TSMC announced the 29th leading the field of integrated circuit manufacturing services, the introduction of the industry’s most comprehensive ultra low-power technology platform for the needs of a wide range of technical support and because fast-growing networking and wearable device market to provide the necessary technology to meet market diversification product applications. TSMC said through this technology platform provides a number of process technology to significantly enhance the power advantage to support networking and wearable products, but also provide a complete design ecological environment and accelerate customers’ time to market.
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TSMC said a combination of ultra-low-power process in addition to covering the current 0.18-micron low-leakage process (0.18eLL), 90 nm ultra low leakage process (90uLL) and 16 nm FinFET process, but extended to the new 55 nm ultra-low-power process (55ULP), 40 nm ultra-low-power process (40ULP) and ultra-low-power 28 nm process (28ULP) to support operation at speeds up to 1.2GHz of applications. This covers the 0.18-micron to 16 nm FinFET ultra-low-power process with a combination of energy efficiency for a variety of intelligent networking and wearable products.
Among them, 0.18-micron to 40-nanometer manufacturing process ultra-low power consumption also have the RF and embedded flash memory function, can make system-level integration to effectively reduce the size of the appearance, and by wireless transmission technology product series of things. And compared to the previous generation of low-power process, ultra-low-power process to be able to further reduce the operating voltage up to 20-30%, in order to reduce dynamic and static power consumption, while significantly prolong things and wearable product compact size battery life up to 2-10 times.
Cum co-CEO Dr. Liu Deyin TSMC general manager, said ultra-low power consumption and ubiquitous link function is the key to the success of things, the successful launch of a comprehensive industry-leading technology platform to effectively meet the needs of diverse and innovative networking market . This combination of technologies for a wide range of companies in emerging markets to offer, demonstrated technology leadership and commitment to bring customers the greatest value and help customers build competitive products, the success in winning design cooperation.
In addition, TSMC stressed that customer use of “open innovation platform” provided by both IP Design ecological environment is an important value ultra-low-power technology platform company extra to offer. When the chip designers to new ultra-low-power process design, can be easily re-use the company’s low-power process Silicon Intellectual Property and component database, designed to improve the probability that the first production of successful products to market quickly and achieve goals .
TSMC is expected in 2014 with customers in 55 nm process ultra-low power, ultra-low-power 40-nanometer manufacturing process and ultra-low-power 28 nm process reached a preliminary cooperation in a number of case design and put into trial production in 2015.
