To protect electronic assemblies assembly-friendly, safe and virtually designed housing are needed. However, users also require user editing capabilities.

The wide range of applications for housing for electronic modules, modules and functional units requires some important properties. These are primarily the protection from negative influences such as moisture, dirt, dust or electromagnetic radiation, but also other functional properties such as easy assembly of electronic components, adaptive and robust construction, durability, and a modern and graceful design.

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In addition to these factors, the efficiency of the housing used plays an important role. Because only at a fair market price find a modern design, functional and efficient housing their way into industrial applications.

Proven manufacturing processes and suitable material

Considering many of the above features, so provide for the housing construction in some materials. In addition to the already long-established materials such as plastic and aluminum steel is more often used in the case construction. Mainly by manufacturing processes such as extrusion, many of the housing units and components in the form of aluminum profiles in various, complex geometries and contours can be produced inexpensively. In addition, eliminating the need for additional post-processing of the extruded profiles, by adhering to the tight tolerances in the extrusion process.

The design of the housing AKG series consists of two extruded aluminum this half-shell profiles, which form a tube with a special tongue and groove system assembled and installed by frontally bolted cover plates. The many forms of housing profiles enable various functionalities such as wall and ceiling mounting with integrated brackets, mounting rails by special brackets, improved cooling of electronic components, thanks to built-in cooling fins and, not least, an elegant outer appearance, which is realized with plastic design elements.

The integration of circuit boards or electronic components in a closed housing is particularly problematic when these are fitted with connectors on multiple pages, displays and switches, and must be passed through openings in the housing wall or the cover plate to the outside. For such applications, the housing GD series was developed, which is characterized by a particularly installation-friendly design and various functional properties.

Easy installation thanks to slide-in cover plate

The open-sided, U-shaped housing sections have built-in guide grooves for receiving electronic components or circuit boards and retractable cover sheets, which can be varied in thickness and thus the stability. By mechanical machining of the cover plates of the receiving devices such as LCDs, the connector or switch is enabled, which are then inserted together with the circuit board in the housing profile.

The fixation of the cover plate is carried by the front and back covers with inner shadow gaps which compensate not only the manufacturing tolerances, but also prevent deflection of the cover plate. For applications with a high heat release said cover sheets can be replaced by an adjusted by milling heat sink for cooling of electronics.

The case series GD is default black or anodised available in four different widths and six length variants, as well as in the finishes. The special geometry of the housing profile allows the recording of membrane switches or front panels. In addition to the standard versions, the housing may machined to customer, be surface treated and printed.

Due to the impact of Apple to Samsung, Samsung this year and only iPhone 6/6 Plus processing chip – that’s 30% A8 production orders. For Samsung had a monopoly on the iPhone processing chip, the share fell so heavily is clearly inconsistent with the company’s development strategy, so they want him next year in A9 chip get more benefits. Wei Feng network news, according to South Korean media reports, Samsung has recently issued a hint of the upcoming production A9 chip.

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Reported that the executives in charge of Samsung’s semiconductor business, Kim Ki-nam told the media that they were about to apple production 14 nm processors, and 14 nm is rumored A9 chip production process. This statement is also considered Samsung has solved the 14-nanometer process among yield problems. Kim Ki-nam said Samsung’s earnings will get a substantial growth through A9 orders. The current A8 chip production orders were from Taiwan Semiconductor Manufacturing Co. (TSMC) accounted for 70% of the share.

TSMC has issued an official press release a few days ago, claiming that its third-quarter profit growth in 2014 could reach a record 47%, the main reason is iPhone 6/6 Plus popular on a global scale. I believe this news, Samsung also makes very jealous, because a major supplier A series chip was originally them. In addition, there is news that the list of suppliers A9 chip will only Samsung and TSMC.

2014 LTPS TFT LCD panel shipments into the area and only 56% of capacity, which means that many of the existing production LTPS panel makers are still improving efficiency, improve product yield and LTPS panel space quality stability. LTPS panel will present five future development trends: First 2017 LTPS TFT LCD production capacity will reach 12.2 million square meters, a substantial increase of 66% compared to 2014; Second LTPS TFT LCD capacity utilization is generally 75% to 85%; Third, LTPS TFT LCD demand from 2014′s 3.1 million square meters in 2017 to grow to 6.4 million square meters; Fourth LTPS panel area shipments in 2014 accounted for only the actual input capacity of 56%, in 2015 this proportion increased to 60% , 2016 and 2017 will remain at 62%, which indicates that the area of ​​conversion LTPS panel production capacity and shipments are still gaps between; Fifth LTPS LCD panel will continue to face high-resolution amorphous silicon, Oxide and AMOLED panels competition.

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With panel makers, especially in mainland China panel makers to actively invest LTPS TFT LCD (low-temperature polysilicon thin film transistor liquid crystal display panel) new plant to supply the smart phone panels, many people have begun to worry LTPS TFT LCD will supply surplus, thus affecting smartphone panel the whole supply chain. For some new vendors, LTPS panel plant operational efficiency and yield is the need to solve a big problem.

NPD DisplaySearch consider the following points will pose a threat to the market for LTPS TFT LCD panel demand:

First, amorphous silicon (a-Si) TFT LCD technology and technology continues to challenge the limits, and continue to make breakthroughs. For example, currently has a-Si TFT LCD mass production 300PPI (such as 4.7 inches 1280 × 720) smartphones panel. Many panel makers are actively developing amorphous silicon (a-Si) TFT LCD technology to produce 5.0 inches Full HD (1920 × 1080) of the panel. A few years ago on a-Si (amorphous silicon) can not do 300PPI more products this argument has been broken by advances in technology. Panel makers are still constantly challenging technical limitations of a-Si. Long time compared with the LTPS technology, a-Si is undoubtedly the most cost-effective option.

Second, the oxide (Oxide), also known as indium gallium zinc oxide (IGZO), is also actively expanding in the smart phone market share share. Which Xiapuyou is aggressively expanding the use of Oxide technology in smart handheld devices, and with greater capacity 8th generation panel production line.

Third, actively promote the Samsung AMOLED display screen technology, the color is stronger than LCD. Samsung AMOLED display overcapacity enormous pressure, and therefore are actively looking for more external customers to consume capacity. Generally, if the screen size and resolution of the same panel of smart phones, AMOLED LCD panels and more than 10% to 15% premium. But Samsung display are more flexible to adjust its AMOLED panel premium, especially in the Chinese market, hoping to expand the AMOLED panel shipments reached purposes.

Fourth, the world’s largest user of LTPS panel is Apple iPhone. Except in special LTPS specifications Apple used, the remaining majority of LTPS TFT LCD panel is using a smart phone manufacturers in mainland China. Chinese mainland smart phone manufacturers adopt a “high standard, low price” business strategy, leading panel makers had to endure tremendous downward pressure on prices. Downward pressure on prices may be greater LTPS panel aspect, because it’s the average price is higher than the a-Si TFT LCD panel.

Things to bring all things Internet, machine-to-machine all kinds of new possibilities, wisdom, control, data acquisition, intelligence systems, but also to many individuals, startups or major companies began to develop innovative products in order to obtain consumer of all ages, it also means that things are a huge disruptive market.

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According to IDC research predicts that in 2020 there will be 30 billion networked devices, the market revenue will reach 7.1 trillion dollars in size, and now its application has been all over the retail, transportation, health care, industrial manufacturing and other industries. Things diversified development, but also to various technology giants competing to invest, to launch a variety of solutions or alliances. In order to simplify and accelerate the deployment of Things output devices, ARM has also announced the launch of the new software platform ARM mbed IoT Device Platform and mbed OS operating system.

Among them, ARM mbed platform for networking devices are particularly sensitive to energy consumption and pricing Things device design, which combines Internet protocol, information security and standardized management, and also has mbed hardware and software ecosystem as a backup, so that new committed to the development of enterprises to create differentiated product features. Krisztian Flautner networking business unit general manager, ARM pointed out, there are still many things device in isolation is not linked, it is difficult to imagine that all devices can communicate in a truly comprehensive link to the world, and mbed platform to solve this problem. mbed platform provides a common set of communication transmission and management tool suite can be applied to a variety of purposes.

The mbed OS is based on the ARM Cortex-M processor designed operating system, which supports all major standards, including Bluetooth Smart, Thread, Wi-Fi, 2G, 3G, CDMA communication technology. ARM also stressed that will expand its ecosystem through open standards, allowing businesses to more quickly access large networking markets. ARM mbed OS will begin offering in the fourth quarter as the initial development partners, is expected in 2015 the first batch of devices using mbed OS will come out.

U.S. sapphire materials suppliers and equipment manufacturers a very special advanced (GT Advanced Technologies) on October 6 suddenly filed for bankruptcy protection. As at September 29, 2014, still holds a very special advanced $ 85 million in cash. A $ 578 million supply agreement signed with Apple basis before, very special need to provide a certain number of advanced sapphire crystal rod to give Apple, but because of the long grain yield as expected, Apple unwilling to continue to pay the remaining money; plus pole Sapphire Dan Changjing with special advanced drilling equipment factory Xin Jing dispute lawsuit against Taiwan, the amount of equipment needed to return $ 24 million to Xin crystal diamond, cash-strapped cause problems.

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TrendForce’s green energy career at LEDinside observation pointed out that the results actually tracked. Despite the very special advanced with nearly 2,000 crystal growth furnace production capacity to 5.5-inch iPhone 6 Plus Size converter, capable of providing 1,000 ten thousand sapphire protection panel, but due to a very special advanced crystal growth rate while maintaining good at four percent, plus processed into a situation from ingot yield sapphire segment protection panel can not be overcome, the cause can not be imported sapphire protection panel iPhone this year two new machines, but most especially the two companies advanced and Apple also abolished many employees to this project responsible for.

LEDinside said sapphire protection panel will be Apple’s competitors to differentiate important expression. Because Apple has invested a lot of money and patent applications in the layout sapphire protection panel to protect the lens from the camera on the iPhone, Home key to Apple Watch table covers are introduced one by one sapphire glass, sapphire protective panel therefore not impossible to import the iPhone OK, but still needs time to overcome. If all goes well, perhaps equipped with sapphire iPhone protection panel have the opportunity to debut at the end of 2015.

Road iPhone sapphire protection panel listed, still need to overcome three major obstacles

1 long crystal production capacity:

Sapphire protective panel in the supply chain into consideration crystal growth technology can not be ignored. Traditional suppliers such as KY law Monocrystal, Rubicon, Harbin Institute of Technology, Taiwan companies such as poly photovoltaic technology is more skilled, higher product yield, but requires a lot of skilled long-grain division to produce poor mass production. KY law currently able to do more than 90 kg class is only a small number of vendors. The product life cycle is short and the need for mass production of mobile phone industry, there are still a considerable number of threshold to overcome, and therefore had no choice supplier of Apple and more KY law camp.

On the other hand, HEM crystal growth method is very special claim to its high degree of advanced crystal growth furnace automation equipment, and can grow more than 200 kg of single crystal sapphire, very adaptable to mass production, which is the beginning of the selected pole Apple the main reason special advanced cooperation. However HEM France very special product yield is much lower than claimed by the advanced level, it seems that still takes time to overcome technical obstacles. For Apple, if you want to continue future development of sapphire protection panel, you must have enough ingot sources. Currently HEM method and KY France, VHGF law sapphire suppliers have switched certified, so Apple will continue to increase in the future to avoid ingot supplier shortage. Sapphire Dan Changjing for both experienced vendors will have the opportunity to increase the supply of apples, or even get a stable agreement.

2 Cost Capacity:

Currently the size of 5.5 inches, the production cost of sapphire panel thickness of 500 um, at least more than $ 60, for a sell US $ 859 the iPhone 6 Plus, it just costs sapphire protective panels accounted for 7% of the price of the phone. Therefore, how to reduce the cost will be very important topic. Despite boasts a very special advanced laser cutting technology, the sapphire substrate can be thinned and then to fit the traditional tempered glass processing, can reduce the cost of sapphire protection panel, but now it seems that the technology is still some distance away from mass production, is there a more appropriate technology to reduce costs need to do to observe the future.

After processing capacity of 3 segments:

Sapphire protection panel is not simply the sole responsibility of the advent of long-grain plants, as well as cutting and grinding and polishing after the segment, coatings, mimeograph and other processes. Especially in the Cutting and polishing of processing, hard and difficult because of the sapphire substrate material processing, but at the same time there is the problem of fragile, so the segment processing firms also need to actively look for ways to identify with a mass production process in nature.

TSMC announced the 29th leading the field of integrated circuit manufacturing services, the introduction of the industry’s most comprehensive ultra low-power technology platform for the needs of a wide range of technical support and because fast-growing networking and wearable device market to provide the necessary technology to meet market diversification product applications. TSMC said through this technology platform provides a number of process technology to significantly enhance the power advantage to support networking and wearable products, but also provide a complete design ecological environment and accelerate customers’ time to market.

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TSMC said a combination of ultra-low-power process in addition to covering the current 0.18-micron low-leakage process (0.18eLL), 90 nm ultra low leakage process (90uLL) and 16 nm FinFET process, but extended to the new 55 nm ultra-low-power process (55ULP), 40 nm ultra-low-power process (40ULP) and ultra-low-power 28 nm process (28ULP) to support operation at speeds up to 1.2GHz of applications. This covers the 0.18-micron to 16 nm FinFET ultra-low-power process with a combination of energy efficiency for a variety of intelligent networking and wearable products.

Among them, 0.18-micron to 40-nanometer manufacturing process ultra-low power consumption also have the RF and embedded flash memory function, can make system-level integration to effectively reduce the size of the appearance, and by wireless transmission technology product series of things. And compared to the previous generation of low-power process, ultra-low-power process to be able to further reduce the operating voltage up to 20-30%, in order to reduce dynamic and static power consumption, while significantly prolong things and wearable product compact size battery life up to 2-10 times.

Cum co-CEO Dr. Liu Deyin TSMC general manager, said ultra-low power consumption and ubiquitous link function is the key to the success of things, the successful launch of a comprehensive industry-leading technology platform to effectively meet the needs of diverse and innovative networking market . This combination of technologies for a wide range of companies in emerging markets to offer, demonstrated technology leadership and commitment to bring customers the greatest value and help customers build competitive products, the success in winning design cooperation.

In addition, TSMC stressed that customer use of “open innovation platform” provided by both IP Design ecological environment is an important value ultra-low-power technology platform company extra to offer. When the chip designers to new ultra-low-power process design, can be easily re-use the company’s low-power process Silicon Intellectual Property and component database, designed to improve the probability that the first production of successful products to market quickly and achieve goals .

TSMC is expected in 2014 with customers in 55 nm process ultra-low power, ultra-low-power 40-nanometer manufacturing process and ultra-low-power 28 nm process reached a preliminary cooperation in a number of case design and put into trial production in 2015.