Cisco said Tuesday it will acquire startups CloudLock. The company helps enterprise customers monitor and control employee usage of cloud computing services.

The deal price was $ 293 million in cash and stock. Cisco agreed to join Cisco’s CloudLock employees extra incentive plan.

Cisco is the world’s largest network hardware vendors. The company will through the acquisition of information to assist in the development of security software and services. 2013, Cisco price of $ 2.7 billion acquisition of information security hardware and software vendor Sourcefire, and again in 2015 for $ 635 million acquisition of OpenDNS. The latter use of the Internet domain name server to intercept information security attacks.

CloudLock Massachusetts Waltham. Recently, the use of employees for Salesforce and Dropbox and other cloud computing services are becoming more frequent, and these services may save sensitive company information. CloudLock developed technology to track how employees use these services, and deploy security policies, such as restrictions on the transfer of staff and the way to get those files.

CloudLock has 130 employees, the future will become part of Cisco Information Security Group. The business is responsible for Cisco’s senior vice president David Ge Kele (David Goeckeler). He said that Cisco hopes to promote the independence of each section of information security products, and gradually build a framework to make it whole.

Ge Kele in an interview said: “The problem of information security that provide only a single aspect of the best products is not enough.”

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According fool.com website reported today, April, well-known US stock market commentator Jim – Kramer (Jim Cramer) published such remarks views: Intel should be split in upcoming rapid growth of the business, such as data center business group, was networking and storage devices split into a company; the relatively slow growth of the PC business spin-off to another company.

However, this view is no practical significance, for the following reasons: Kramer said such a manner that there is a fundamental problem of the spin-off, the so-called “high-growth” businesses rely on the PC being developed by technology.

In most cases, the spin-off by Kramer, Intel is a $ 30 billion and nearly 300 million units of PC based technology market development, will be used as the cornerstone of its server chip business. Most of Intel’s chip business networking group is sold for the PC market, the development of products, of course, things are also selling some business group level server chips.

If Intel to split into two companies, R & D expenditure will be doubled, and that the shareholders of the so-called “rapid growth” Intel and the “slow growth” contrary to the values ​​held by some Intel.

Generally speaking, Intel chips independent production is a competitive advantage. However, to produce a continuous chip business make sense, then it needs to maximize the use of its production capacity.

However, Intel’s PC business is much smaller than its data center operations. In fact, in the present situation, Intel’s data center business group and the two things are difficult to sufficiently maintain the operation of a tip of the plant.

Thus, according to this situation, we can conclude that if Intel split into two companies, two company’s profits will be lower than this current.

According to “Financial Times” reported June 26, the chip maker Intel is considering the sale of its network security business. The report said, Intel has been working with its bankers on how to handle its network security services to discuss the sector is Intel spent $ 7.7 billion acquisition in 2011 McAfee.

One aspect of Intel spokesman was unable to comment immediately on the matter.

It is reported that Intel had said in April that it plans to lay off 12,000 people worldwide, which with its business focus moves to re-up on a microchip fabrication off.

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In the “2016 Symposia on VLSI Technology” (June 13 to 17 in Honolulu held), following “Plenary Session” (plenary session), on the Session T2 “Technology Highlighted Session”, also emerged a lot about 10nm process technology papers. 86 papers of this Symposium adopted, there 12 was chosen as the focus of the paper, including four on the Highlighted Session Session T2 publication.

These objects thesis dissertation is the use of Si, SiGe, InGaAs channel different materials FinFET technology, and STT-MRAM. At the meeting, discussions are heating up at the end of the meeting, many listeners will be surrounded by the publisher, the atmosphere is very warm.

In recent years, with the miniaturization of silicon integrated circuits exposed limitations, researchers focus on the development direction after the demise of Moore’s device technologies discussed. Despite this situation, but in this Highlighted Session, on 10nm process technology, the device is still a lot of papers, it showed higher performance-based fine still advancing, still going strong.

Realize four kinds of Vth

First, Samsung Electronics announced the 10nm process Si FinFET technology (lecture No. 2.1), its main feature is to achieve four kinds of Vth by improving the gate stack, improved fin formation, contacts and many other processes.

All parts have achieved miniaturization, compared with 14nm technology, speed increased by 27% at the same speed, power consumption reduced by 40%, and the SRAM cell size to 0.04μm2. Although Korea recently published a paper on the quantity is less than in the past, but this release is still showing strong integration of Samsung technology.

Next, IBM and GLOBALFOUNDRIES released using SiGe as a channel material 10nm node technology (lecture No. 2.2). A big difference between this technology and Samsung is using a SiGe channel pMOS, nMOS using conventional silicon.

On paper shows that by using the pMOS Ge concentration of 20% of SiGe, not only the mobility increased by 35%, effectively increase the current 17%, also significantly improved NBTI (Negative Bias Temperature Instability, negative bias temperature instability). The paper noted that the key is to improve the properties by reducing the oxygen concentration to reduce defects. But also it provides four kinds of Vth, and Samsung’s 10nm platform in stark contrast.

InGaAs transistor find practical road

TSMC third stage, introduced the use of more advanced than SiGe of InGaAs FinFET (lecture No. 2.3). InGaAs channel is formed by epitaxial growth on 300mm silicon wafers. Realized on a silicon wafer with the grown lattice matched InP substrate device the same performance, reaching the largest existing InGaAs transistor on-state current, which is a major technological progress. To put into practice the InGaAs, the key is to grow, process, and all other sectors should be using a silicon platform, the paper pointed out the ways to achieve this goal.

Finally, the US TDK Headway Technologies released a paper (Paper No. 2.4) on the improvement of STT-MRAM writing speed. Without reducing data storage characteristics of the premise, to reduce by the write pulse width to 750ps, the successful use of 8MB array implements 3ns pulse writing. By implementing sub-nanosecond high-speed writing, it opened the way to MRAM LLC cache road.

About the future 10nm process technology, in addition Highlighted Session described above, but in Session T9 “Technology Scaling Beyond 10nm” is also published a number of related papers, including papers focus. For example, TSMC announced the area 0.03μm2, Samsung’s smaller fine than SRAM cell described previously (Paper No. 9.1). IBM released Ge concentration up to 60% of the SiGe-FinFET technology, proved this technology enables effective gate insulating film thickness of 0.7nm, the fin width of 4nm finer (Paper No. 9.3).

In the case of people already realize miniaturization will soon reach the limit, indicating that can improve the performance by fine papers was endless, indicating that after beyond 10nm process, at least for some time, the device performance may also continue to increase. I sincerely look forward to after the technology beyond 10nm, continue to move toward 7nm node.

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Board US electric car manufacturer Tesla company just to Solarcity co-founder and CEO Leif Lyndon (Lyndon Rive) submitted an offer to acquire the latter. In other words, the elon Musk, CEO of Tesla as the company intends to acquire its own chairman solar company SolarCity. In fact, SolarCity is Musk’s household photovoltaic power generation project company.

In a letter to Leif offer letter, Tesla Board proposed acquisition SolarCity all outstanding common shares as trading returns, SolarCity will receive Tesla’s common stock, that is, the price is equivalent to a share deal US $ 26.5 to 28.5 US dollars.

Tesla shares in accordance with the previously announced proposed transaction, the total stock trading this stock exchange price of approximately $ 2.8 billion.

Tesla acquired SolarCity’s initiative will help Musk early as possible “to use fully sustainable fuel to accelerate the transformation of the world transportation industry” targets.

Musk in a conference call said, “This is our many years of heated debate and has been considering the matter from the perspective of product integration and provide regular users and business users experience the most convincing point of view, we really need to achieve tighter product integration. “he also said,” the timing is very appropriate, because Tesla is best to take measures to solve the problem of storage battery, and will be able to provide some Solarcity just exciting products. ”

If the deal goes well, then all of the Tesla brand products will fall. Musk said the biggest difference is, sales and enforcement costs will decline as Solarcity and Tesla products will be integrated.

Musk said, “decided to merge the two companies into one, is independent of the shareholders other than the result of my vote as long as the majority of shareholders except me favor, then this decision must push ahead. it’s that simple, we may propose the idea, but the final decision should also be decided by the shareholders. I personally think that this is very easy to understand. over time, more and more people will understand the truth. ”

The following is the contents of Tesla’s quotations.

Dear Linton:

You can submit to Tesla and SolarCity Board of Directors to acquire ordinary shares in exchange for all of your company’s outstanding common shares of the proposal, we feel happy. According to the results of due diligence matters, we propose to follow 0.122 times 0.131 times the price of ordinary shares of Tesla common stock in exchange for SolarCity. That is to say, the equivalent price per share of $ 26.5 to 28.5 US dollars acquisition of SolarCity all shares outstanding, the price 21-30% higher than today’s closing price of SolarCity. We believe that our proposals offer fair and reasonable, but also to allow SolarCity and its shareholders to accept the value, but also allow the shareholders the opportunity to participate SolarCity related issues after the integration of the company, as they will hold the transaction by Tesla equity.

Tesla Board potential integration prospects SolarCity and Tesla are very excited. We believe that the possibility of co-products, services and other aspects of the operation will further increase, and this merger will be beneficial to our company to create its own core competitiveness, and be able to walk in the forefront of the market, continue to develop innovative solutions, and launch a sustainable transportation energy. We believe that both sides of the merger will bring significant benefits both our shareholders, customers and employees.

We are committed to advance this possible deal, which SolarCity and Tesla respective shareholders are reasonable and fair. To ensure this, Tesla prepared to allow the two companies disinterested shareholders to vote on this proposed transaction, and on the advice of the majority shareholder, contributed to the merger to produce the perfect ending. In addition, since Musker and Antonio Gracias (Antonio Gracias) have a stake in the two companies, they will not be in the board meetings of both companies vote on the proposal. We believe that any deal to go through the board of directors of the parties in consultation and careful deliberation, but also give full consideration to the views of our respective shareholders.

Our proposal is based on the results of due diligence, after the final transaction documents mutually agreed to negotiate after the final approval by the board of directors of Tesla decision. Although the transaction would also be subject to routine routine conditions, but we believe that Tesla can be well in a more rapid way to coordinate and complete the transaction. We do not want a major regulatory or other obstacles arise in successfully advancing this allows both sides to benefit from mutual transactions.

Tesla expect the two sides in a friendly manner to advance the deal.

We hope that further consultations on the potential transaction with you and want to quickly reach a final transaction agreement.

Tesla Board Sincerely,

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In the recently held a new conference glory Huawei Huawei Fellow Yiwei Xuan cloth, Hass unicorn series chip cumulative shipments have exceeded 80 million. This is a remarkable achievement, however, Kirin Hass chip shipments to break one hundred million, but also further enlarge and strengthen, in particular, to dare to challenge industry leader Qualcomm Snapdragon chip.

As we all know, the chip is one of the “core” power boost mobile phone industry continues to move forward. Especially with the growing competition in the market for mobile phone manufacturers, if not self-development of the chip, you need to use third-party chip, which is likely to lead mobile phone manufacturers to pay higher costs, more flexibility but can not define your own products, and even affect the time new products, it is difficult to get rid of product homogeneity, can not give users more differentiated experience. So many current phones manufacturers have started to increase investment in research since the chips, hoping to seize the initiative in the future product innovation and market competition.

However, review of the current number of Chinese mobile phone companies really have very few self-developed chip manufacturers. Although the latest Chinese mobile phone shipments data, has occupied 90% of the domestic mobile phone market share, but “Delta does not increase profits,” the phenomenon is still quite prominent. One very important factor is that most manufacturers are still heavily dependent on the use of chip Qualcomm, MediaTek and other vendors. This is tantamount to disguise their work. Huawei is one of the few Chinese mobile phone manufacturers continue to invest in research since the chips, and has a certain strength to compete with the international chip giant manufacturers. Especially with the unicorn 950 launch and the first equipped with the chip’s annual flagship phone Mate 8 release, Huawei declared successful counter-attack in the mobile phone chip market.

It is reported that Huawei’s self-developed chips have been the case without human attention quietly gone through 20 years of history. Since 1991, Huawei established ASIC Design Center, 2004 Hass Semiconductor Co., Ltd. was founded; started to develop smartphone chips from 2006 to 2008, announced the first mobile phone chip K3V1, and then in 2012 launched the smallest quad-core K3V2 processor and to achieve ten million commercial; from 2013 to further clarify the use of SoC architecture, introduced support for LTE Cat4 Kirin 910 quad-core processor, and a variety of large-scale commercial on Huawei’s flagship smartphone, the world’s first launch in 2014 supports LTE Cat6 standard Kirin 920 chip, introduced in 2015 and the successful Kirin 930/935 chip scale applications on the flagship model, and then introduced the industry’s first commercial 16 nanometer technology chips Kirin 950 SoC, Huawei has been in the mobile phone chip this “no return” on courage.

The past two years, Kirin chips gained more and more recognized by consumers, access to application on a series of Huawei mobile phones selling models, the current overall chip shipments unicorn show rapid growth. In the new conference, Huawei’s first full-mode chip re-launched Kirin 650, become another important milestone in the development of Huawei Kirin series chip, chip Kirin also shows the international advanced level in technology and further shorten the distance.

Known as the Pearl of the chip industry on the crown of ICT, and self-study of mobile phone chips this road is full of obstacles. Not only a huge investment, and each first silicon failure, may bring up to tens of millions of huge losses. Many lack the financial and technical strength of the enterprise despite also want to practice self-developed road, but in the face of enormous difficulties and risks, had to give up. “Huawei from the outset, chose the most difficult road to climb, I hope that through continuous investment terminal core chip R & D, to master the core technology to build long-lasting competitiveness, so as to provide differentiated the best experience.” Ai Wei said.

Not long ago, Huawei CEO Ren Zhengfei, Huawei’s terminal proposed future revenue target of up to five years, $ 100 billion, which means that Huawei’s terminal will surpass Samsung, Apple in the global mobile phone market share but also grown exponentially. Hass unicorn chip this “nuclear umbrella” will play a crucial role. In addition to meet their supply needs outside Hass Kirin should also look beyond broad some, such as delivery to more domestic mobile phone manufacturers to pass ratio, more favorable conditions for MediaTek to attract more Chinese manufacturers to use Kirin chip, Chinese enterprises gradually get rid of dependence on Qualcomm and other chip companies, and ultimately achieve domestic alternatives.

Although it had established Hass out “to prevent people without food,” the strategic plan, but by 10 years of accumulated technology and development, Hass has now far beyond the original vision to become the world’s chip design has important implications enterprise. According to 2015 statistics, Huawei Hass revenue growth of 19%, ranking the world’s top 10 chip design companies in sixth place. And have appeared in the case of Qualcomm, MediaTek performance decline, shipments and revenue both contrarian surge. Since Huawei phones dare to challenge Samsung, Apple, then Hass unicorn and dare to challenge Qualcomm Xiaolong, China to play a leading role in the field of ICT chip, issued more energy to completely change the “lack of core small soul” dilemma Chinese ICT industry .

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Microsoft’s price of $ 1.96 per share, to spend $ 26.2 billion acquisition of professional networking site Linkedin. Transaction has been approved by the board of directors of Microsoft and Linkedin. This price Linkedin previous valuation premium compared with 49.5%. After the deal was announced, Microsoft and Linkedin jointly held a conference call with analysts, purpose and future development to make an explanation of the transaction.

· Microsoft CEO Satya Nadella (Satya Nadella) represented at the meeting, Linkedin will retain their own brands, culture and independence. Linkedin CEO Jeff Weiner (Jeff Weiner) will stay on Linkedin CEO, joined Microsoft executive team and report directly to themselves. He also said, Linkedin founder Reid Hoffman (Reid Hoffman) fully supports this transaction, the acquisition is expected to be completed this year.

Nadella emphasized that Microsoft and Linkedin share a common mission, it is to support each and every company in the world to achieve greater value, and the best way to achieve this goal is to connect each of the world’s professionals to help them be more productive and more successful. This is the Microsoft acquisition Linkedin purposes. Weiner said, Linkedin has over 433 million users and 105 million monthly active users worldwide, the mobile terminal traffic accounted for 60%, and continues to grow. In particular, he stressed that China is the fastest-growing market Linkedin.

Nadella spoke, Linkedin and Microsoft Office 365 and Dynamics business has a strong synergistic effect, which is Microsoft’s core business lies. Microsoft will by individuals and businesses as well as many business subscription model for advertising, accelerate these three business interaction and collaboration. There are significant growth opportunities in this regard.

Specifically, he said that Microsoft has 1.2 billion Office users, Windows 10 installed capacity of over 300 million, Office 365 users to 70 million monthly living, Dynamics 800 million users. But only to Microsoft may reach 9% of the market range, which means that Microsoft has a huge room for growth. Now, Microsoft has a Linkedin has 433 million users and 105 million active users. Microsoft’s enterprise service maps and Linkedin professional social graph integration exciting prospect.

Nadella cited as an example of the synergistic effect of the empty space of Microsoft and Linkedin. He mentioned, LinkedIn will become the connection between Microsoft and many other social services infrastructure, whether it is Outlook, Excel, Skype, Powerpoint, Word, or SharePoint. Microsoft’s powerful artificial intelligence and machine learning techniques for the rapid growth of information flow LinkedIn brings improved, helping the latter to enhance the liquidity of the ad.

Microsoft general counsel Brad? Smith (Brad Smith) describes that, before the two sides to complete the transaction requires the approval of the US, EU and Canadian regulatory authorities, etc., which does not include Japan, South Korea and China. Microsoft expects that this transaction is expected before the end of the year to get regulatory approval. He noted that Microsoft and Linkedin business no significant overlap, but complementary, Microsoft can help Linkedin expand their business. The merger is conducive to the world’s hundreds of millions of users to bring more benefit.

Microsoft CFO Amy Hu DS (Amy Hood) spoke, Microsoft agreed to pay $ 196 per share, all-cash transaction by way of acquisition of Linkedin. The deal worth $ 26 billion, including net cash Linkedin. Microsoft will before the completion of the transaction, with the favorable market window new issues, financing for the acquisition. She mentioned that the main purpose of the acquisition is to accelerate business growth Linkedin Linkedin and Office 365 and Dynamics, and is expected to bring cost synergies of $ 150 million per year.

She is expected in 2017 and 2018 fiscal years, the deal would give Microsoft a non-GAAP earnings per share to bring about 1% dilution. After completion of the transaction, Microsoft will continue to publish impact of the acquisition on earnings per share caused. DS Hu stressed that the transaction will not affect Microsoft’s current equity repurchase program, Microsoft will continue to promote the end of the year $ 40 billion equity repurchase program previously approved.

Some analysts asked Microsoft over the past few strokes huge deal less successful, but growth is slowing Linkedin. Nadella said that Microsoft is in three dimensions to measure whether the acquisition. First, whether the acquisition will help Microsoft to enter new markets or enhance current market competitiveness? Second, whether the transaction can bring significant synergies? Thirdly, the transaction is in line with Microsoft’s core business, part of Microsoft’s enterprise architecture to integrate, focus on the best in the field of executive power. In his view, Linkedin transactions fully comply with three conditions.

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“DOB technology is rapidly becoming the new choice for LED lighting applications, although not as SMD or other conventional forms of penetration so fast, but it must be a place, the next few years, DOB will reach more than 20% market share.” Easy US-light Executive Vice president and technical Director Liu Guoxu mentioned in his speech.

DOB, is based on the high-voltage AC drive modules integrated DOB light, it attracted the attention of many designers. DOB is not actually new, a few years ago have begun to enter the international manufacturers, and mass production, including Osram, Samsung, LGIT have launched their products.

Liuguo Xu said in his speech, efficient and high-voltage LED driver IC elements are constructed of DOB. LED drivers account for about 20% in lighting costs, not only affects the cost, but also affect efficiency, but also determines the life of the LED lamp.

Traditional AC-DC Driver topologies there are many, such as isolated driver with the device, large volume, assembly complexity, high cost, stability and security is good. Other ways have different structures, including the choice of Buck-Boost configuration, it requires a large capacitance and inductance element. It is relatively inexpensive RC Buck power, low cost, but low reliability.

Direct AC from topology point of view, many packaging manufacturers have introduced AC LED or DOB, traditional anti-parallel structure, mixed bridge structure, but also the use of an external bridge, light and easy to use SBC AC linear drive. Compared with the conventional AC-DC converter (switching power supply), AC linear drive can be connected directly to the mains, no external circuit, very compact, very easy to implement integrated, adjustable light, and very flexible, longer life, because it does not contain electrolytic capacitors, the extra space can be used to full cooling, lower cost, low component count, assembly costs are low. With a large number of driver chip production, the overall costs will fall significantly.

Liu Guoxu think, DOB provides new flexibility for lighting, if appropriate AC design, can solve the flicker problem. Since DOB simplicity and integration of different sensors connected to the gateway, the future DOB in the field of intelligent lighting can account for a place.

In addition to DOB, the Liuguo Xu also talked about other technology trends, for example, high CRI, high luminous efficiency LED technology is a breakthrough (narrow spectrum red phosphor or quantum dots into a key); health and artificial lighting efficiency energy saving substituted, a new market demand driven; intelligent lighting faster than imagination, and from everyday life is getting closer; silicon LED national Science and technology invention award, the industry once again become concerned about the hot; CSP packaging technology to become hot from the backlight and flash, start applying to lighting.

On LED market trends, Liu Guoxu summed up five points: First, LED prices continue downward, but the decline has slowed down, the quality gradually returning, as concerns; Second, the upper and middle reaches capacity continues to increase, the greater the larger; Third, cross-border mergers and acquisitions and overseas overwhelming; Fourth, emerging markets become hot pursuit; five market segments into a new opportunity (UV, plant growth, visible light communication, etc.).

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The semiconductor industry is about to reach the wafer process bottlenecks, also on behalf of Moore’s Law will likely fail, the future is bound to integrate fab down to the packaging and testing plant in miniature wafer process can not continue, the packaging and testing industry will be temporarily to system-level packaging, etc. effective integration of chip technology will do to improve the chip manufacturing profits, provoked beyond the role of Moore’s Law, ASE, SPIL and force a positive layout.

Semiconductor Association Lu superior that the next vertically stacked semiconductor going to do 3D, the future of the global semiconductor industry will grow towards the kind of Moore’s Law.

Wafer miniature reach bottleneck

Ma Guanghua, deputy general manager SPIL R & D Center, said the future single chip has been unable to continue to narrow the case, say, or a reduced cost price has gone beyond economic benefits, it is necessary at this time through the packaging technology to enhance the performance benefits of the chip, like ASE system-in-package (SiP) technology or wafer level packaging.

Ma Guanghua pointed out that the so-called wafer level package is to direct the entire wafer packaging and testing process have lost part of the packaging materials, make up an IC (integrated circuit) will be relatively thin, so-called fan-out wafer level package that is directly on the fan-out wafer packaging materials can save another 30%, while the chip can be thinner.

There panel next level package, Ma Guanghua interpretation, the panel level package is the direct use of the panel encapsulation, compared to the 12-inch wafer cutting IC, can be more efficient and cost-effective, until the fan-out type package maturity on the panel after, there will be panel-level system-level package.

Panel level package cost savings

Now all major plant aimed at advanced packaging process to improve the quality of packaging and testing, but also to throw off opponents, which is actively layout ASE fan-out type package and system-in-package, the previous ASE also made DECA TECHNOLOGIES type of fan-out wafer level packaging process technology and patents.

Powertech chairman DK Tsai said that after due future product development will move towards compact size, but faced with the limits of Moore’s Law, it is necessary to take the advanced packaging technology to make up for this deficiency, whether 2.5D, 3D or fan-out (Fan out) packaging, etc., to force all devices are ready.

IC packaging and testing industry pointed out that at present, neither on logic IC or is NAND Flash, the 3D stacking technology is required in order to allow the chip to maximize the benefits of play, but also to achieve the slim and light level.

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