Promote energy efficiency and innovative Semiconductor (ON Semiconductor), further expansion of automotive power integrated module (PIM) product line, launched STK984-190-E. The module is optimized for driving three-phase brushless DC motor (BLDC) for modern automotive applications, comprising six 40 V, 30 A MOSFET configured as a three-phase bridge, and an additional 40 V, 30 A high-side reverse battery protection MOSFET. The MOSFET is mounted onto a direct bond copper (DBC) substrate, resulting in a compact module with excellent heat dissipation, it is only as effective as discrete programs half the board space.

The module is suitable for 12 V automotive motor drive applications, rated power of 300 W, electric pumps, fans and windshield wipers. Using motor controller designers to incorporate such LV8907UW, can create energy efficient BLDC solution with best-in thermal performance and built-in diagnostics, and ultra-small PCB, saving critical dimensions and weight.

Use this module can significantly reduce component count and BOM cost. DBC substrate thermal resistance reduced, thereby reducing the operating temperature of the MOSFET. By reducing the thermal cycling during temperature changes, which reduces the power consumption and increase reliability. Insulation provided by the DBC substrate also enhance the reliability. STK984-190-E specified operating temperature range of -40 ° C to 150 ° C. All integrated MOSFET through AEC-Q101 certification.

Chris Chey, general manager of ON Semiconductor System Solutions Division, said:. “Develop an efficient BLDC drive program usually takes at least 13-15 discrete components, while less than half the number of car components STK984-190-E power modules required in addition to a compact size, STK984-190-E support robust thermal performance with a smaller heat sink. this enables the size and weight of the system is significantly reduced, which means engineers can fully address the challenges currently facing with regard to improve fuel economy and overcoming space constraints. ”

STK984-190-E lead-free DIP-S3 package measuring 29.6mm x 18.2mm x 4.3mm.

According to overseas media reports, Taiwan’s IC design greet the season in the third quarter, gradually covering inventory downstream customers, MediaTek counterattack horn blowing performance driven, comprising: Realtek, silicon Cenda, Bright, Li product, Sheng Branch, etc. 3rd quarter results monthly rise, the opportunity to challenge the new record high.

From rival Qualcomm optimistic about the third quarter outlook, you can see the results of this season MediaTek go Yang is not difficult, Qualcomm estimated quarter revenue between 5.4 to 6.2 billion US dollars, higher than analysts expected figures, MSM chipset shipments will be between 195 million to 215 million group, annual growth rate of between 4.0% to 6%.

MediaTek chairman Tsai Ming-Kai previously they predict the third quarter in good shape, the mainland and the emerging markets in the smart phone development speed up the pace, 2G, 3G into the 4G than expected to fast, the third quarter continued the previous quarter boom, shipping momentum continues to grow . The corporation estimates, the three major telecom operators in the mobile phone, driven by continued subsidization, Andriod mobile platform customers continued to build inventories, MediaTek Q3 revenue will continue to set new monthly high, and the opportunity to rebound this quarter gross margin .

Netcom Realtek chip maker into the traditional peak season, switching applications replace 802.11n WLAN 802.11ac shipments warming, increase market share month by month, and after the acquisition of Avago Broadcom exit consumer WLAN, Ethernet chip market, Realtek into a single chip manufacturers, substitute effect gradually reaction, new orders in the third quarter began volume shipments.

Also benefit from 802.11n 802.11ac substitution effect, RF IC stand volume in the third quarter WiFi RF components ship sustained heavy volume this season monthly revenue record June sales will remain high trend, the second half of the monthly performance go Yang. Since the multi-band multi-mode mobile phones towards development, RF radio frequency front-end components used in an amount more than 2.5 to 3 times the penetration increased from 35% last year to 50% this year, only the previously established plot 11ac 2.4G and low power 5G PA, expected third quarter 11ac began shipping high power 5G PA.

Analog IC silicon Cenda the third quarter into the industrial shipping season, monthly sales continued in June highs boom, SSD steady growth is expected to received the Japanese and the US Department of SSD customer orders, in addition, China cut before five smart TV and Korea of ​​the customer, shipment growth is expected in the second half. Plus the acquisition of Maxim and NXP sector into the fermentation efficiency, legal expected this year and the acquisition of profitable sector revenue is expected to grow 13-14%, 3-4%.

China’s three major telecom operators continued to subsidize smartphones, Bright led the third quarter of the mobile phone chip fast charge continued strong demand for mobile phone IC were maintained annual growth rate of more than 30% annual growth, accounting for the proportion of products from 2 years ago 15% to 25% in the first quarter of this year, corporate forecast to benefit from the booming mobile phone fast charge IC shipments, quarter by quarter revenue of 5-10 percent.

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According to “Science Daily net,” the report pointed out recently in the United States of an international technology team, officially announced the development of a new technology, which is a high-performance magnetic memory chips team will migrate to the surface of a soft plastic, and lossless performance . And through the soft plastic characteristics, the development of a transparent film-like “soft plastic smart chip.” It has excellent data storage and processing power in the future if the formal commercialization, the future is expected to become an important product wearable storage element.

Reports indicated that research and development which “soft plastic smart chip” team first magnesium oxide-based magnetic tunnel junction (MTJ) grown on a silicon surface, then etching away silicon below, then the use of a transfer method, in a raw material made of polyethylene terephthalate made of soft plastic surface, a magnetic memory chips implanted. After testing, the new equipment in action Magnetoresistive Random Access Memory (MRAM) on the clear. Since MRAM in the processing speed, power consumption, and can be powered down after data storage and other properties, are higher than conventional random access memory chips. Therefore, the “soft plastic smart chip” Future after integration and MRAM will create a new birth of another storage element.

Currently, flexible electronics equipment market to develop soft magnetic storage device the most attention. Because they will be the future of wearable electronics, and biomedical device key components of data storage and processing. Although scientists have conducted a number of studies on different styles of memory chips and materials. However, the flexible substrate to create a high-performance memory chips without compromising its performance, the research is still facing enormous difficulties.

At present, developed the “soft plastic smart chip,” the international team for the National University of Singapore, scientists Yonsei University, the University of Ghent, Belgium, Singapore and the Singapore Institute of Materials Engineering Research Institute of the combination. The team said that at present in the United States and South Korea have applied for a patent for this technology. The device is currently being further enhance the effectiveness of the experimental magnetoresistance, and look forward to products used in other electronic devices.

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Micro LED and OLED technology can be seen as a counter display technology, Apple will next year with the wisdom of introducing Micro LED watches, chip crystal power plant will look forward to new areas of the chip to the effective production capacity, the more optimistic Micro LED OLED with low power and high performance high luminance characteristics, end-use applications is expected to achieve market share.

It is understood that next year Apple will be the first time with wisdom watches Micro LED, replace the currently used OLED display panel, due to cost approximately $ 8.5 spread, the product is expected to import high-end models, and feature low power consumption will help resolve the current wisdom watch battery problem, prompting Apple and actively develop new technology applications; Taiwan plant is expected next year will determine the watch Apple wisdom Micro lED technology can be successfully introduced into the application side.

Foreign noted, Micro LED due to the high contrast and a high resolution, so in addition to wearable device applications, have the opportunity to follow import VR (virtual reality) and AR (augmented reality) means the technology is mature after five years can not rule out entering other mobile devices and larger displays; if the technology gain market acceptance, the wafer will effectively reverse the current situation of excess supply.

Epistar said that the current Micro LED technology matures can be gradually introduced into the device, the current wafer production is not the problem but rather Lei wafer transfer shall be time-consuming, the current shift can only transfer 50 000 Micro LED, and the need to smartphones 5 million points of mobile computing, a mobile phone need 10 working days, so hard to import mobile device in the short term, will initially import low demand wisdom watches, is expected next year to see the wisdom of using the Micro LED watch, three years after the expected into the mobile space.

According to legal sources, crystal power last year to enter the Apple Watch intelligence application health monitoring optical sensing modules, this year is expected to enlarge the supply of the first generation of next year using MicroLED the iWatch, Epistar have the opportunity to supply a small amount, to the next generation supply will be magnified.

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14nmFinFET process has been in mass production in 2015, the semiconductor industry is increasingly complex process, Moore’s Law seems to be increasingly difficult to achieve now, smaller chip manufacturing process far away from us does? Not very far.

TSMC’s 10nm process that they have three clients complete flow sheet, although not announced the name of the customer, but affordable 10nm process chip is Apple A10, X30 MediaTek and Hass unicorn new generation processor, it is estimated that this flow sheet three, and compare Samsung also need TSMC, the process will be in volume production in 2017 Q1 quarter.

As for the lower 7nm and 5nm, TSMC said it would accelerate the process in 2017, may have to wait two years, we will be able to see the single digits of the processor chip manufacturing process.

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Semiconductor manufacturers and equipment suppliers, smartphone and PC market saturation, can not drive sales growth, the traditional practices of the past, the production of more powerful chips, it is difficult to expect to reverse the decline, and now the industry to adopt new technologies, such as fully depleted coated silicon (FD-SOI) and 3DNAND on type insulation.

The Wall Street Journal reported that performance pressure faced by the semiconductor industry and has led the whole trend, the latest data also pointed out that this year the global semiconductor equipment manufacturer revenue is probably grow by only 1 percent to $ 36.94 billion, while the wafer revenue may decline 2.4 percent, bad is wisdom slowing the growth of the mobile phone, PC market is shrinking. The semiconductor industry are asking: Where is the next growth opportunity?

Today, many operators have adopted new materials and new production technologies to cope with changes in the market, these industry optimistic about the networking device needs, but things wafer demand is not the same as asking wafer costs at less than $ 1, and can be run for several years, not need to replace the battery.

GlobalFoundries (GlobalFoundries) and rival Samsung Electronics has adopted known as FD-SOI technology, this technology has advantages in power consumption and cost, rely on semiconductor wafers French manufacturer Soitec specially tailored.

Soitec CEO Bourdelle said the Japanese technology giant Sony recently designed smart phone GPS chips will use FD-SOI technology, power consumption is only one-tenth of the results of the wafer original wafer, allowing users to more frequent use of satellite positioning technology, Do not worry too much electricity will eat your phone.

Some in the industry have not started production of smaller transistors, the further tap the potential of the wafer, NAND flash memory manufacturers have to 3DNAND way through the stacked multilayer circuit to enhance performance. This technique requires a lot of production and procurement of equipment, and therefore so many companies can benefit, Applied Materials (AppliedMaterials) is one of them.

Coated silicon (FullyDepletedSilicon-on-Insular, FD-SOI) is on a full depletion type insulated fin field effect transistor (FinFET) and Three gate transistor architecture (Tri-Gate) of complementary technologies, it can be regarded as look at things with the car market substituted FinFET ideal alternative, which features low power consumption, better performance and cost effectiveness. Currently supports FD-SOI wafer foundries include GlobalFoundries and Samsung Electronics.

TSMC 7nm process before the next city, chip makers TSMC AppliedMicro officially announced the 7-nanometer process technology to produce cloud computing and network communications chip.

AppliedMicro President and CEO Paramesh Gopi said the company is pleased to have the opportunity to expand partnership with TSMC, future efforts will be advanced technology will bring high-performance computing market, and more intensive cooperation with TSMC to promote its AppliedMicro silicon products, can benefit from TSMC’s excellent process technology. Meanwhile, the 7-nanometer process technology is introduced, it will is rapidly growing data center market has brought important changes to computing performance, network speed, energy efficiency and so will bring significant improvement, and reduce overall data center support cost.

TSMC Jinping, deputy general manager of business development, said, TSMC is also very pleased to be able to do something AppliedMicro success, TSMC advanced 7-nm process, allows customers access to key performance performance computing and web applications.

Cloud-to-server data center or related product performance, density and power consumption of an endless pursuit. Therefore, a good end-user experience, lower maintenance and operation costs, and environmental protection, will be more attention. AppliedMicro its products X-Gene and X-Weave is currently used in 16-nm FinFET potent version of the process (16FF +), while the new 7nmFinFET process, will provide more performance advantages under the same power consumption, or the same performance It offers lower power consumption.

AppliedMicro in 2015 ARM TECHNOLOGY (TechCon) published the X-Gene 3, combines 32ARMv8, up to about 550 SPECint rate. It is the product of the company’s product strategy after the change, the early X-Gene technology used in design 1 to 2 nodes process provides only a relatively small number of cores and high I / O consolidation. On the contrary, the use of 16FF + wafer manufacturing process with more number of cores, bigger L3 cache and more DDR4 memory interface.

Addition, the company in 2016 at the Optical Fiber Communication Conference (Optical Fiber Communications Conference) delivered a 100G X-Weave PAM4, which is a single wavelength, with mixed signal characteristics, using 4-order pulse amplitude modulation (PAM4). X-Gene and X-Weave goal is to provide a larger corporate or private cloud operating system and the environment. Common characteristics such as high-speed Internet and carrier-class reliability, or in existing data centers in the record, retrieve and have more computing power.

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The “Acquisition Master,” said Cisco has recently announced a new deal.

The acquisition of cloud security company CloudLock, the total transaction price of $ 293 million. This is Cisco’s fifth launched this year were acquisitions.

As the world’s largest network equipment maker Cisco pioneered the “all things Internet” cloud computing, big data, and so is an important part of its business to digital transformation. Including the acquisition, including the acquisition is more than the industry believe that Cisco plot self “salvation” another move. However, for this performance, Cisco’s market capitalization pulling is not obvious.

Leaving many industry insiders worried that Cisco has chosen a “congestion” on the road, filled with a rival. It has not yet formed its own competitive advantages Cisco wants destined not easy to break.

The acquisition of more and more “soft”

Cisco’s development process has always been associated with the acquisition. Public information, Cisco almost every six weeks will launch a takeover.

Before the acquisition of cloud security firm CloudLock, Cisco has gradually acquired Things startups Jasper Technologies, hybrid cloud service providers CliQr, chipmakers Leaba, cloud search technology start-ups Synata.

It is worth mentioning that Cisco in February to $ 1.4 billion income shopping network platform provider Jasper Technologies, Cisco is not only the past two years, the biggest deal, also considered to be the largest merger in the field of things a lot of people in the industry one. After the acquisition, Jasper can not only provide Cisco networking platform that can expand Cisco’s security, advanced analytics and other networking services.

The recent acquisition of cloud security company CloudLock, are mainly used to strengthen security technology cloud. Acquired in March cloud search technology start-ups Synata, is used to support Cisco’s cloud-based collaboration services “Cisco Spark” end to end encryption services.

Also in early March launch of CliQr USD 260 million acquisition of its technical essence is to help customers select the most suitable cloud service providers.

“Not only these five acquisitions, Cisco’s recent multi acquisitions revolves around cloud computing, software and services large data, expand the” Cisco’s cloud computing and insiders digital service sector pointed out that with the hardware more standardized software gives hardware the soul, innovative IT industry increasingly occur in the software field. By hardware such as routers and switches, Cisco fortune, acquisitions are occurring more and more in software and services.

Typically, it is determined whether or not the acquisition is successful venture is nothing less than whether the acquisition of a controlled and whether the acquisition fit the company long-term development and the interests of the two standards.

The source admitted that the subject must meet Cisco acquired by the transformation direction. The senior vice president of Cisco’s global cloud business two years ago, Nick Earle told the media made it clear that, in recent years, Cisco launched the acquisition of up to 173, all with cloud computing, big data correlation.

In fact, half of this year’s five acquisitions, Leaba acquisition only semiconductor company, is one of the few in recent years, a Cisco hardware acquisitions. It is reported that, Leaba products will become part of Cisco’s core hardware acquisition. In this regard, while the person also said that the final acquisition of the hardware but also software and services in order to expand the extension.

Specific to the mode of acquisition point of view, compared to many companies adopted “She Tunxiang” acquisition mode, willing to spend billions of dollars, will inevitably produce integration in place, rejection reactions. Cisco’s acquisition of more than trace amounts generally less than two digits, like “chipping away” “ism” appear to be more prominent.

“Not only is Cisco’s acquisition model, but also foreign IT enterprises generally acquisition of style ‘Alliance founder Wang Yanhui China Mobile, frankly, a relatively small amount of controlled acquisitions, integration of the difficulty, the risk of failure coefficient; and in view of the technology giant in the field of hardware has become oligopolies and barriers to entry, a large Zaixun find suitable acquisition targets difficult. And software, services and other areas are full of small businesses everywhere, and the software is derived from services, which also fit the needs of the present with Cisco as the representatives of international IT giants from hardware to “software and service” orientation transformation.

And He Jun, general manager of Cisco Greater China Cloud computing and digital media services sector last year had publicly stated that “a new era of IT really can not use the traditional thinking, innovation comes from small US companies, shares of Cisco do not want to stifle this innovation . ”

More and more difficult nut to “bone”

Behind the frequent acquisition is Cisco’s strategic transformation.

According to Cisco’s John Chambers soul-type figure division, from 2010 to 2030 it will no longer be the information age, but the digital age. He made it clear that “all things Internet” will promote the growth of Cisco’s next decade.

Cisco at the end of 2012 for the first time that “all things Internet” strategy. It is also the first dedicated to “all things Internet IOT” of the company. Then put forward the vision of all the global cloud joined together to establish a unified data platform –Intercloud worldwide. By Intercloud, Cisco wants to isolate the cloud together, to break down barriers to data, promoting the arrival of a new wave of all things Internet. It is seen as Cisco’s strategic transformation engine of development.

Around the “all things Internet” strategy, Cisco’s business structure has also changed. Data center virtualization, software, security, and other cloud by Cisco as a key growth area, especially in the data center business is placed Cisco’s expectations.

“Cisco’s strategic transition path is clear, but the performance boost is not obvious.” An IT industry observers have pointed out, Cisco in May 2011 after the reorganization of the transition, clearly aware of the need in addition to the traditional hardware and software to find, new growth pole of services and other areas.

However, nearly three years of earnings data show that the traditional product category still accounted for over 70% of income, no service revenue is always less than 30%. 2015 fiscal year report shows that service class income share holding of 23.2%, compared to fiscal 2014 decreased 0.1%. Specific to the business income, routers, switches and other still occupy nearly half of total revenue. The data center business is only $ 3.22 billion, accounted for only 6.55% of total revenue, in fiscal year 2014 also accounted for only 5.60%.

At the same time, “all things Internet” Cisco’s strategy to enhance the market value is not significant. As of July 5, Cisco shares closed at $ 28.43, the market value of about $ 142.995 billion, less than March 28, 2001, Cisco peak of $ 555.44 billion 1/3.

Many people in the industry view, the current “cloud computing”, “big data” are two major trends in the IT industry innovation, but are two sides of the same coin. Cisco selected transition road no doubt, but a lively, bustling and full of rival.

According to the latest data for the first quarter Synergy Research Group released: AWS with 31% market share, still dominate the cloud services market; Microsoft, IBM, Google in the second echelon, a total of 22% of the market share. Industry consulting firm Gartner published last August in the analysis report, AWS has a computing power of 14-bit computing the sum of the competitors ability 5 times. The second tier of Microsoft and Google, also by more than 100% annual growth rate of struggling to catch up.

“Right now occupies the tip of cloud computing are defended by the enemy and doing my part. Cisco does not fear layout contrary to industry trends, but finding a place of their own lack of differentiated competitive advantage.” Societe Generale Securities (7.690, -0.02, -0.26%) iT industry analyst who asked not to be named, said the Amazon in 2006 took the lead in the layout of cloud computing, e-commerce and its computing capacity has become an absolute advantage. Microsoft in personal and business software, Google in Web search and advertising algorithms form their own competitive barriers.

Clearly, Cisco recognizes its own cloud computing software platform to build on and opportunities have been missed, and the lack of killer embarrassment identity. After it raises all Internet strategy, it represents itself will focus on cloud computing software and hosting services.

However, it also appears to be too perfect.

“IT enterprise cloud computing business had not split, but mutual integration.” The analyst said, Amazon, Microsoft, in addition to providing a platform software, accompanied provide hosting services; on the other hand, Cisco is hoping to open up the Amazon, Microsoft , Google and other cloud their closed environment, “Cisco so directly out of” the analyst said, valuable imaginative cloud computing market, the opportunity to leave a little striking.

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How thin the thinnest solar energy? The latest record was 1 micron. This is equivalent to one percent of the diameter of a human hair, which is the number one percent of traditional standard solar cells.

Ultra-thin, if realized, solar cells will become more broad application space, no longer confined to the ground station or the roof. PV systems can be attached to a variety of surfaces, such as wearable energy equipment as well as vehicles, appliances, buildings.

Recently, South Korean scientists Juho Kim et al., “Applied Physics Letters” (Applied Physics Letters) published the latest research, the introduction of ultra-thin solar cells. Although thin, but the battery is not low conversion efficiency, compared with a thickness of about 3.5 m solar cells, it can produce the same power, but the thickness is reduced to a quarter.

Korean researchers try to inorganic compound semiconductor devices and micro-battery bendable or malleable substrates together, by reducing the thickness of the battery to increase its flexibility for the use of these micro-cell device as clothes, skin and other wearable portable electronic device It provides the possibility of power.

In the past, production, due to the electronic components that need to be adhered to the substrate, the thickness of the adhesive will be an additional battery, the new study uses a “cold welding” method, the material in the top layer of photoresist 170 degrees Celsius By melting, and then welded to the electrode substrate. After the resist will be stripped in the cooling process so that adhesive does not cause an increase in thickness of the battery.

Reducing the thickness of a microelectronic device’s battery is conducive to adapt to a variety of electronic devices for everyday use in the extreme case of bending. In general, the thinner the microelectronic devices, by bending of the pressure the smaller, more easily bent. Meanwhile, the admirable flexibility to carry around electronic devices often require continuous power supply, the experimental results and theoretical analysis show that happens, micro-thin solar cell in the case of extreme bending power more durable. Whether in the continued supply of electricity or the cost of production, we have a great advantage.

Research produced a solar cell material is a micro semiconductor gallium arsenide, reuse mainly by a transfer of the transfer-printing technology, the battery electrode substrate through the bottom of the photons reflected back photovoltaic cells to achieve.

This ultra-thin solar cells are very thin and flexible, it can be wrapped pencil week. Many wearable device limited battery size and weight can not be applied to promote, but this battery feature high flexibility and light weight, will help promote the production of wearable electronic devices, such as powered smart glasses can also be incorporated into clothing wearable device for power supply.

In addition, the future potential of the material, solar cell applications is expected to create many new fields. Like the weight of the more sensitive areas of spacecraft or upper-air sounding balloons, ultra-thin solar cell applications has important scientific value. Glass, fabric, paper, plastic and other materials can be used as a battery carrier and greater value.

In fact, by the end of February this year, researchers at the Massachusetts Institute of Technology had developed the so-called “world’s thinnest and lightest” solar cells. Which solar cell thickness of 2 m, is twice the product development team in Korea. Researchers call it thin enough to be placed in a soap bubble without it cracking. In the wearable device, since the solar cell is very light, it was dressed users can not even see it there. However, MIT at the time of this solar cell conversion efficiency is not very high, and the study of South Korean scientists will further optimize the conversion efficiency of this issue.

However, MIT and South Korean scientists have developed a new ultra-thin solar cells are still in the proof of concept stage, put into real commercial needs time.

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