Mentor Graphics tools TSMC16nmFinFET + certification process technology

Mentor Graphics Corporation today announced that based on TSMC (TSMC) SPICE simulation tool certification program, Analog FastSPICE (AFS ™) platform (including AFS Mega and Eldo®) adopted a 16nm FinFET + V0.9 certification process technology. V1.0 certification is underway and will be completed in November 2014.

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“Mentor’s Analog FastSPICE platform, AFS Mega and Eldo has successfully reached the 16nm FinFET + technical accuracy and compatibility requirements. Using TSMC 16nm FinFET + technology, customers can be very competitive design through accurate verification solution,” TSMC design senior director of marketing infrastructure Lee Suk said.

Analog FastSPICE platform for nanometer analog, radio frequency (RF), mixed signal, memory and custom digital circuits for rapid circuit verification. For larger circuits, AFS platform also provides high-capacity, high-speed mixed-signal simulation, including the industry’s only comprehensive full-spectrum device noise analysis. Memory and other array-based circuit for, AFS Mega-based “Silicon accurate” simulation.

“In partnership with TSMC, we on the Analog FastSPICE, AFS Mega and Eldo conducted TSMC’s 16nm FinFET + certification, which is another important milestone,” AMS Mentor company DSM department to verify Ravi Subramanian, general manager said. “Through continued close collaboration with TSMC, we will ensure that our joint customers can meet the most complex and highest degree of integration of nano nano analog, mixed-signal and RF design requirements verification platform.”

Mentor Graphics Calibre® and Olympus-SoC ™ platform also passed TSMC’s 16nm FinFET + certification process technology. Olympus-SoC product supports TSMC’s 16nm FinFET + design rules, to provide pin connection, low-voltage wiring to improve and advanced timing closure function, and also supports MCMM optimization. Calibre xACT ™ series of products for long runtime and accuracy improved, so our joint customers can more fully utilize TSMC’s 16nm FinFET + technology.

IC package into the biggest winner

2014 for the IC industry is not quiet year, the largest industry in the last decade to support policies formally introduced this year, the level of capital acquisitions demonstrate unprecedented vigor, but carding industry performance of the company found that corporate profits are still many structural problems imbalance, packaging and testing enterprise performance leader, and the design enterprises either mediocre or decline in performance, to some extent reflects the current IC industry problems.

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Daily News revealed that, A shares 13 IC companies, a total of six grew to maintain performance, including Taiji Industry, Long Point Technology, Nantong Fujitsu Microelectronics three companies net profit growth of more than 100 percent year on year. Beijing Jun, Shanghai Belling three national technology and the sharpest decline in performance of the company were 118%, 48% and 31%.

IC industry can be divided according to the upstream and downstream design, equipment, packaging and testing, manufacturing several areas, A-share companies focused on the design and packaging and testing. This year almost all of the design class enterprise is struggling, several performance decline or even loss of business all from the design companies. The best performing countries in the core with the side only 19 percent reported earnings growth in the electronics industry is not outstanding, but it was the best report card in the first half of listed IC design company can come up with. And several other design class enterprise performance all decline.

End dismal performance design, and packaging and testing side but nice view, many companies this year to usher in performance even big reversal. Changjiang Electronics Technology and Jiangsu Nantong Fujitsu Microelectronics is the packaging and testing of two more well-known enterprises, reporting the results remarkable year, net profit in the first half of this year the two companies are close to 50 million yuan, an increase of respectively 141% and 102%. Another one from the packaging and testing companies in Gansu Huatian Technology, earnings growth also exceeded 36 percent in the first half, time shares Jing Fang Technology net profit increase of 19%.

Insiders said that due to weak industrial base, the financial structure of the problem of domestic IC industry has long criticized the industry, the performance of most enterprises from government subsidies rather than their own operations, and problems faced by domestic enterprises also designed a long time. As we all know, the domestic IC industry at the top of the lack of resources to control, in other words the lack of core competitiveness of enterprises in the design, so the design enterprises in the state caught in long-term survival can only get better when the boom of a product is higher downstream performance. Such ills is obvious, that is, market segments boom erupted uncertainties too high.

And walking foundry model to scale as the scale of the package by the technical aspects of the manufacturing industry impact is relatively small. Analysts say there is no problem as long as the quality and production capacity is guaranteed, whether domestic or foreign orders, such firms can digest, and the more well-known upstream firms, moat after entering their supply chain more secure.

In recent years with the rise of intelligent terminals, mobile phone, tablet, wearable even to the extent of increasing electronic industries, which also makes IC demand surge. In fact, whether foreign or domestic IC design enterprises in recent years because of capacity issues are a headache, a more stable packaging production line, are the meat and potatoes of the industry, which is encapsulated in recent years, corporate performance there are reasons for security. It is worth noting that, before the national release of the integrated circuit industry support plan, will also be locked in the packaging and testing resources and manufacturing sectors.

Spreadtrum before the Nasdaq-listed, RDA, Montage Technology Group have been purple cast and Pudong Branch acquisition and delisting from the Nasdaq, analysts said the company expected that several post-landing A shares, this could break the current situation. The three companies are IC design companies, the former two focus on communications, Montage Technology places do set-top box chips Kyo. From the competitiveness of enterprises and financial data, the strength of these companies are more than the current A-share IC design companies are expected to join them to break the current A-share IC design enterprises Legion strength weak situation.

Definition infrared receiver and common applications

Infrared receiver (also known as the infrared receiver module, IRM) is an integrated infrared receiver diode PD, amplifies, filters, and the comparator output, the IC module. We are no longer making receiver amplifier circuit, so infrared receiver simplifying the circuit.

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Before understand infrared receiver, we first look at what is “infrared.” Infrared fact infrared short, is a spectrum (electromagnetic waves) in between 0.75 to 1000 microns you and I can not see the light. From the above understanding, we can launch, infrared receiver receives the infrared is a kind of thing used to. This thing is there are many names, usually called infrared receiver, referred to as receiver, can also be called an infrared receiver, infrared receiver, infrared receiver module, remote control receiver can also be more complex, that is, after adding a line in the infrared words, such as infrared receiver, then you can learn by analogy, make persistent efforts of the. In addition to Chinese name, English name as well as an infrared receiver, called Infrared? Receiver? Module, called IRM, with international practice.

Then, follow us Chao Yi Electronics engineers to see infrared receiver look like, according to the appearance can be divided into two categories: the nose type, ball type (dot type). The nose can be subdivided into large type in the nose, standard nose, small nose. In addition there are other special, such as ultra-thin, mini, straw hat, patch type, with line receiver.

Apart from the appearance of classification, but also can be classified according to package, this is more accurate. Currently on the market can buy the receiver from the package divided mainly into two categories: pressure model and filling plastic type. In general, nose type are filling plastic type, ball type belongs pressure models. From the two packaging technology, investing large pressure model equipment, the use of plastic bread more expensive, so the overall price to be more expensive, of course, its resistance to light interference stronger, larger acceptance angle (360 degrees round the reception); irrigation glue-type device small investment now made ​​mostly domestic plants glue products, the advantage is cheap, the disadvantage is poor resistance to light interference, the receiver angle is smaller (270 receiving). Of course, there is a false pressure model, the use of plastic irrigation methods to make ball-type, similar to the shape of the die way to do it, but it certainly did not die of a good performance.

Sometimes, the outside receiver also wear an iron vest, so they can receive the head is divided into two kinds of plastic and steel, the benefits are much more than steel outer layer shield against light and the ability to have a certain power interference shielding role, relatively speaking reception performance to stable. Of course, if the product design OK, under the same distance of two pieces of plastic with a reception to be a little further away. Of course, with or without steel prices will have some differences, so the choice to receive or not to take the first concrete steel according to the design to be. With the use of plastic toys products, with the home appliance products in the steel belts are more general.

Most are now available in the market is the integration of remote control receiver, this remote control receiver to receiver module, PIN photodiode and preamplifier IC, integrated in a component, to realize the infrared remote control signal pickup, amplification reconciliation tone, the detector output signal can be decoded directly by the microprocessor.

Infrared receiver is widely used in: air conditioning, fans, heaters, humidifiers, TV, DVD, set-top boxes, car mobile DVD, hard disk player, multimedia hi-fi, digital photo frames, mobile phones, home appliances, computers and peripheral equipment, sanitary sensors , instrumentation, industrial automation, remote control toys, communication equipment, photographic equipment, business machines, financial electronics, automotive electronics, lighting and other fields.

This year the global semiconductor production value will reach $ 322 billion

In 2014, driven by overall economic recovery, smart phones and emerging wearable devices, the end product demand continues to grow, the global semiconductor market value is expected to reach 3,220 billion, compared with 2013 growth of 5.3 percent.

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Industrial Information Institute for Information Industry (MIC) industry consultant and director of the Hong Chunhui pointed out that due to the wisdom of handheld products demand growth in 2014 is quite optimistic about the development of the global semiconductor market; first half of the North American semiconductor equipment book to bill ratio (B / B Ratio) are maintain a 1.0 or above, Japan in June this year also rose to 1.0 or more.

It is worth noting that, in the global semiconductor market in mainland China as the largest source of demand. Hong Chunhui revealed that continent for electronic product manufacturing center, and the majority of the domestic market, mainly for driving the global semiconductor market to the greatest force in Asia; 2013 Chinese mainland market, representing nearly 30 percent of global semiconductor market share, 2014 will continue to increase.

As for Taiwan, the personal computer (PC) market decline rate reduction, continued to rise, such as fingerprint identification and sensor applications emerging growth, as well as advanced manufacturing process and high-end packaging needs, plus the first three quarters of new products and have emerged, semiconductor strong industrial growth; MIC estimates that in 2014 the performance of Taiwan’s semiconductor industry is expected to better than global output value will reach NT $ 2 trillion zero 93.4 billion yuan, compared with 2013 growth of 16%.

Moreover, Taiwan’s IC design industry rely on the Chinese mainland brands very well, but also to benefit from the strong growth trend of the mainland market. Hong Chunhui, said the first half of 2014, due to MediaTek’s multi-core products in mainland China continued to get smart phone manufacturers use to make Taiwan’s IC design industry with outstanding performance in the first half of 2014, compared with the first half of 2013 grew 15%. In addition, the Taiwan panel driver IC vendor’s products are not only favored by Taiwanese panel makers, China and South Korea panel makers are also widely used, making the Taiwan panel driver IC enjoy a very high market share.

Hong Chunhui that the first half compared to the state of high growth, Taiwan’s IC design industry will be relatively slow growth rate in the second half, but remained at a relatively stable high. The second half of 2014 is expected to increase the proportion of 4K × 2K TV, China plans to long-range evolution (LTE) demand will continue upward, so Taiwan IC design at this year’s growth will still be good.

New product launches of mobile communication, not only to stimulate the wafer shipments, will also enable increased demand for advanced process, so the second half of 2014 Taiwan’s foundry industry will continue to maintain high growth momentum, it is estimated in the third quarter 2014 production value of Taiwan’s IC manufacturing growth rate will reach 8 percent.