Mentor Graphics Corporation today announced that based on TSMC (TSMC) SPICE simulation tool certification program, Analog FastSPICE (AFS ™) platform (including AFS Mega and Eldo®) adopted a 16nm FinFET + V0.9 certification process technology. V1.0 certification is underway and will be completed in November 2014.
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“Mentor’s Analog FastSPICE platform, AFS Mega and Eldo has successfully reached the 16nm FinFET + technical accuracy and compatibility requirements. Using TSMC 16nm FinFET + technology, customers can be very competitive design through accurate verification solution,” TSMC design senior director of marketing infrastructure Lee Suk said.
Analog FastSPICE platform for nanometer analog, radio frequency (RF), mixed signal, memory and custom digital circuits for rapid circuit verification. For larger circuits, AFS platform also provides high-capacity, high-speed mixed-signal simulation, including the industry’s only comprehensive full-spectrum device noise analysis. Memory and other array-based circuit for, AFS Mega-based “Silicon accurate” simulation.
“In partnership with TSMC, we on the Analog FastSPICE, AFS Mega and Eldo conducted TSMC’s 16nm FinFET + certification, which is another important milestone,” AMS Mentor company DSM department to verify Ravi Subramanian, general manager said. “Through continued close collaboration with TSMC, we will ensure that our joint customers can meet the most complex and highest degree of integration of nano nano analog, mixed-signal and RF design requirements verification platform.”
Mentor Graphics Calibre® and Olympus-SoC ™ platform also passed TSMC’s 16nm FinFET + certification process technology. Olympus-SoC product supports TSMC’s 16nm FinFET + design rules, to provide pin connection, low-voltage wiring to improve and advanced timing closure function, and also supports MCMM optimization. Calibre xACT ™ series of products for long runtime and accuracy improved, so our joint customers can more fully utilize TSMC’s 16nm FinFET + technology.
