the quarter batch delivery OEM chip, the second half of the rapid expansion of production capacity. m27500-24sr2s23

MediaTek Helio X30, Huawei Kylin 970, Apple A11 will use TSMC 10nm process, Xiao Long 835, Exynos 8895 is Samsung 10nm.