In the recently held annual supply chain management forum, TSMC joint CEO Liu Deyin (Mark Liu) also disclosed that TSMC will be in the second half of 2019 planned production of 5nm process.

TSMC has just begun mass production of 10nm, but the first quarter of 2017 will try to produce a new 7nm, 2018 into mass production, and then into the 5nm, can be said to be a ring, did not stop. 08055c104kat2a

Liu Deyin also revealed that TSMC will be in the 7nm process to improve the version of the first use of EUV extreme ultraviolet lithography, 5nm will be fully applied. This is the first to determine the launch of the EUV fab – Intel 7nm will not still do not know.

Liu said that TSMC 10nm process mainly for mobile devices, will be the end of the quarter batch delivery OEM chip, the second half of the rapid expansion of production capacity. m27500-24sr2s23

MediaTek Helio X30, Huawei Kylin 970, Apple A11 will use TSMC 10nm process, Xiao Long 835, Exynos 8895 is Samsung 10nm.