TSMC will launch GaN fast charging chips challenge TI, NXP

Leading wafer TSMC advanced process technology big leap forward again, promising fast-charge management IC market potential source, collaborative partners Delors cell semiconductor (Dialog Semiconductor), will be launched in the first quarter of next year’s first gallium nitride (GaN) phone fast charge the wafer, the wafer challenge fast-charge leader Texas Instruments (TI) and NXP (NXP) dominance.

Hit the headlines in the long process of gallium nitride, gallium nitride entered finally announced TSMC advanced process for customers German business cooperation Delors grid tailored, 6-inch, 0.5 micron, gallium nitride (GaN-On-Silicon on 650V silicon ) process technology to produce gallium nitride’s first fast-charge mobile phone chips, is expected in the first quarter of next year output, the wafer with reduced volume, improve performance, charging time in half, and other advantages for mobile phones and tablet and other fast charge, We will challenge the industry’s dominant Texas Instruments, NXP leading position.

It is reported that TSMC has long been a gallium nitride field layout, technology is quite mature, however, due to cost considerations and the downstream customer application problems, the demand for gallium nitride process is not high, or the traditional silicon-based process, therefore, is only TSMC You can do anything, waiting for an opportunity. Today, cell phone quick charge applied gradually surfaced, mobile phone chips MediaTek and Qualcomm have been pushing fast charge specifications, Spreadtrum and Hass also introduced the fast charge standard response, Samsung also introduced support for Galaxy full range of smartphone quick charge function, Apple will join the ranks of the fast-charge, fast charge market matures, TSMC timely flex its muscles.

The industry said, using gallium nitride wafer production process can be used in addition to the phone fast charge, but also significantly reduce external laptop power supply volume in the future be applied to servers, automotive and smart grid markets such huge business opportunities. Therefore, the international chip maker associated power management IC solutions, Texas Instruments, NXP and Infineon already ready for the relevant power management IC solutions, launched more than gallium nitride wafer production process, this, TSMC and Le Dai grid cooperation, in addition to challenge the dominance, but also show the gallium nitride TSMC process technologies mature, the relevant power management IC factory beckons customers.

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