TSMC actively promote the advanced process, on the 8th board of directors approved the capital budget of about NT $ 154.63 billion, including the construction and expansion of advanced process capacity, upgrade the advanced packaging capacity to the next generation of technology, and the first quarter of 2017 R & D capital budget and regular Capital budget, since November 2016 will continue to invest.

TSMC’s overall capital spending this year will exceed 9.5 billion US dollars a new high, is expected next year, capital spending is still high. TSMC said in a previous conference, 10-nanometer advanced process will be the end of this year into mass production, shipments in the first quarter of next year will be able to contribute to revenue; 7-nanometer process progress is good, performance and power consumption are leading opponents, Quarter trial production, first quarter of 2018 production. 2SC2694

TSMC Board of Directors and approved the appointment of Dr. Zhang Xiaoqiang, vice president for the design and technology platform organization. Zhang Xiaoqiang will be responsible for the management of memory design and analog signal and radio frequency design, and directly to the design and technology platform, deputy general manager Hou Yongqing responsible.

Zhang Xiaoqiang graduated from Tsinghua University in 1987, Department of Electrical Engineering, and in 1994 the United States Duke University doctorate in electrical engineering. Has served Motorola and HP in the US, and worked for Intel Corporation for nearly 20 years, has experienced silicon intellectual property development, design verification and management positions. 635a716h01

In addition, the TSMC Board of Directors has approved the following personnel promotion case: to promote the operation of the Deputy General Manager Qin Yongpei as senior vice president; to promote R & D Deputy General Manager Mi Yujie as senior vice president; to promote research and development organization Integrated Interconnect & Packaging Division senior Director Yu Zhenhua as Deputy General Manager; Senior Technical Director of the R & D Special Technology Division and Alexander Kalnitsky, Vice President of TSMC.